Optical device and manufacturing method for optical device

Patent metadata

Field	Value
Publication number	US-12429657-B2
Application number	US-202118009247-A
Country	US
Kind code	B2
Filing date	Jun 11, 2021
Priority date	Jun 12, 2020
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

An optical device according to one embodiment includes: a light-emitting element; first and second lenses optically coupled with the light-emitting element; an optical component provided between the light-emitting element and the second lens, optically coupling each of the light-emitting element and the second lens, and multiplexing input lights; and a base having a lower plate having a plurality of convex mounting surfaces with each of the light-emitting element, the first lens, the second lens, and the optical component being mounted thereon and a side wall with a receptacle being connected thereto.

First claim

The invention claimed is:

1. An optical device comprising:
an optical element;
a lens optically coupled with the optical element;
an optical component provided between the optical element and the lens, optically coupling the optical element and the lens, and multiplexing or demultiplexing input lights, having a light input surface and a light output surface having an oblique face with respect to an optical axis of the input light, and the light input surface and the light output surface being parallel to each other;
a base having a lower plate having a first convex mounting surface and a second convex mounting surface with the optical component being mounted on the first mounting surface and the second convex mounting surface, the first mounting surface and the second convex mounting surface having the same height and being parallel to a surface of the lower plate, and a side wall with a receptacle being connected thereto,
wherein the mounting surface of the lower plate of the base has two parallel sides, and a distance between the two sides is smaller than a distance between the light input surface and the light output surface of the optical component, and
wherein a relationship between the light input surface and the light output surface of the optical component is a relationship of being parallel to the two parallel sides of the mounting surface, and the optical component is arranged on the mounting surface in such a relationship that the two parallel sides of the mounting surface are located in respective inner sides from the light input surface and the light output surface of the optical component.

2. The optical device according to claim 1 , wherein the optical component is a multiplexer multiplexing a plurality of the input lights.

3. The optical device according to claim 1 , wherein the optical component is a demultiplexer demultiplexing the input light into a plurality of output lights.

4. The optical device according to claim 2 ,
wherein the lower plate further has a convex light-receiving element mounting surface with a light-receiving element for receiving the input light being mounted on, and
wherein the light-receiving element mounting surface is non-parallel to the surface of the lower plate and faces an opposite side of the side wall.

5. A manufacturing method for the optical device according to claim 1 , comprising:
a process of mounting the optical component on the mounting surface using the outer walls as the alignment marker; and
a process of aligning the lens.

Assignees

• Sedi Inc
• Sumitomo Electric Industries

Inventors

• Oki Kazushige
• Kobayashi Kazunobu
• Hara Hiroshi
• Tsumura Eiji
• Kawamura Masanobu
• Yoshimura Satoshi
• Ishii Kuniyuki
• Nakajima Fumihiro
• Kitajima Hideaki
• Kamisugi Hideaki

Classifications

• G02B6/426

  mounting, engaging or coupling of the package to a board, a frame or a panel · CPC title

• G02B6/4257

  having a supporting carrier or a mounting substrate or a mounting plate (G02B6/3648 takes precedence) · CPC title

• G02B6/4243

  Mounting of the optical light guide into a groove (mounting optical light guides into a groove in general G02B6/3636) · CPC title

• G02B6/4281

  the printed circuit boards being flexible (in general H05K1/147) · CPC title

• G02B6/4239

  Adhesive bonding; Encapsulation with polymer material · CPC title