Package with thermoelectric power feedback loop
US-10600948-B1 · Mar 24, 2020 · US
US12429808B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12429808-B2 |
| Application number | US-202118250100-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 10, 2021 |
| Priority date | Nov 13, 2020 |
| Publication date | Sep 30, 2025 |
| Grant date | Sep 30, 2025 |
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To provide a control board for efficiently generating electric energy in a power generating device from heat generated from an electronic device. A control board includes a board including a first heat dissipating pad; an electronic device including a second heat dissipating pad to dissipate heat; a power generating device including a Peltier device which converts heat energy generated from the electronic device into electric energy, wherein the power generating device is sandwiched between the first heat dissipating pad and the second heat dissipating pad; and a power supply circuit configured to reuse the electric energy.
Opening claim text (preview).
The invention claimed is: 1. A control board comprising: a board including a first heat dissipating pad; an electronic device including a second heat dissipating pad to dissipate heat; and a power generating device including a Peltier device configured to convert heat energy generated from the electronic device into electric energy, and wiring configured to connect a first terminal of the electronic device and a second terminal of the board, wherein the power generating device is sandwiched between the first heat dissipating pad and the second heat dissipating pad. 2. The control board according to claim 1 , wherein the wiring is impedance matched between the electronic device and the board. 3. An electronic equipment comprising the control board of claim 1 . 4. An image forming apparatus comprising the control board of claim 1 . 5. The control board according to claim 1 , further including a power supply circuit configured to reuse the electric energy. 6. The control board according to claim 1 , wherein the first terminal of the electronic device is connected to the first heat dissipating pad and the second terminal of the board is connected to the second heat dissipating pad. 7. The control board according to claim 1 , wherein the electronic device is indirectly provided on the board via the power generating device. 8. The control board according to claim 1 , wherein the board and the electronic device are at positions facing each other with the power generating device sandwiched between the board and the electronic device. 9. The control board according to claim 1 , wherein the power generating device includes a first surface joined to the second heat dissipating pad and a second surface joined to the first heat dissipating pad. 10. The control board according to claim 1 , wherein the power generating device includes a first surface joined to the second heat dissipating pad and a second surface joined to the first heat dissipating pad, and wherein the wiring penetrates the first surface and the second surface. 11. The control board according to claim 1 , wherein the first terminal, the second terminal, and the wiring are located at a same position in a top view.
Thermoelectric component · CPC title
Cooling of mounted components (H05K1/0272 takes precedence) · CPC title
Interconnections · CPC title
characterised by the heat-exchanging means at the junction · CPC title
operating with only the Peltier or Seebeck effects · CPC title
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