Acoustic wave device with electrode fingers made of an alloy

Patent metadata

Field	Value
Publication number	US-12426513-B2
Application number	US-202217863448-A
Country	US
Kind code	B2
Filing date	Jul 13, 2022
Priority date	Jan 20, 2020
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

An acoustic wave device includes an IDT electrode on a piezoelectric layer. The IDT electrode includes first and second electrode fingers made of an alloy film including Al and at least one of Cu, Mg, Ag, or Nd, and an overlap region in which the first and second electrode fingers overlap when viewed in the direction of propagation of acoustic waves. The overlap region includes a central region and first and second edge regions outside the central region on opposite sides in the direction in which the first and second electrode fingers extend. In at least one of the first and second electrode fingers, a concentration of the at least one of Cu, Mg, Ag, or Nd in at least a portion of the first and second edge regions is higher than that in the central region.

First claim

What is claimed is:

1. An acoustic wave device comprising:
a piezoelectric layer; and
an IDT electrode on the piezoelectric layer, the IDT electrode including a plurality of electrode fingers; wherein
the plurality of electrode fingers are made of an alloy film including Al and at least one of Cu, Mg, Ag, or Nd;
the plurality of electrode fingers include interdigitated first and second electrode fingers, and an overlap region in which the first and second electrode fingers overlap when viewed in a direction of propagation of an acoustic wave;
the overlap region includes a central region in a middle in a direction in which the electrode fingers extend, and first and second edge regions outside the central region on opposite sides in the direction in which the electrode fingers extend; and
in at least one of the plurality of electrode fingers, a concentration of the at least one of Cu, Mg, Ag, or Nd in at least a portion of the first and second edge regions is higher than a concentration of the at least one of Cu, Mg, Ag, or Nd in the central region.

2. The acoustic wave device according to claim 1 , wherein in all of the first and second electrode fingers, the concentration of the at least one of Cu, Mg, Ag, or Nd in at least a portion of the first and second edge regions is higher than a concentration of the at least one of Cu, Mg, Ag, or Nd in at least a portion of the central region.

3. The acoustic wave device according to claim 1 , wherein in the central region of the plurality of electrode fingers, the alloy film is an epitaxial film.

4. The acoustic wave device according to claim 1 , wherein in at least one of the plurality of electrode fingers, a concentration of an ingredient of the at least one of Cu, Mg, Ag, or Nd in the central region is about 10% by weight or less.

5. The acoustic wave device according to claim 1 , wherein at least one of the plurality of electrode fingers includes a mass-adding film in the first or second edge region.

6. The acoustic wave device according to claim 5 , wherein the mass-adding film is between the piezoelectric layer and the first and second electrode fingers.

7. The acoustic wave device according to claim 5 , wherein the mass-adding film includes a dielectric material.

8. The acoustic wave device according to claim 5 , wherein the mass-adding film includes metal.

9. The acoustic wave device according to claim 1 , wherein the alloy film is primarily Al and includes Cu.

10. The acoustic wave device according to claim 1 , wherein the alloy film is primarily Al and includes Mg.

11. The acoustic wave device according to claim 1 , wherein the alloy film is primarily Al and includes Ag.

12. The acoustic wave device according to claim 1 , wherein the alloy film is primarily Al and includes Nd.

13. The acoustic wave device according to claim 1 , wherein an acoustic velocity in the first and second edge regions is lower than an acoustic velocity in the central region.

14. The acoustic wave device according to claim 1 , further comprising a layer of a high-acoustic-velocity material, through which a bulk wave propagates faster than an elastic wave propagates through the piezoelectric layer, and the piezoelectric layer is directly or indirectly on the layer of a high-acoustic-velocity material.

15. The acoustic wave device according to claim 14 , wherein the layer of a high-acoustic-velocity material is a high-acoustic-velocity support substrate made of the high-acoustic-velocity material.

16. The acoustic wave device according to claim 14 , further comprising a low-acoustic-velocity film between the layer of a high-acoustic-velocity material and the piezoelectric layer, the low-acoustic-velocity film being made of a low-acoustic-velocity material, through which a bulk wave propagates more slowly than through the piezoelectric layer.

17. The acoustic wave device according to claim 2 , wherein in the central region of the plurality of electrode fingers, the alloy film is an epitaxial film.

18. The acoustic wave device according to claim 2 , wherein in at least one of the plurality of electrode fingers, a concentration of an ingredient of the at least one of Cu, Mg, Ag, or Nd in the central region is about 10% by weight or less.

19. The acoustic wave device according to claim 2 , wherein at least one of the plurality of electrode fingers includes a mass-adding film in the first or second edge region.

20. The acoustic wave device according to claim 19 , wherein the mass-adding film is between the piezoelectric layer and the first and second electrode fingers.

Assignees

• Murata Manufacturing Co

Inventors

• Daimon Katsuya
• Taniguchi Yasumasa

Classifications

• H03H9/02574

  of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate · CPC title

• H03H9/14538 Primary

  Formation · CPC title

• H03H9/13

  for networks consisting of piezoelectric or electrostrictive materials (for networks using surface acoustic waves H03H9/145) · CPC title

• H10N30/877 Primary

  Conductive materials · CPC title