Pattern recognition module and pattern recognition apparatus

Patent metadata

Field	Value
Publication number	US-12430942-B2
Application number	US-202218020093-A
Country	US
Kind code	B2
Filing date	Feb 28, 2022
Priority date	Feb 28, 2022
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

A pattern recognition module and a pattern recognition apparatus. The pattern recognition module includes a pattern recognition substrate, and the pattern recognition substrate includes a pattern recognition area and a non-pattern recognition area located on at least one side of the pattern recognition area; and an anti-static layer, located on the pattern recognition substrate, and an orthographic projection of the anti-static layer on the pattern recognition substrate completely covers the pattern recognition area, extends to the non-pattern recognition area, and overlaps the non-pattern recognition area.

First claim

What is claimed is:

1. A pattern recognition module, comprising:
a pattern recognition substrate, wherein the pattern recognition substrate comprises a pattern recognition area, and a non-pattern recognition area located on at least one side of the pattern recognition area;
an anti-static layer, located on the pattern recognition substrate, wherein an orthographic projection of the anti-static layer on the pattern recognition substrate completely covers the pattern recognition area and extends to the non-pattern recognition area, and overlaps the non-pattern recognition area; and
an anti-glare layer and a first protective layer, wherein the anti-static layer is disposed between the anti-glare layer and the first protective layer, and the anti-glare layer is arranged adjacent to the pattern recognition substrate.

2. The pattern recognition module according to claim 1 , wherein the anti-static layer is a conductive layer.

3. The pattern recognition module according to claim 2 , wherein a sheet resistance of the conductive layer is larger than or equal to 10 Ω/□and less than or equal to 100 Ω/□;
wherein a transmissivity of the conductive layer is larger than 80%; and,
wherein a thickness of the conductive layer in a direction perpendicular to the pattern recognition substrate is larger than or equal to 300 Å and less than or equal to 2000 Å.

4. The pattern recognition module according to claim 2 , wherein the pattern recognition substrate further comprises a conductive structure, wherein the conductive structure is located on a side of the anti-static layer away from the pattern recognition substrate, and the conductive structure is located in the non-pattern recognition area and arranged in contact with the conductive layer.

5. The pattern recognition module according to claim 4 , further comprising a grounding shell, wherein the grounding shell is arranged in the non-pattern recognition area, and is electrically connected with the conductive structure;
wherein a surface of the grounding shell has insulating paint beyond a contact surface with the conductive structure and a grounding point.

6. The pattern recognition module according to claim 4 , further comprising a gate drive chip; wherein
the non-pattern recognition area surrounds the pattern recognition area, the non-pattern recognition area comprises a first non-pattern recognition area and a second non-pattern recognition area arranged opposite to each other, the first non-pattern recognition area is provided with the gate drive chip, and the second non-pattern recognition area is provided with the conductive structure;
in the first non-pattern recognition area, an orthographic projection of the gate drive chip on the pattern recognition substrate does not overlap an orthographic projection of the anti-static layer on the pattern recognition substrate; and
in the second non-pattern recognition area, an orthographic projection of the conductive structure on the pattern recognition substrate approximately coincides with the orthographic projection of the anti-static layer on the pattern recognition substrate.

7. The pattern recognition module according to claim 6 , wherein the first non-pattern recognition area is further provided with the conductive structure, and in the first non-pattern recognition area, the orthographic projection of the conductive structure on the pattern recognition substrate approximately coincides with the orthographic projection of the anti-static layer on the pattern recognition substrate.

8. The pattern recognition module according to claim 6 , further comprising a flexible printed circuit board, wherein the flexible printed circuit board is electrically connected with the gate drive chip, the flexible printed circuit board comprises a bent area, and a length of the bent area is larger than or equal to 14 mm.

9. The pattern recognition module according to claim 8 , wherein the flexible printed circuit board is of a copper grid structure.

10. The pattern recognition module according to claim 8 , further comprising a stiffening plate, wherein the stiffening plate comprises a body part and a handle part which are integrally arranged; and the flexible printed circuit board further comprises an unbent area, the unbent area is attached to the body part, and the handle part is located on a side of the body part adjacent to the bent area.

11. The pattern recognition module according to claim 6 , further comprising a chip-on-film and a readout integrated circuit (ROIC), wherein the ROIC is arranged on the chip-on-film, and is electrically connected with the chip-on-film; and
the non-pattern recognition area comprises a third non-pattern recognition area and a fourth non-pattern recognition area arranged opposite to each other, the third non-pattern recognition area is connected with the first non-pattern recognition area and the second non-pattern recognition area, the fourth non-pattern recognition area is connected with the first non-pattern recognition area and the second non-pattern recognition area, and the third non-pattern recognition area and the fourth non-pattern recognition area are both provided with the chip-on-films.

12. The pattern recognition module according to claim 11 , further comprising a black adhesive, wherein the black adhesive is located on a side of the ROIC away from the chip-on-film, and an orthographic projection of the ROIC on the chip-on-film is located within an orthographic projection of the black adhesive on the chip-on-film.

13. The pattern recognition module according to claim 1 , wherein the anti-static layer is a high-resistance film.

14. The pattern recognition module according to claim 13 , wherein a sheet resistance of the high-resistance film is larger than or equal to 10 8 Ω/□;
wherein a transmissivity of the high-resistance film is larger than 80%;
wherein a thickness of the high-resistance film in a direction perpendicular to the pattern recognition substrate is larger than or equal to 100 Å and less than or equal to 300 Å; or,
wherein the anti-static layer is of a planar structure or a grid structure.

15. The pattern recognition module according to claim 1 , wherein the anti-static layer comprises a conductive layer and a high-resistance film which are arranged in a stacked mode, and the conductive layer is disposed between the pattern recognition substrate and the high-resistance film; and,
wherein an orthographic projection of the high-resistance film on the pattern recognition substrate is located within an orthographic projection of the conductive layer on the pattern recognition substrate.

16. The pattern recognition module according to claim 1 , wherein the anti-glare layer is at least arranged in the pattern recognition area;
wherein an orthographic projection of the anti-glare layer on the pattern recognition substrate is larger than the pattern recognition area and located within the orthographic projection of the anti-static layer on the pattern recognition substrate; and,
wherein a thickness of the anti-glare layer in a direction perpendicular to the pattern recognition substrate is larger than or equal to 2 μm and less than or equal to 10 μm.

17. The pattern recognition module according to claim 1 , wherein an orthographic projection of the first protective layer on the pattern recognition substrate is larger than the pattern recognition area and located within an orthographic projection of the anti-glare layer on the pattern recognition substrate.

18. The pattern recognition module according to claim 1 , wherein a m

Assignees

• Beijing Boe Sensor Technology Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Feng Yajie
• Li Cheng
• Geng Yue
• Li Zhonghuan
• Dai Yi
• Qi Chaoyang
• Li Zefei
• Xi Congcong
• Wang Xinglong
• Wang Yingzi

Classifications

• G06V40/1329

  Protecting the fingerprint sensor against damage caused by the finger · CPC title

• G06V40/1306

  non-optical, e.g. ultrasonic or capacitive sensing · CPC title

• G06F18/00

  Pattern recognition · CPC title

• G06V40/1318 Primary

  using electro-optical elements or layers, e.g. electroluminescent sensing · CPC title