Architecture and operational modes of pump-augmented loop heat pipe with multiple evaporators

US12429288B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12429288-B2
Application numberUS-202117353712-A
CountryUS
Kind codeB2
Filing dateJun 21, 2021
Priority dateJun 18, 2020
Publication dateSep 30, 2025
Grant dateSep 30, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A pump-augmented Loop Heat Pipe (LHP) includes a conventional LHP evaporator/reservoir assembly; one or more additional evaporators; a condenser; a condenser bypass; and a pump upstream of the condenser and condenser bypass and configured to pump fluid generally toward the one or more additional evaporators.

First claim

Opening claim text (preview).

What is claimed is: 1. A pump-augmented Loop Heat Pipe (LHP), comprising: a first evaporator constructed to receive external heat and evaporate a working fluid; a reservoir integrated with the first evaporator; a vapor transport line connected to the first evaporator; a condenser connected to the vapor transport line; a liquid return line connected to the condenser and the reservoir; a fluid transport line connected to the liquid return line and the vapor transport line; a pump; a plurality of evaporators situated along the fluid transport line; and a check valve situated along the fluid transport line and arranged to supply a liquid received from the pump directly to the plurality of evaporators situated along the fluid transport line, wherein the pump-augmented LHP is constructed to operate in: a first mode where the check valve is closed and the pump off such that: (i) evaporated working fluid, evaporated by the first evaporator, is received by the vapor transport line and provided to the condenser, (ii) the condenser condenses the evaporated working fluid, evaporated by the first evaporator, into a liquid working fluid and provides the liquid working fluid to the liquid return line, and (iii) the liquid working fluid provided to the liquid return line is supplied to the reservoir, and a second mode where the check valve is open and the pump is on such that: (i) the evaporated working fluid, evaporated by the first evaporator, is received by the vapor transport line and provided to the condenser, (ii) evaporated working fluid, evaporated by the plurality of evaporators situated along the fluid transport line, is also received by the vapor transport line and provided to the condenser, (iii) the condenser condenses the evaporated working fluid evaporated by the first evaporator and the evaporated working fluid evaporated by the plurality of evaporators situated along the fluid transport line into a liquid working fluid and provides the liquid working fluid to the liquid return line and fluid transport line, (iv) the liquid working fluid provided to the liquid return line is supplied to the reservoir, and (v) the liquid working fluid provided to the fluid transport line is pumped by the pump through the check valve and directly to the plurality of evaporators situated along the fluid transport line. 2. The pump-augmented LHP of claim 1 , further comprising: a subcooler upstream of a liquid intake of the pump configured to cool the pump with liquid pumped by the pump. 3. The pump-augmented LHP of claim 1 , further comprising: a second pump, wherein the pump and the second pump are in series and are rotodynamic pumps. 4. The pump-augmented LHP of claim 1 , wherein the pump is situated along the fluid transport line. 5. The pump-augmented LHP of claim 1 , wherein the plurality of evaporators situated along the fluid transport line are constructed to receive respective external heat loads. 6. The pump-augmented LHP of claim 5 , wherein the plurality of evaporators are constructed to evaporate liquid working fluid in the fluid transport line in accordance with the received respective external heat loads. 7. The pump-augmented LHP of claim 1 , further comprising: a condenser bypass connected to the liquid return line and the vapor transport line. 8. The pump-augmented LHP of claim 1 , further comprising: a condenser bypass connected to the liquid return line and the vapor transport line. 9. A pump-augmented Loop Heat Pipe (LHP), comprising: a first evaporator constructed to receive external heat and evaporate a working fluid; a reservoir integrated with the first evaporator; a vapor transport line connected to the first evaporator; a condenser connected to the vapor transport line; a liquid return line connected to the condenser and the reservoir; a fluid transport line connected to the liquid return line and the vapor transport line; a pump situated along the liquid return line; a plurality of evaporators situated along the fluid transport line; and a check valve situated along the fluid transport line and arranged to supply a liquid received from the pump directly to the plurality of evaporators situated along the fluid transport line; wherein the pump-augmented LHP is constructed to operate in: a first mode where the check valve is closed such that: (i) evaporated working fluid, evaporated by the first evaporator, is received by the vapor transport line and provided to the condenser, (ii) the condenser condenses the evaporated working fluid, evaporated by the first evaporator, into a liquid working fluid and provides the liquid working fluid to the liquid return line, and (iii) the liquid working fluid provided to the liquid return line is supplied to the pump which then supplies the liquid working fluid to the reservoir, and a second mode where the check valve is open such that: (i) the evaporated working fluid, evaporated by the first evaporator, is received by the vapor transport line and provided to the condenser, (ii) evaporated working fluid, evaporated by the plurality of evaporators situated along the fluid transport line is also received by the vapor transport line and provided to the condenser, (iii) the condenser condenses the evaporated working fluid evaporated by the first evaporator and the evaporated working fluid evaporated by the plurality of evaporators situated along the fluid transport line into a liquid working fluid and provides the liquid working fluid to the liquid return line and fluid transport line, (iv) the liquid working fluid provided to the liquid return line is supplied to the reservoir, and (v) the liquid working fluid provided to the fluid transport line is pumped by the pump through the check valve and directly to the plurality of evaporators situated along the fluid transport line. 10. The pump-augmented LHP of claim 9 , further comprising: a subcooler upstream of a liquid intake of the pump configured to cool the pump with liquid pumped by the pump. 11. The pump-augmented LHP of claim 9 , further comprising: a second pump, wherein the pump and the second pump are in series and are rotodynamic pumps. 12. The pump-augmented LHP of claim 9 , wherein the plurality of evaporators situated along the fluid transport line are constructed to receive respective external heat loads. 13. The pump-augmented LHP of claim 12 , wherein the plurality of evaporators are constructed to evaporate liquid working fluid in the fluid transport line in accordance with the received respective external heat loads.

Assignees

Inventors

Classifications

  • with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title

  • comprising internal rotor means, e.g. turbine driven by the working fluid · CPC title

  • having non-capillary condensate return means · CPC title

  • F28D15/043Primary

    forming loops, e.g. capillary pumped loops · CPC title

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What does patent US12429288B2 cover?
A pump-augmented Loop Heat Pipe (LHP) includes a conventional LHP evaporator/reservoir assembly; one or more additional evaporators; a condenser; a condenser bypass; and a pump upstream of the condenser and condenser bypass and configured to pump fluid generally toward the one or more additional evaporators.
Who is the assignee on this patent?
Us Gov Sec Navy
What technology area does this patent fall under?
Primary CPC classification F28D15/0266. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Sep 30 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).