Encapsulation of external components in active implantable medical devices

Patent metadata

Field	Value
Publication number	US-12427323-B2
Application number	US-202017597527-A
Country	US
Kind code	B2
Filing date	Jul 13, 2020
Priority date	Jul 11, 2019
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

An implantable medical device is described. The implantable medical device includes an enclosure for receiving and hermitically sealing active components. A header is connected to the enclosure and encloses other components of the device. A communications antenna is encapsulated in a bio-compatible material and connected to an exterior surface of the enclosure. The communications antenna is electrically connected to the active components via an access window of the header. The access window is backfilled after the connections are made.

First claim

What is claimed is:

1. An implantable device, comprising:
an enclosure comprising a lid and a side wall connected to the lid;
an electronics assembly disposed within an interior volume of the enclosure;
a plurality of conductive leads electrically connected to the electronics assembly and extending through the enclosure;
a header connected to the lid of the enclosure comprising an access window, wherein the plurality of conductive leads extends from the electronics assembly through the access window; and
a communications antenna mounted on an exterior surface of the side wall and comprising a main body and a tab, the tab comprising a plurality of conductive terminals and corresponding in size and shape to the access window, wherein the main body is coated in a bio-compatible material and the plurality of conductive terminals is electrically connected to the plurality of conductive leads.

2. The implantable device of claim 1 , wherein the main body of the communications antenna is not disposed within the header.

3. The implantable device of claim 1 , further comprising:
a charging antenna connected to the lid; and
a connector stack connected to the lid,
wherein a second plurality of conductive leads extends through the enclosure and electrically connects the electronics assembly to at least one of the connector stack or the charging antenna.

4. The implantable device of claim 3 , further comprising an epoxy header that encloses the charging antenna and the connector stack.

5. The implantable device of claim 1 , wherein each conductive lead of the plurality of conductive leads extends through the lid of the enclosure in a first direction and comprises a bend that orients a distal tip of the respective conductive lead in a second direction.

6. The implantable device of claim 1 , wherein the enclosure hermetically seals the interior volume.

7. The implantable device of claim 1 , wherein the bio-compatible material is RF-compatible.

8. The implantable device of claim 1 , wherein the communications antenna further comprises a metallic plate formed on a ceramic substrate, and the plurality of conductive terminals is electrically connected to the metallic plate via a set of conductive traces.

9. The implantable device of claim 8 , wherein the main body and the tab are formed from the ceramic substrate, with the metallic plate disposed in the main body.

10. A method, comprising:
providing an enclosure comprising an electronics assembly;
coupling a header to enclose at least a lid of the enclosure, wherein an access window is formed at a perimeter edge of the header, a plurality of conductive leads extending from the electronics assembly and through the access window; and
connecting a communications antenna to an exterior surface of a side wall of the enclosure, the communications antenna comprising a body and an electrical termination tab that corresponds in size and shape to the access window and aligns a plurality of conductive terminals disposed in the electrical termination tab with the plurality of conductive leads.

11. The method of claim 10 , further comprising electrically connecting the plurality of conductive terminals with the plurality of conductive leads.

12. The method of claim 11 , wherein the body of the communications antenna is formed from a ceramic substrate that is coated in a bio-compatible material.

13. The method of claim 12 , wherein the header is formed from a second bio-compatible material.

14. The method of claim 10 , wherein the electrical termination tab extends beyond a perimeter edge of the lid of the enclosure.

15. The method of claim 10 , wherein electrically connecting the plurality of conductive terminals with the plurality of conductive leads comprises at least one of soldering, crimping, or laser welding.

16. The method of claim 10 , wherein connecting the communications antenna to the exterior surface of the side wall comprises:
applying an adhesive to at least one of the communications antenna or the side wall; and
mating together the communications antenna and the side wall, with the adhesive disposed between the communications antenna and the side wall.

17. The method of claim 10 , further comprising forming the header.

18. The method of claim 17 , wherein forming the header comprises:
forming the header as a separate part; and
fitting the header in place on the lid of the enclosure after forming the header.

19. The method of claim 10 , further comprising, after connecting the communications antenna, placing a backfill material in the access window to cover at least the plurality of conductive terminals.

20. The method of claim 19 , wherein connecting the communications antenna to the exterior surface of the side wall comprises connecting the communications antenna at a particular mounting location on the exterior surface that defines an air gap between the header and the communications antenna, and wherein placing the backfill material further comprises placing the backfill material in the air gap.

21. The method of claim 10 , further comprising, prior to connecting the communications antenna, forming the communications antenna by at least:
forming the body and the electrical termination tab in a ceramic substrate;
forming a first metallic plate in a first side of the body of the ceramic substrate;
forming a second metallic plate in a second side of the body of the ceramic substrate;
forming the plurality of conductive terminals in the electrical termination tab;
forming a set of electrical traces in the ceramic substrate that electrically connect the first and second metallic plates and the plurality of conductive terminals; and
encasing the body in a bio-compatible material without encasing the electrical termination tab.

Assignees

• Verily Life Sciences Llc
• Peterson David K

Inventors

• Loo Alexander
• Cong Peng
• Peterson David K

Classifications

• A61N1/3787

  from an external energy source · CPC title

• A61N1/3758

  Packaging of the components within the casing · CPC title

• A61N1/3754

  Feedthroughs · CPC title

• A61N1/37229 Primary

  Shape or location of the implanted or external antenna · CPC title