Additively manufactured device enclosures

Patent metadata

Field	Value
Publication number	US-12426187-B2
Application number	US-202217805641-A
Country	US
Kind code	B2
Filing date	Jun 6, 2022
Priority date	May 20, 2020
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

A component for an electronic device can include a pre-formed substrate comprising a first metal and an additively manufactured portion bonded to the pre-formed substrate. The additively manufactured portion can include a first portion comprising a second metal and defining a volume, the first portion having a first value of a material property, and a second portion disposed in the volume, the second portion having a second value of the material property that is different from the first value.

First claim

What is claimed is:

1. A housing for an electronic device, comprising:
a first housing portion, comprising:
a first substrate comprising a first metal and at least partially defining an exterior surface of the housing; and
a first additively manufactured portion bonded to the first substrate, the first additively manufactured portion comprising a second metal and defining a first engagement structure;

a second housing portion, comprising:
a second substrate comprising a third metal and at least partially defining the exterior surface; and
a second additively manufactured portion bonded to the second substrate, the second additively manufactured portion comprising a fourth metal and defining a second engagement structure; and

a material engaging the first substrate, the first engagement structure, the second substrate, and the second engagement structure.

2. The housing of claim 1 , wherein the first metal is different from the second metal.

3. The housing of claim 1 , wherein at least one of the first metal and the second metal comprises at least one of steel or titanium.

4. The housing of claim 3 , wherein the second metal comprises at least one of steel, aluminum, or copper.

5. The housing of claim 1 , wherein:
the first substrate has a first density;
the second substrate has a second density;
the first additively manufactured portion has a third density that is lower than the first density; and
the second additively manufactured portion has a fourth density that is lower than the second density.

6. The housing of claim 1 , wherein at least one of the first engagement structure or the second engagement structure comprises a gyroid structure.

7. The housing of claim 1 , wherein at least one of the first engagement structure or the second engagement structure defines an array of fluidically interconnected voids.

8. The housing of claim 1 , wherein the material comprises a polymer.

9. A component for an electronic device, comprising:
a pre-formed substrate comprising a first metal; and
an additively manufactured portion bonded to the pre-formed substrate, the additively manufactured portion comprising:
a first portion comprising a second metal and defining a volume, the first portion having a first value of a material property; and
a second portion disposed in the volume, the second portion having a second value of the material property that is different from the first value;

wherein the first portion at least partially surrounds the second portion.

10. The component of claim 9 , wherein the material property comprises density and the second value is lower than the first value.

11. The component of claim 9 , wherein the material property comprises thermal conductivity and the second value is higher than the first value.

12. The component of claim 9 , wherein the second portion comprises an electronic component.

13. The component of claim 9 , wherein the second portion comprises a self-healing material.

14. The component of claim 9 , wherein the first metal is different from the second metal.

15. The component of claim 9 , wherein the pre-formed substrate defines a cosmetic exterior surface of the electronic device.

16. The component of claim 9 , wherein the additively manufactured portion is diffusion bonded to the pre-formed substrate.

Assignees

• Apple Inc

Inventors

• Hamann Eric W
• Misra Abhijeet
• Prescenzi Anthony D
• Gable Brian M
• Prest Christopher D
• Li Hoishun
• Yurko James A
• Hooton Lee E
• Wittenberg Michael B
• Dinh Richard H
• Schuler Jennifer D

Classifications

• H04M1/026

  Details of the structure or mounting of specific components · CPC title

• H05K5/0086

  portable, e.g. battery operated apparatus (casings for switching devices H01H9/02) · CPC title

• H05K5/0208

  Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof · CPC title

• H04M1/0249

  Details of the mechanical connection between the housing parts or relating to the method of assembly · CPC title

• H05K5/04 Primary

  Metal casings · CPC title