Display module and mobile terminal

Patent metadata

Field	Value
Publication number	US-12426169-B2
Application number	US-202217795545-A
Country	US
Kind code	B2
Filing date	Jun 9, 2022
Priority date	May 25, 2022
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

Disclosed are a display module and a mobile terminal. The display module includes a first bonding segment of a display panel and a second bonding segment on a flexible circuit board, wherein a second bonding terminal on the second bonding segment corresponds to and is electrically connected to a first bonding terminal on the first bonding segment, and a second mark is disposed opposite to a first mark; a support layer is disposed between the first bonding segment and the second bonding segment, and a projection of the support layer in a direction perpendicular to the first bonding segment is disposed on a peripheral side of the first mark.

First claim

What is claimed is:

1. A display module comprising:
a display panel comprising a display segment and a first bonding segment, the first bonding segment being provided with a first mark and a first bonding terminal; and
a flexible circuit board comprising a second bonding segment disposed opposite to the first bonding segment, the second bonding segment being provided with a second mark and a second bonding terminal, the second bonding terminal corresponding to and being electrically connected to the first bonding terminal, the second mark being disposed opposite to the first mark;
wherein a support layer is disposed between the first bonding segment and the second bonding segment, and a projection of the support layer in a direction perpendicular to the first bonding segment is disposed at least on a peripheral side of the first mark and/or the second mark, and
the support layer is disposed at least on a side of the first mark and/or the second mark close to the first bonding terminal and/or the second bonding terminal, and the support layer is in contact with only a side surface of the first bonding terminal and/or the second bonding terminal closest to the first mark and/or the second mark.

2. The display module of claim 1 , wherein a thickness of the support layer in the direction perpendicular to the first bonding segment is less than a perpendicular distance between the first bonding segment and the second bonding segment, and the support layer is spaced apart from the first bonding segment or the second bonding segment.

3. The display module of claim 1 , wherein the support layer comprises a first support layer disposed on the first bonding segment and/or a second support layer disposed on the second bonding segment.

4. The display module of claim 3 , wherein the support layer comprises the first support layer and the second support layer, and a height of the second support layer in a direction perpendicular to the second bonding segment is less than a height of the second bonding terminal.

5. The display module of claim 3 , wherein the support layer comprises a third support layer disposed on the first bonding segment, and a projection of the third support layer in the direction perpendicular to the first bonding segment is disposed on a peripheral side of the first bonding terminal.

6. The display module of claim 3 , wherein the support layer comprises a fourth support layer disposed on the second bonding segment, and a projection of the fourth support layer in the direction perpendicular to the first bonding segment is disposed on a peripheral side of the second bonding terminal.

7. The display module of claim 1 , wherein the support layer comprises an organic film layer disposed on the first bonding segment, and the organic film layer is disposed surround the first mark in the direction perpendicular to the first bonding segment, and/or
the organic film layer is disposed on the second bonding segment, and the organic film layer is disposed surround the second mark in a direction perpendicular to the second bonding segment.

8. The display module of claim 1 , wherein the support layer comprises at least one support structure group, the number of the at least one support structure group is the same as the number of the first mark; one of the at least one support structure group comprises a plurality of spaced support structures, and the plurality of support structures are disposed on a peripheral side of a corresponding first mark and/or second mark.

9. The display module of claim 8 , wherein a spacing between every two adjacent support structures is gradually increased along a direction away from the first mark and/or the second mark, within one of the at least one support structure group.

10. The display module of claim 8 , wherein a projection area of the support structures on the first bonding segment is gradually reduced in a direction away from the first mark and/or the second mark, within one of the at least one support structure group.

11. The display module of claim 8 , wherein each of the support structures comprises a first surface facing the first bonding segment and a second surface facing the second bonding segment, and an area of the first surface is greater than an area of the second surface in the direction perpendicular to the first bonding segment.

12. A mobile terminal, comprising a display module and a terminal body, wherein the terminal body is integrated with the display module, and the display module comprises:
a display panel comprising a display segment and a first bonding segment, the first bonding segment being provided with a first mark and a first bonding terminal; and
a flexible circuit board comprising a second bonding segment disposed opposite to the first bonding segment, the second bonding segment being provided with a second mark and a second bonding terminal, the second bonding terminal corresponding to and being electrically connected to the first bonding terminal, the second mark being disposed opposite to the first mark;
wherein a support layer is disposed between the first bonding segment and the second bonding segment, and a projection of the support layer in a direction perpendicular to the first bonding segment is disposed at least on a peripheral side of the first mark and/or the second mark, and
the support layer is disposed at least on a side of the first mark and/or the second mark close to the first bonding terminal and/or the second bonding terminal, and the support layer is in contact with only a side surface of the first bonding terminal and/or the second bonding terminal closest to the first mark and/or the second mark.

13. The mobile terminal of claim 12 , wherein a thickness of the support layer in the direction perpendicular to the first bonding segment is less than a perpendicular distance between the first bonding segment and the second bonding segment, and the support layer is spaced apart from the first bonding segment or the second bonding segment.

14. The mobile terminal of claim 12 , wherein the support layer comprises a first support layer disposed on the first bonding segment and/or a second support layer disposed on the second bonding segment.

15. The mobile terminal of claim 14 , wherein the support layer comprises the first support layer and the second support layer, and a height of the second support layer is less than a height of the second bonding terminal in a direction perpendicular to the second bonding segment.

16. The mobile terminal of claim 14 , wherein the support layer comprises a third support layer disposed on the first bonding segment, and a projection of the third support layer in the direction perpendicular to the first bonding segment is disposed on a peripheral side of the first bonding terminal.

17. The mobile terminal of claim 14 , wherein the support layer comprises a fourth support layer disposed on the second bonding segment, and a projection of the fourth support layer in the direction perpendicular to the first bonding segment is disposed on a peripheral side of the second bonding terminal.

18. The mobile terminal of claim 12 , wherein the support layer comprises an organic film layer disposed on the first bonding segment, and the organic film layer is disposed surround the first mark in the direction perpendicular to the first bonding segment, and/or
the organic film layer is disposed on the second bonding segment, and the organic film layer is disposed surround the second mark in a direction perpendicular to the second bonding segment.

19. T

Assignees

• Wuhan China Star Optoelectronics Semiconductor Display Tech Co Ltd

Inventors

• Liu Zongwei

Classifications

• B32B3/10

  characterised by a discontinuous layer, i.e. formed of separate pieces of material · CPC title

• B32B3/22

  of spaced pieces {(not used)} · CPC title

• B32B3/02

  characterised by features of form at particular places, e.g. in edge regions {(non-uniform thickness B32B3/263)} · CPC title

• H05K3/361

  Assembling flexible printed circuits with other printed circuits · CPC title

• H05K2201/09918

  Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components · CPC title