Modular liquid cooling architecture for liquid cooling

Patent metadata

Field	Value
Publication number	US-12426208-B2
Application number	US-202418636967-A
Country	US
Kind code	B2
Filing date	Apr 16, 2024
Priority date	Nov 22, 2021
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

A housing and cooling system for computer hardware includes an infrastructure module and a payload module. The infrastructure module is configured for housing computer hardware and is equipped with either or both of a convective air cooling system and an arrangement of metal plates connected by one or more conduits for carrying liquid for cooling computer equipment housed by the infrastructure module. The infrastructure modules also houses a programmable logic controller (“PLC”). The payload module includes an immersion cooling system governed by the PLC and is located outside of the infrastructure module.

First claim

The invention claimed is:

1. A method of housing and cooling computer hardware, the method comprising:
housing first computer hardware in an infrastructure module that also houses a programmable logic controller (“PLC”), the infrastructure module having a first power consumption level and comprising an infrastructure bus bar;
immersing second computer hardware in evaporable liquid within a two phase immersion cooling system housed by a payload module, the payload module having a second power consumption level greater than the first power consumption level and being located outside of the infrastructure module and the immersion cooling system being governed by the PLC; and
electrically connecting a payload bus bar to the infrastructure bus bar.

2. The method of claim 1 , further comprising cooling the first computer hardware with a cooling arrangement included by the infrastructure module, the cooling arrangement of the infrastructure module comprising at least one of a liquid-air heat exchanger and an arrangement of metal plates connected by one or more conduits for carrying liquid.

3. The method of claim 2 , further comprising connecting the cooling arrangement of the infrastructure module and a condenser of the two phase immersion cooling system in parallel to a building liquid supply.

4. The method of claim 3 , further comprising connecting the cooling arrangement of the infrastructure module and the condenser in series to a building liquid supply.

5. The method of claim 4 , further comprising connecting the cooling arrangement of the infrastructure module and the condenser to the building liquid supply such that liquid is supplied by the building liquid supply to the cooling arrangement of the infrastructure module and is returned to the building liquid supply from the condenser.

6. The method of claim 1 , further comprising supplying electrical power to the payload module and the second computer hardware through the infrastructure module.

7. The method of claim 1 , wherein the payload module is a first payload module, and comprising immersing third computer hardware in evaporable liquid in a tank housed by a second payload module that includes a two phase immersion cooling system, the two phase immersion cooling system of the second payload module being governed by the PLC.

8. The method of claim 1 , the payload module has the dimensions of a single EIA-310 standard server rack or of two or three adjoining EIA-310 standard server racks.

9. The method of claim 2 , wherein the cooling arrangement has a first cooling capacity.

10. The method of claim 9 , wherein the two-phase immersion cooling system has a second cooling capacity higher than the first cooling capacity.

11. The method of claim 1 , further comprising connecting the infrastructure bus bar to an external power supply.

12. The method of claim 1 , wherein the payload module is a first payload module and the immersion cooling system of the first payload module includes a first condenser, the method further comprising:
connecting the first condenser and a second condenser of a second payload module in series along a flow path of cooling liquid.

13. The method of claim 1 , wherein the payload module is a first payload module and the immersion cooling system of the first payload module includes a first condenser, the method further comprising:
connecting the first condenser and a second condenser of a second payload module in parallel along a flow path of cooling liquid.

Assignees

• Google Llc

Inventors

• Chiu Jerry
• Iyengar Madhusudan K

Classifications

• H05K7/20818

  within cabinets for removing heat from server blades · CPC title

• H05K7/20318

  Condensers · CPC title

• H05K7/20127

  Natural convection · CPC title

• H05K7/203 Primary

  by immersion · CPC title