Polyolefin compositions for photovoltaic encapsulant films

Patent metadata

Field	Value
Publication number	US-12428507-B2
Application number	US-201716627202-A
Country	US
Kind code	B2
Filing date	Oct 31, 2017
Priority date	Jun 29, 2017
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

The present disclosure relates to an encapsulant film made from a curable composition comprising: (A) a polyolefin polymer; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising a monocyclic organosiloxane of formula (I).

First claim

What is claimed is:

1. A curable composition for forming an encapsulant film, wherein the composition comprises:
a) from 85 wt % to 99.88 wt % of an ethylene/1-octene copolymer comprising of greater than 60 wt % ethylenic units and at least 30 wt % 1-octene units and having a density of from 0.870 g/cc to 0.890 (ASTM D792) and a melt index of from 1.0 g/10 min to 50.0 g/10 min (ASTM D1238, at 190° C./2.16 kg);
b) from 0.1 wt % to 5 wt % of an organic peroxide;
c) from 0.01 wt % to 2 wt % of a silane coupling agent; and
d) from 0.01 wt % to 5 wt % of a co-agent comprising a monocyclic organosiloxane of formula (I):

wherein subscript n is an integer greater than or equal to 3; each R 1 is independently a (C 2 -C 4 )alkenyl; and each R 2 is independently H, (C 1 -C 4 )alkyl, phenyl, or R 1 .

2. The composition of claim 1 , wherein the monocyclic organosiloxane of formula (I) is further described by any one of limitations (i) to (vi): (i) subscript n is 3; (ii) each R 1 is independently a (C 2 -C 3 )alkenyl; and each R 2 is independently H, (C 1 -C 2 )alkyl, or (C 2 -C 3 )alkenyl; (iii) each R 1 is vinyl; and each R 2 is independently (C 1 -C 2 )alkyl; (iv) each R 1 is vinyl; and each R 2 is methyl; (v) each R 1 is allyl; and each R 2 is independently (C 1 -C 2 )alkyl; (vi) each R 1 is allyl; and each R 2 is methyl.

3. The composition of claim 1 , wherein the monocyclic organosiloxane of formula (I) is further described by any one of limitations (i) to (vi): (i) subscript n is 4; (ii) each R 1 is independently a (C 2 -C 3 )alkenyl; and each R 2 is independently H, (C 1 -C 2 )alkyl, or (C 2 -C 3 )alkenyl; (iii) each R 1 is vinyl; and each R 2 is independently (C 1 -C 2 )alkyl; (iv) each R 1 is vinyl; and each R 2 is methyl; (v) each R 1 is allyl; and each R 2 is independently (C 1 -C 2 )alkyl; (vi) each R 1 is allyl; and each R 2 is methyl.

4. The composition of claim 1 , wherein the monocyclic organosiloxane of formula (I) is further described by any one of limitations (i) to (vi): (i) subscript n is 5 or 6; (ii) each R 1 is independently a (C 2 -C 3 )alkenyl; and each R 2 is independently H, (C 1 -C 2 )alkyl, or (C 2 -C 3 )alkenyl; (iii) each R 1 is vinyl; and each R 2 is independently (C 1 -C 2 )alkyl; (iv) each R 1 is vinyl; and each R 2 is methyl; (v) each R 1 is allyl; and each R 2 is independently (C 1 -C 2 )alkyl; (vi) each R 1 is allyl; and each R 2 is methyl.

5. The composition of claim 1 , wherein the monocyclic organosiloxane of formula (I) is selected from the group consisting of: 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane; 1,3,5-trivinyl-1,3,5-trimethylcyclotrisiloxane; 1,3,5,7,9-pentavinyl-1,3,5,7,9-pentamethylcyclopentasiloxane; and combinations thereof.

