Metal material and method for manufacturing metal material

Patent metadata

Field	Value
Publication number	US-12428732-B2
Application number	US-202017798596-A
Country	US
Kind code	B2
Filing date	Feb 25, 2020
Priority date	Feb 25, 2020
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

A metal material comprising: a base material; an oxide layer disposed on a surface of the base material; and a metal layer disposed on a surface of the oxide layer, wherein the base material includes aluminum, the oxide layer includes aluminum, nickel, and oxygen, the metal layer includes nickel, and an average thickness of the oxide layer is no less than 50 nm and no more than 250 nm.

First claim

The invention claimed is:

1. A metal material comprising:
a base material;
an oxide layer disposed on a surface of the base material; and
a metal layer disposed on a surface of the oxide layer, wherein
the base material includes aluminum,
the oxide layer includes aluminum, nickel, and oxygen,
the metal layer includes nickel,
an average thickness of the oxide layer is no less than 50 nm and no more than 250 nm,
the oxide layer includes a plurality of dispersed pores, and
a size of the pores is no less than 1 nm and no more than 50 nm.

2. The metal material according to claim 1 , wherein
the oxide layer comprises:
a base layer disposed on a base material side and
a composite layer disposed on a metal layer side, wherein
the base layer has a higher content of aluminum than that of nickel and
the composite layer has a higher content of nickel than that of aluminum.

3. The metal material according to claim 2 , wherein the base layer includes no less than 30 atomic % and no more than 60 atomic % of aluminum.

4. The metal material according to claim 2 , wherein the composite layer includes no less than 30 atomic % and no more than 70 atomic % of nickel.

5. The metal material according to claim 2 , wherein an average thickness of the base layer is no less than 30 nm and no more than 230 nm.

6. The metal material according to claim 2 , wherein an average thickness of the composite layer is no less than 20 nm and no more than 220 nm.

7. The metal material according to claim 2 , wherein
the composite layer comprises:
a plurality of protrusions protruding from the base layer; and
a metal portion interposed between adjacent protrusions thereof, wherein
each of the plurality of protrusions includes aluminum and oxygen, and
the metal portion includes nickel.

8. The metal material according to claim 1 , wherein an interface at which the base material and the oxide layer are in contact with each other is formed in an uneven shape.

9. The metal material according to claim 1 , wherein an average thickness of the metal layer is no less than 3 μm and no more than 15 μm.

10. The metal material according to claim 1 , wherein
the base material is a wire rod, and
a diameter of the wire rod is no less than 0.04 mm and no more than 5 mm.

11. The metal material according to claim 1 , wherein
the base material is a wire rod, and
a proportion of an average thickness of the oxide layer to a diameter of the base material is no less than 0.00005 and no more than 0.0025.

12. The metal material according to claim 1 , wherein
the base material is a wire rod, and
a proportion of an average thickness of the metal layer to a diameter of the base material is no less than 0.003 and no more than 0.075.

13. The metal material according to claim 2 , wherein
the base material is made of an aluminum alloy including a doped element, and
the base layer includes the doped element.

14. The metal material according to claim 1 , wherein the oxide layer includes no less than 20 atomic % and no more than 55 atomic % of oxygen.

15. A method for manufacturing a metal material according to claim 1 , comprising:
providing a base material including aluminum;
disposing a precursor layer including aluminum and nickel on a surface of the base material;
disposing a metal layer including nickel on a surface of the precursor layer; and
applying heat treatment to the base material on which the precursor layer and the metal layer are disposed, at a temperature of no less than 400° C. and no more than 600° C. to transform the precursor layer into an oxide layer including aluminum, nickel, and oxygen, wherein
the disposing a precursor layer comprises:
forming a thin film including aluminum oxide on the surface of the base material; and
applying electroless plating to the base material on which the thin film is formed, using a nickel plating solution having a pH of more than 9 and less than 11 at 25° C.

Assignees

• Sumitomo Electric Industries

Inventors

• Kureishi Yusuke
• Takeyama Tomoharu
• Hosoe Akihisa

Classifications

• C23C18/1827

  only one step pretreatment · CPC title

• C23C18/1817

  Heat · CPC title

• C23C18/1644

  porous substrates · CPC title

• C23C18/34

  using reducing agents · CPC title

• C25D7/0607

  Wires · CPC title