Thermal element for a pressing insertion manufacturing process

US12429206B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12429206-B2
Application numberUS-202218278601-A
CountryUS
Kind codeB2
Filing dateMar 18, 2022
Priority dateMar 23, 2021
Publication dateSep 30, 2025
Grant dateSep 30, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for coupling a thermal plate ( 10 ) and a housing ( 20 ) is disclosed. The method includes the steps of inserting the thermal plate ( 10 ) having a main area ( 14 ) and one or more folded panels ( 11 ) configured at an angle ( 15 ) from the main area ( 14 ) to allow the thermal plate ( 10 ) to be inserted within the housing ( 20 ) and stopping the thermal plate ( 10 ) within the housing ( 20 ) at a predetermined location using a stop support ( 101 ). The one or more folded panels ( 11 ) are flattened using a pressing element ( 100 ) so that the angle from the main area ( 14 ) is substantially zero degrees so that the thermal plate ( 10 ) is physically and thermally coupled to an inside wall of the housing ( 20 ). The thermal plate ( 10 ) within the housing ( 20 ) may be aligned using one or more groves ( 12 ) and grove guides ( 21 ). The coupled thermal plate ( 11 ) and the housing may form part of a luminaire ( 200 ).

First claim

Opening claim text (preview).

The invention claimed is: 1. A device, comprising: a housing; and a thermal element including a main area having a curvature and one or more foldable panels that can be configured at an angle from the main area, wherein the foldable panels are configured to provide clearance to be inserted inside of the housing, only when folded, wherein the curvature and the one or more folded panels can be flattened, wherein the curvature is substantially removed from the main area and wherein panels are unfolded, so that the thermal element is physically and thermally coupled to an inside wall of the housing, wherein the unfolded panels create an interference with the inside wall of the housing. 2. The device of claim 1 , wherein the housing includes including a plurality of grove guides and the thermal element includes a plurality of groves arranged to be aligned with the grove guides. 3. The device of claim 2 , wherein the plurality groves and the plurality of grove guides have a cross-section selected from the group consisting of circular, elliptical, triangular, square, rectangular, pentagonal, hexagonal, or octagonal. 4. The device of claim 1 , wherein the thermal element is fabricated from an aluminum alloy. 5. The device of claim 1 , wherein the thermal element is fabricated from a material having a thermal conductivity of at least 5 W/(m K). 6. The device of claim 1 , wherein the thermal element is circular in shape, the housing is cylindrical in shape and the thermal element includes four folded panels each having a sub-portion area of the thermal element that are substantially equal. 7. The device of claim 1 , wherein the device forms at least part of a housing for a luminaire. 8. The device of claim 1 , wherein the luminaire includes a light source that generates heat that is at least partially dissipated via the thermal element and the housing. 9. The device of claim 1 , wherein housing has a cross-section selected from the group consisting of circular, elliptical, triangular, or square. 10. The device of claim 9 , wherein the thermal element has an outer-surface shape to match the inner-surface of the housing in a cross-section perpendicular to an axial direction of the housing. 11. A method for coupling a thermal plate to a housing comprising the steps of: inserting the thermal plate having a main area having a curvature and one or more folded panels configured at an angle from the main area to allow the thermal plate to be inserted within the housing; stopping the thermal plate within the housing at a predetermined location using a stop support; and flatting the curvature of the main area and the one or more folded panels using a pressing element, wherein the curvature is substantially removed from the main area and the angle from the main area is substantially zero degrees so that the thermal plate is physically and thermally coupled to an inside wall of the housing. 12. The method of claim 11 further comprising the step of aligning the thermal plate within the housing using one or more groves and grove guides. 13. The method of claim 11 , wherein the thermal plate and the housing form part of a luminaire. 14. The method of claim 11 , wherein the predetermined location is adjustable. 15. The method of claim 11 , wherein the angle is between 10 and 30 degrees.

Assignees

Inventors

Classifications

  • by first expanding and then shrinking or vice versa, e.g. by using pressure fluids; by making force fits · CPC title

  • characterised by passive heat-dissipating elements, e.g. heat-sinks · CPC title

  • Shrinkage connections, e.g. assembled with the parts being at different temperature · CPC title

  • Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for  (connecting sheet metal or metal tubes, rods or profiles B21D39/00; riveting B21J; soldering, unsoldering, welding B23K; hand tools for connecting wire or strip B25B25/00; connecting metal parts by adhesives F16B11/00) · CPC title

  • Light-emitting diodes [LED] · CPC title

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What does patent US12429206B2 cover?
A method for coupling a thermal plate ( 10 ) and a housing ( 20 ) is disclosed. The method includes the steps of inserting the thermal plate ( 10 ) having a main area ( 14 ) and one or more folded panels ( 11 ) configured at an angle ( 15 ) from the main area ( 14 ) to allow the thermal plate ( 10 ) to be inserted within the housing ( 20 ) and stopping the thermal plate ( 10 ) within the housin…
Who is the assignee on this patent?
Signify Holding Bv
What technology area does this patent fall under?
Primary CPC classification F21V29/507. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Sep 30 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).