Light-emitting substrate, backlight module and display apparatus

Patent metadata

Field	Value
Publication number	US-12426423-B2
Application number	US-202218264597-A
Country	US
Kind code	B2
Filing date	May 9, 2022
Priority date	May 9, 2022
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

A light-emitting substrate includes a back plate, light-emitting regions arranged in an array and a bonding electrode group. The light-emitting regions are disposed on the back plate, and each light-emitting region is provided with at least one light-emitting group therein. The bonding electrode group is disposed on the back plate and includes a first bonding electrode and remaining bonding electrodes. A second power supply voltage terminal of a light-emitting group is electrically connected to a feedback signal line included in the light-emitting substrate, and the first bonding electrode is electrically connected to the feedback signal line. An impedance between the first bonding electrode and an adjacent one of the remaining bonding electrodes is larger then an impedance between two adjacent and consecutive ones of the remaining bonding electrodes.

First claim

What is claimed is:

1. A light-emitting substrate comprising:
a back plate;
a feedback signal line;
a plurality of light-emitting regions arranged in an array and disposed on the back plate, wherein each light-emitting region is provided with at least one light-emitting group therein, a light-emitting group of the at least one light-emitting group is a first light-emitting group, and a second power supply voltage terminal of the first light-emitting group is electrically connected to the feedback signal line; and
a bonding electrode group disposed on the back plate, wherein the bonding electrode group includes a plurality of bonding electrodes disposed in parallel, and the plurality of bonding electrodes includes a first bonding electrode and remaining bonding electrodes;
wherein the feedback signal line is electrically connected to the first bonding electrode, the feedback signal line is configured to transmit a feedback signal;
an impedance between the first bonding electrode and an adjacent one of the remaining bonding electrodes is larger than an impedance between two adjacent and consecutive ones of the remaining bonding electrodes; and
in an extending direction of the bonding electrode group, a ratio of a distance between the first bonding electrode and the adjacent one of the remaining bonding electrodes to a distance between the two adjacent and consecutive ones of the remaining bonding electrodes is greater than or equal to 3.

2. The light-emitting substrate according to claim 1 , wherein the impedance between the first bonding electrode and the adjacent one of the remaining bonding electrodes is greater than 10G ohms.

3. The light-emitting substrate according to claim 1 , wherein the distance between the first bonding electrode and the adjacent one of the remaining bonding electrodes is greater than 600 μm.

4. The light-emitting substrate according to claim 1 , wherein at least one first empty space and/or at least one redundant bonding electrode is provided between the first bonding electrode and the adjacent one of the remaining bonding electrodes;
wherein a first empty space is a region, where a bonding electrode is to be provided and no bonding electrode is actually provided, reserved in the bonding electrode group; the redundant bonding electrode transmits no signal.

5. A light-emitting substrate comprising:
a back plate;
a feedback signal line;
a plurality of light-emitting regions arranged in an array and disposed on the back plate, wherein each light-emitting region is provided with at least one light-emitting group therein, a light-emitting group of the at least one light-emitting group is a first light-emitting group, and a second power supply voltage terminal of the first light-emitting group is electrically connected to the feedback signal line; and
a bonding electrode group disposed on the back plate, wherein the bonding electrode group includes a plurality of bonding electrodes disposed in parallel, and the plurality of bonding electrodes includes a first bonding electrode and remaining bonding electrodes; and
a first power supply voltage signal line, wherein
the feedback signal line is electrically connected to the first bonding electrode, the feedback signal line is configured to transmit a feedback signal;
an impedance between the first bonding electrode and an adjacent one of the remaining bonding electrodes is larger than an impedance between two adjacent and consecutive ones of the remaining bonding electrodes;
a first power supply voltage terminal of the first light-emitting group is electrically connected to the first power supply voltage signal line, and the remaining bonding electrodes include a power supply voltage bonding electrode electrically connected to the first power supply voltage signal line; and
at least one first empty space and/or at least one redundant bonding electrode is provided between the power supply voltage bonding electrode and an adjacent one of the remaining bonding electrode.

6. The light-emitting substrate according to claim 1 , further comprising a second power supply voltage signal line and a third power supply voltage signal line, wherein the light-emitting region is further provided at least one chip therein, and each light-emitting group is electrically connected to a single chip; an output pin of a chip is electrically connected to the second power supply voltage terminal of the first light-emitting group, a first power supply pin of the chip is electrically connected to the second power supply voltage signal line, and a second power supply pin of the chip is electrically connected to the third power supply voltage signal line;
a plurality of chips located in a same light-emitting region are sequentially cascaded; and an output pin of a last chip in the plurality of cascaded chips is electrically connected to the feedback signal line.

7. The light-emitting substrate according to claim 1 , wherein the light-emitting substrate further comprises a flexible circuit board or a chip on flex, wherein the flexible circuit board or the chip on flex includes a gold finger, and the bonding electrode group is electrically connected to the gold finger;
wherein a thickness of the gold finger is in a range of 6 μm to 10 μm.

8. The light-emitting substrate according to claim 7 , wherein the gold finger includes a plurality of conductive contacts, the plurality of conductive contacts include at least a first conductive contact and remaining conductive contacts, and each of the plurality of conductive contacts is electrically connected to a bonding electrode; wherein the first conductive contact is configured to be electrically connected to the first bonding electrode, and a second empty space and/or a redundant contact is provided between the first conductive contact and an adjacent one of the remaining conductive contacts; and
at least one first empty space and/or at least one redundant bonding electrode is provided between the first bonding electrode and the adjacent one of the remaining bonding electrodes; wherein
an orthographic projection of the second empty space on the back plate at least partially overlaps with an orthographic projection of a first empty space on the back plate, and an orthographic projection of a redundant bonding electrode on the back plate at least partially overlaps with an orthographic projection of the redundant contact on the back plate.

9. The light-emitting substrate according to claim 7 , wherein an anisotropic conductive film is provided between the bonding electrode group and the gold finger; and
a thickness of the anisotropic conductive film is in a range of 9 μm to 13 μm.

10. A backlight module, comprising:
the light-emitting substrate according to claim 1 , wherein the light-emitting substrate further includes a flexible circuit board or a chip on flex, the flexible circuit board or the chip on flex includes a gold finger including a first conductive contact, and the bonding electrode group is electrically connected to the gold finger; the light-emitting region is further provided at least one chip therein; and
a driver chip disposed on a backlight side of the light-emitting substrate, wherein the driver chip is electrically connected to the first conductive contact, and the driver chip is configured to receive a feedback signal output by a chip.

11. The backlight module according to claim 10 , wherein the backlight module further comprises:
a plurality of supporters fixed on a light exit side of the light-emitting substrate;
a diffuser plate disposed on an end of the plurality of supporters away from the light-emitting substrate;
a quantum dot film disposed on a side of the diffusi

Assignees

• Hefei Boe Ruisheng Tech Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Sun Yiding
• Zhang Bing
• Tang Hai
• Gao Liang
• Geng Xiaolin
• Qin Jianwei
• Wang Xiao

Classifications

• H10W90/00

  Package configurations · CPC title

• G02F1/133603 Primary

  with LEDs · CPC title

• H10H20/855

  Optical field-shaping means, e.g. lenses · CPC title

• G02F1/133612

  Electrical details · CPC title

• G02F1/13454

  Drivers integrated on the active matrix substrate (G02F1/136277 takes precedence) · CPC title