Resin composition and uses thereof

Patent metadata

Field	Value
Publication number	US-12428550-B2
Application number	US-202218056323-A
Country	US
Kind code	B2
Filing date	Nov 17, 2022
Priority date	Oct 20, 2022
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

A resin composition and the uses of it are provided. The resin composition comprises:
(A) a polyfunctional vinyl aromatic copolymer; and (B) a diene compound, represented by the following formula (I)

wherein, in formula (I), R 10 and R 11 are independently H, a C1-C6 linear or branched alkyl, with the proviso that R 10 and R 11 are not simultaneously H; and
the polyfunctional vinyl aromatic copolymer (A) is prepared by copolymerizing one or more divinyl aromatic compounds with one or more monovinyl aromatic compounds.

First claim

What is claimed is:

1. A resin composition, which comprises:
(A) a polyfunctional vinyl aromatic copolymer; and
(B) a diene compound, represented by the following formula (I),

wherein, in formula (I), R 10 and R 11 are independently H, a C1-C6 linear or branched alkyl, with the proviso that R 10 and R 11 are not simultaneously H; and
the polyfunctional vinyl aromatic copolymer (A) is prepared by copolymerizing one or more divinyl aromatic compounds with one or more monovinyl aromatic compounds.

2. The resin composition of claim 1 , wherein the weight ratio of the polyfunctional vinyl aromatic copolymer (A) to the diene compound (B) is 5:1 to 1:2.5.

3. The resin composition of claim 1 , wherein the polyfunctional vinyl aromatic copolymer (A) comprises a structural unit selected from the group consisting of

wherein R 1 and R 2 are independently a C6-C12 aromatic hydrocarbyl, and R 3 is H or a C1-C12 hydrocarbyl.

4. The resin composition of claim 1 , wherein the divinyl aromatic compound is selected from the group consisting of divinylbenzene, divinylnaphthalene, divinylbiphenyl, and isomers of the preceding compounds.

5. The resin composition of claim 1 , wherein the monovinyl aromatic compound is selected from the group consisting of nuclear-alkyl-substituted vinyl aromatic compound, α-alkyl-substituted vinyl aromatic compound, β-alkyl-substituted vinyl aromatic compound, and alkoxyl-substituted vinyl aromatic compound, and combinations thereof.

6. The resin composition of claim 1 , wherein the diene compound is selected from the group consisting of 1-isopropenyl-2-vinylbenzene, 1-isopropenyl-3-vinylbenzene, 1-isopropenyl-4-vinylbenzene, 1,2-diisopropenylbenzene, 1,3-diisopropenylbenzene, 1,4-diisopropenylbenzene, and combinations thereof.

7. The resin composition of claim 1 , further comprising:
(C) a polyphenylene ether resin with unsaturated functional groups represented by the following formula (II):

wherein, in formula (II),
R 4 , R 5 , R 6 and R 7 are independently H, or a substituted or unsubstituted C1-C5 alkyl;
p and q are independently an integer from 0 to 100, with the proviso that p and q are not 0 at the same time;
Y 4 and Y 5 are independently a direct bond, a carbonyl group, or an alkenyl-containing group;
A 1 and A 2 are independently

and
W is a direct bond, —O—,

or an aryl, wherein R 8 and R 9 are independently H or a C1-C12 alkyl.

8. The resin composition of claim 1 , further comprising:
(D) a compound having the structure of formula (III),

wherein, in formula (III), X is a C1-C10 linear or branched alkylene.

9. The resin composition of claim 1 , further comprising an additive selected from the group consisting of catalysts, elastomers, fillers, dispersing agents, tougheners, viscosity modifiers, flame retardants, plasticizers, coupling agents, and combinations thereof.

10. The resin composition of claim 9 , wherein the catalyst is selected from the group consisting of dicumyl peroxide, tert-butyl peroxybenzoate, di-tert-amyl peroxide (DTAP), isopropylcumyl-tert-butyl peroxide, tert-butylcumylperoxide, di(isopropylcumyl) peroxide, di-tert-butyl peroxide, α,α′-bis(tert-butylperoxy)diisopropyl benzene, benzoyl peroxide (BPO), 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, 4,4-di(tert-butylperoxy)butyl valerate, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, 2,5-dimethyl-2,5-di(tert-butylperoxy)-3-hexyne, and combinations thereof.

11. The resin composition of claim 9 , wherein the elastomer is selected from the group consisting of polybutadiene, styrene-butadiene copolymer, styrene-butadiene-divinylbenzene copolymer, polyisoprene, styrene-isoprene copolymer, acrylonitrile-butadiene copolymer, acrylonitrile-butadiene-styrene copolymer, functional modified derivatives of the preceding compounds, and combinations thereof.

12. The resin composition of claim 9 , wherein the filler is selected from the group consisting of silica, aluminum oxide, magnesium oxide, magnesium hydroxide, calcium carbonate, talc, clay, aluminum nitride, boron nitride, aluminum hydroxide, silicon aluminum carbide, silicon carbide, sodium carbonate, titanium dioxide, zinc oxide, zirconium oxide, quartz, diamond, diamond-like carbon, graphite, calcined kaolin, pryan, mica, hydrotalcite, polytetrafluoroethylene powders, glass beads, ceramic whiskers, carbon nanotubes, nanosized inorganic powders, and combinations thereof.

13. A prepreg, which is prepared by impregnating a substrate with the resin composition of claim 1 or by coating the resin composition of claim 1 onto a substrate and drying the impregnated or coated substrate.

14. A metal-clad laminate, which is prepared by laminating the prepreg of claim 13 and a metal foil.

15. A printed circuit board, which is prepared from the metal-clad laminate of claim 14 .

16. A metal-clad laminate, which is prepared by coating the resin composition of claim 1 onto a metal foil and drying the coated metal foil.

17. A printed circuit board, which is prepared from the metal-clad laminate of claim 16 .

Assignees

• Taiwan Union Technology Corp

Inventors

• Chiang Jen-Chi
• Chen Meng-Huei

Classifications

• C08J5/244

  using glass fibres · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• B32B2262/101

  Glass fibres · CPC title

• B32B2260/046

  Synthetic resin · CPC title

• B32B2260/021

  Fibrous or filamentary layer · CPC title