6. An encapsulant film comprising a crosslinked polymeric composition comprising the reaction product of:
a) from 85 wt % to 99.88 wt % of an ethylene/1-octene copolymer comprising of greater than 60 wt % of ethylenic units and at least 30 wt % 1-octene units and having a density of from 0.870 g/cc to 0.890 g/cc (ASTM D792) and a melt index of from 1.0 g/10 min to 50.0 g/10 min (ASTM D1238, at 190° C./2.16 kg);
b) from 0.1 wt % to 5 wt % of an organic peroxide;
c) from 0.01 wt % to 2 wt % of a silane coupling agent; and
d) from 0.01 wt % to 5 wt % of a co-agent comprising a monocyclic organosiloxane of formula (I):

wherein subscript n is an integer greater than or equal to 3; each R 1 is independently a (C 2 -C 4 )alkenyl; and each R 2 is independently H, (C 1 -C 4 )alkyl, phenyl, or R 1 ; and an average initial glass adhesion of greater than 60 N/cm.

7. The encapsulant film of claim 6 , wherein the monocyclic organosiloxane of formula (I) is further described by any one of limitations (i) to (vi): (i) subscript nis 3; (ii) each R 1 is independently a (C 2 -C 3 )alkenyl; and each R 2 is independently H, (C 1 -C 2 )alkyl, or (C 2 -C 3 )alkenyl; (iii) each R 1 is vinyl; and each R 2 is independently (C 1 -C 2 )alkyl; (iv) each R 1 is vinyl; and each R 2 is methyl; (v) each R 1 is allyl; and each R 2 is independently (C 1 -C 2 )alkyl; (vi) each R 1 is allyl; and each R 2 is methyl.

8. The encapsulant film of claim 6 , wherein the monocyclic organosiloxane of formula (I) is further described by any one of limitations (i) to (vi): (i) subscript n is 4; (ii) each R 1 is independently a (C 2 -C 3 )alkenyl; and each R 2 is independently H, (C 1 -C 2 )alkyl, or (C 2 -C 3 )alkenyl; (iii) each R 1 is vinyl; and each R 2 is independently (C 1 -C 2 )alkyl; (iv) each R 1 is vinyl; and each R 2 is methyl; (v) each R 1 is allyl; and each R 2 is independently (C 1 -C 2 )alkyl; (vi) each R 1 is allyl; and each R 2 is methyl.

9. The encapsulant film of claim 6 , wherein the monocyclic organosiloxane of formula (I) is further described by any one of limitations (i) to (vi): (i) subscript n is 5 or 6; (ii) each R 1 is independently a (C 2 -C 3 )alkenyl; and each R 2 is independently H, (C 1 -C 2 )alkyl, or (C 2 -C 3 )alkenyl; (iii) each R 1 is vinyl; and each R 2 is independently (C 1 -C 2 )alkyl; (iv) each R 1 is vinyl; and each R 2 is methyl; (v) each R 1 is allyl; and each R 2 is independently (C 1 -C 2 )alkyl; (vi) each R 1 is allyl; and each R 2 is methyl.

10. The encapsulant film of claim 6 , wherein the monocyclic organosiloxane of formula (I) is selected from the group consisting of: 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane; 1,3,5-trivinyl-1,3,5-trimethylcyclotrisiloxane; 1,3,5,7,9-pentavinyl-1,3,5,7,9-pentamethylcyclopentasiloxane; and combinations thereof.

11. The encapsulant film of claim 6 , further comprising a volume resistivity of greater than 1.0*10 14 ohm-cm at room temperature.

12. The encapsulant film of claim 6 , further comprising a volume resistivity of greater than 1.0*10 14 ohm-cm at 60° C.

13. An electronic device module comprising:
an electronic device,
a cover sheet, and
the encapsulant film of claim 6 .

Assignees

• Dow Global Technologies Llc

Inventors

• Yang Yunfeng
• He Chao
• Ma Weiming
• Chen Hongyu
• Sun Yabin
• Zhang Kainan
• Cogen Jeffrey M
• Person Timothy J
• Li Yuyan
• Yang Hong

Classifications

• H10F19/804

  Materials of encapsulations · CPC title

• C08K5/549

  containing silicon in a ring · CPC title

• C08K5/5425

  containing at least one C=C bond · CPC title

• C08L23/04

  Homopolymers or copolymers of ethene · CPC title

• C08L23/06

  Polyethylene · CPC title