Real-time ultrasonic stimulation electric signal recording chip and preparation method thereof

Patent metadata

Field	Value
Publication number	US-12429457-B2
Application number	US-202318332697-A
Country	US
Kind code	B2
Filing date	Jun 9, 2023
Priority date	Dec 10, 2020
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

The present invention discloses a real-time ultrasonic stimulation electric signal recording chip and a preparation method thereof, where the preparation method includes the following steps: S 1 manufacturing an interdigital electrode on a piezoelectric substrate to obtain a surface acoustic wave chip, and manufacturing a recording electrode and an electrode lead; S 2 , manufacturing an insulation protection layer on the chip obtained in the S 1 , and processing the insulation protection layer to form the recording electrode, so as to obtain a chip combining the interdigital electrode and the recording electrode; S 3 , preparing a PDMS cavity; and S 4 , bonding the PDMS cavity prepared in the S 3 and the chip obtained in the S 2 . In the present invention, combining the interdigital electrode generating a surface acoustic wave ultrasound with a multi-channel recording electrode, such that real-time recording of a multi-channel electric signal under ultrasonic stimulation is achieved.

First claim

What is claimed is:

1. A preparation method for a real-time ultrasonic stimulation electric signal recording chip, comprising the following steps:
S 1 , manufacturing an interdigital electrode on a piezoelectric substrate to obtain a surface acoustic wave chip, and manufacturing a recording electrode and an electrode lead;
S 2 , manufacturing an insulation protection layer on the chip obtained in the S 1 , and processing the insulation protection layer to form the recording electrode, so as to obtain a chip combining the interdigital electrode and the recording electrode;
S 3 , preparing a PDMS cavity; and
S 4 , bonding the PDMS cavity prepared in the S 3 and the chip obtained in the S 2 , so as to obtain the real-time ultrasonic stimulation electric signal recording chip.

2. The preparation method for the real-time ultrasonic stimulation electric signal recording chip according to claim 1 , wherein in the S 1 , the manufacturing of the interdigital electrode on the piezoelectric substrate to obtain the surface acoustic wave chip, specifically comprising:
patterning photoresist on the piezoelectric substrate through photo etching, then forming a metal layer on the patterned piezoelectric substrate through magnetron sputtering, and removing the photoresist, so as to obtain the surface acoustic wave chip.

3. The preparation method for the real-time ultrasonic stimulation electric signal recording chip according to claim 2 , wherein the S 1 specifically comprises:
S 11 , gluing: spin coating photoresist with the thickness of 1-5 μm on a surface of the piezoelectric substrate, and heating;
S 12 , exposing and developing: covering a manufactured film on the photoresist for exposing, then adopting a developing solution for developing, so as to carry out the patterning on the photoresist;
S 13 , sputtering: performing the magnetron sputtering on the patterned piezoelectric substrate to form the metal layer, so as to obtain a piezoelectric substrate of a growth electrode;
S 14 , removing the photoresist: carrying out ultrasonic cleaning on the piezoelectric substrate of the growth electrode obtained in the S 13 in an acetone solution, and stripping the photoresist, so as to obtain the surface acoustic wave chip.

4. The preparation method for the real-time ultrasonic stimulation electric signal recording chip according to claim 3 , wherein the photoresist in the S 11 is a positive photoresist AZ5214, and conditions of the spin coating are: rotation rate of 3000 rpm, time of 30 s; and
the film in the S 12 is a film, and the developing solution is mif300.

5. The preparation method for the real-time ultrasonic stimulation electric signal recording chip according to claim 1 , wherein the S 2 specifically comprises:
S 21 , sputtering: manufacturing the insulation protection layer on the surface acoustic wave chip obtained in the S 1 by means of sputtering;
S 22 , processing: spin coating the photoresist on the insulation protection layer, covering the manufactured film on the photoresist and exposing, then adopting the developing solution for developing, and etching to form the recording electrode, so as to obtain the chip combining the interdigital electrode and the recording electrode.

6. The preparation method for the real-time ultrasonic stimulation electric signal recording chip according to claim 5 , wherein the photoresist in the S 22 is a negative photoresist SUN1300, and the conditions of the spin coating are: the rotation rate of 3000 rpm, and the time of 30 s; and the film is the film.

7. The preparation method for the real-time ultrasonic stimulation electric signal recording chip according to claim 1 , wherein in the S 3 , the preparing the PDMS cavity specifically comprises:
manufacturing a PDMS cavity mold, casting PDMS in the PDMS cavity mold, and stripping after the PDMS is solidified, so as to obtain a PDMS cavity;
wherein the PDMS cavity mold is manufactured by means of three dimensional printing.

8. The preparation method for the real-time ultrasonic stimulation electric signal recording chip according to claim 1 , wherein in the S 4 , a specific process of the bonding the PDMS cavity and the chip is as follows:
carrying out a plasma treatment on the PDMS cavity and the chip, then bonding the two, and baking at 80° C. for 20 min, so as to obtain the real-time ultrasonic stimulation electric signal recording chip;
wherein the conditions of the plasma treatment: power of 150 W, and time of 70 s.

9. The preparation method for the real-time ultrasonic stimulation electric signal recording chip according to claim 1 , wherein in the S 1 , the piezoelectric substrate is a 128° YX double-sided polished lithium niobate substrate, a zinc oxide substrate or an aluminum nitride substrate.

10. The preparation method according to claim 1 , the real-time ultrasonic stimulation electric signal recording chip is prepared and obtained.

Assignees

• Shenzhen Inst Of Adv Tech Cas

Inventors

• Meng Long
• Zhou Wei
• Zheng Hairong
• Niu Lili
• Lin Zhengrong
• Peng Benxian
• Umar Farooq
• Cui Yingjian

Classifications

• H03H9/25

  Constructional features of resonators using surface acoustic waves {(devices for manipulating acoustic surface waves in general G10K11/36)} · CPC title

• H03H9/02574

  of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate · CPC title

• H03H3/10

  for obtaining desired frequency or temperature coefficient · CPC title

• A61B2562/12

  Manufacturing methods specially adapted for producing sensors for in-vivo measurements · CPC title

• A61N2007/0026

  Stimulation of nerve tissue · CPC title