Polymeric cold plate for thermal management of power electronics

Patent metadata

Field	Value
Publication number	US-12432877-B2
Application number	US-202318209664-A
Country	US
Kind code	B2
Filing date	Jun 14, 2023
Priority date	Jun 14, 2023
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

A power electronic assembly includes a power electronic and a cold plate. The power electronic is configured to be powered by electric energy and to generate waste heat from the electric energy. The cold plate include polymeric material and is configured to elastically deform to uniformly cover the power electronic and transfer away the waste heat generated by the power electronic.

First claim

What is claimed is:

1. A power electronic assembly comprising:
a power electronic that includes a circuit board and a processor coupled with the circuit board, the processor configured to be powered by electric energy and to generate waste heat from the electric energy, the processor having a planar external surface opposite the circuit board, and
a cold plate configured to transfer the waste heat generated by the processor away from the processor, the cold plate including a polymeric coolant housing that defines a fluid channel therethrough and a back plate coupled with the polymeric coolant housing to close a mouth of the fluid channel, the polymeric coolant housing configured to receive and pass a flow of cooling fluid through the fluid channel and to deform elastically in response to receiving the flow of cooling fluid to provide uniform contact and heat transfer between the polymeric coolant housing and the planar external surface of the processor,
wherein the polymeric coolant housing includes a first end wall having an inlet that opens into the fluid channel, a second end wall having an outlet that opens into the fluid channel, and a membrane made of polymeric material that extends between and interconnects the first end wall and the second end wall, and the membrane is configured to deform elastically and expand outward away from the back plate and into direct contact with the external surface of the processor in response to the cold plate receiving fluid through the flow channel.

2. The power electronic assembly of claim 1 , wherein the external surface of the processor has a first length, the membrane has a second length, and the second length is greater than the first length such that a portion of the membrane between the first end wall and the processor expands into a gap between the processor and the first end wall of the coolant housing.

3. The power electronic assembly of claim 1 , wherein the membrane has a thickness of between about 5 thousandths of an inch and about 20 thousandths of an inch.

4. The power electronic assembly of claim 1 , wherein the membrane has a thickness of between about 7 thousandths of an inch and about 12 thousandths of an inch.

5. The power electronic assembly of claim 1 , wherein the back plate is made of metallic material and the first end wall and the second end wall of the coolant housing are engaged with the back plate.

6. The power electronic assembly of claim 1 , wherein the membrane directly engages the external surface of the processor without a thermal interface material therebetween.

7. The power electronic assembly of claim 1 , wherein the back plate and the coolant housing are integrally formed from polymeric material as a one-piece, single component.

8. The power electronic assembly of claim 1 , wherein the back plate and the coolant housing are made of polymeric material and the coolant housing is engaged with the back plate.

9. The power electronic assembly of claim 1 , wherein the cold plate further includes fasteners that extend into the back plate and into the circuit board to couple the cold plate with the power electronic.

10. A method of making a cold plate for a power electronic, the method comprising
molding a coolant housing made of polymeric material, the coolant housing includes a first end wall, a second end wall, and a membrane made of polymeric material that extends between and interconnects the first end wall and the second end wall, the first end wall, the second end wall, and the membrane cooperating to define a fluid channel,
providing a back plate, and
coupling the first end wall and the second end wall with the back plate to close a mouth of the fluid channel,
wherein the membrane has a thickness sized to allow the membrane to deform elastically and expand in response to a pressurized fluid passing through the fluid channel,
wherein the first end wall of the coolant housing includes an inlet that opens into the fluid channel and the second end wall of the coolant housing includes an outlet that opens into the fluid channel.

11. The method of claim 10 , further comprising passing the pressurized fluid through the fluid channel to cause the membrane to deform elastically and expand away from the back plate.

12. The method of claim 10 , wherein the membrane has a thickness of between about 5 thousandths of an inch and about 20 thousandths of an inch.

13. The method of claim 12 , further comprising passing the pressurized fluid through the fluid channel at a pressure of less than about 50 psi absolute to cause the membrane to deform elastically and expand away from the back plate.

14. The method of claim 13 , wherein the membrane has a thickness of between about 7 thousandths of an inch and about 12 thousandths of an inch.

Assignees

• Rolls Royce Nam Tech Inc

Inventors

• Unton Timothy
• Donovan Eric

Classifications

• H10W40/611 Primary

  Bolts or screws · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/20772

  within server blades for removing heat from heat source · CPC title

• H05K7/20927

  Liquid coolant without phase change · CPC title

• H05K7/20254 Primary

  Cold plates transferring heat from heat source to coolant · CPC title