Flip-chip light-emitting diode and high-voltage flip-chip light-emitting device
US-2022149243-A1 · May 12, 2022 · US
US12426405B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12426405-B2 |
| Application number | US-202217885952-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 11, 2022 |
| Priority date | Aug 16, 2021 |
| Publication date | Sep 23, 2025 |
| Grant date | Sep 23, 2025 |
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A light-emitting device includes a substrate and an epitaxial unit. The substrate has a first and a second surface. The substrate is formed on the first surface with a plurality of protrusions. The epitaxial unit includes a first semiconductor layer, an active layer, and a second semiconductor layer that are sequentially disposed on the first surface of the substrate. The first surface of the substrate has a first area that is not covered by the epitaxial unit, and a second area this is covered by the epitaxial unit. A height difference (h 2 ) between the first area and the second area is no greater than 1 μm. A display apparatus and a lighting apparatus are also disclosed.
Opening claim text (preview).
What is claimed is: 1. A light-emitting device, comprising: a substrate having a first surface and a second surface opposite to said first surface, said substrate being formed on said first surface with a plurality of protrusions and a plurality of recesses, said protrusions being spaced apart from one another by said recesses; and an epitaxial unit including a first semiconductor layer, an active layer, and a second semiconductor layer that are sequentially disposed on said first surface of said substrate in such order; wherein said first surface of said substrate has a first area not covered by said epitaxial unit, and a second area covered by said epitaxial unit, said first area being lower than said second area, a height difference (h 2 ) between said first area and said second area being no greater than 1 μm. 2. The light-emitting device according to claim 1 , wherein each of said protrusions formed on said second area has a height (h 3 ), each of said protrusions formed on said first area having a height (h 1 ), h 3 being greater than h 1 . 3. The light-emitting device according to claim 2 , wherein the height (h 1 ) of one or more of said protrusions on said first area is no greater than 1 μm. 4. The light-emitting device according to claim 2 , wherein the height (h 3 ) of each of said protrusions formed on said second area ranges from 1 μm to 3 μm. 5. The light-emitting device according to claim 2 , wherein the height (h 3 ) of each of said protrusions formed on said second area is no less than 1.5 μm. 6. The light-emitting device according to claim 2 , wherein, a ratio of the height (h 1 ) of one or more of said protrusions to the height (h 3 ) of each of said protrusions formed on said second area is no less than 0.20. 7. The light-emitting device according to claim 2 , wherein, a ratio of the height (h 1 ) of one or more of said protrusions to the height (h 3 ) of each of said protrusions formed on said second area is no greater than 0.50. 8. The light-emitting device according to claim 1 , wherein the height difference (h 2 ) between said first area and said second area is no less than 0.2 μm. 9. The light-emitting device according to claim 1 , wherein a distance between geometric centers of two adjacent ones of said protrusions formed on said first area is no less than 1 μm. 10. The light-emitting device according to claim 1 , wherein a distance between geometric centers of two adjacent ones of said protrusions formed on said second area is no greater than a distance between geometric centers of two adjacent ones of said protrusions formed on said first area. 11. The light-emitting device according to claim 1 , wherein said first area has a width that is no greater than 25 μm. 12. The light-emitting device according to claim 1 , further comprising an insulating layer that covers said first area, wherein said insulating layer that covers said first area has a thickness no less than 50 nm. 13. The light-emitting device according to claim 12 , wherein said insulating layer that covers said first area has a thickness no less than 1000 nm, and said insulating layer that covers said first area includes first sublayers and second sublayers that are alternately arranged to form a laminated structure, said first sublayers and said second sublayers being made from different materials. 14. The light-emitting device according to claim 1 , comprising two of said epitaxial units that are spaced apart from each other by said first area. 15. The light-emitting device according to claim 1 , wherein said first area surrounds said epitaxial unit. 16. The light-emitting device according to claim 1 , wherein said light-emitting device is a flip-chip light-emitting device. 17. The light-emitting device according to claim 1 , wherein said substrate and said protrusions are made of the same material. 18. The light-emitting device according to claim 1 , wherein each of said protrusions is in a cone shape. 19. The light-emitting device according to claim 1 , wherein a height difference between said recesses on said first area and said recesses on said second area is no greater than 1 μm. 20. A lighting apparatus, comprising a light-emitting device as claimed in claim 1 .
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
relative to the surface, e.g. recessed, protruding · CPC title
comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title
Plan-view shape, i.e. in top view · CPC title
comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title
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