Electric component

Patent metadata

Field	Value
Publication number	US-12426162-B2
Application number	US-202117645007-A
Country	US
Kind code	B2
Filing date	Dec 17, 2021
Priority date	Dec 22, 2020
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

An electric component includes: a semiconductor component including a heat radiating portion, a semiconductor element, a lead terminal, and a coating resin coating a part of each of the above; a wiring board including a first mounting portion, a second mounting portion, and an insulating substrate; a first solder connecting the first mounting portion and the heat radiating portion; and a second solder connecting the second mounting portion and the lead terminal. The first solder includes (a) a solder connecting portion connecting the heat radiating portion and the first mounting portion and (b) a flux provided around the solder connecting portion, and a third space which is provided as a space after excluding a second space that is an overlap of the heat radiating portion and the first mounting portion from a first space.

First claim

What is claimed is:

1. An electric component comprising:
a semiconductor component including:
a heat radiating portion made of metal,
a semiconductor element provided in or on the heat radiating portion,
a lead terminal connected to the semiconductor element, and
a coating resin coating at least part of each of: (i) the heat radiating portion, (ii) the lead terminal, and (iii) the semiconductor element;

a wiring board including
a first mounting portion made of metal and is located below the heat radiating portion,
a second mounting portion made of metal that is located at least partially below an exposed portion of the lead terminal, wherein the portion of the lead terminal is overlapped with the second mounting portion, and
an insulating substrate supporting the first mounting portion and the second mounting portion;
a first solder connecting the first mounting portion and the heat radiating portion; and
a second solder connecting the second mounting portion and the exposed portion of the lead terminal, and

wherein:
the first solder includes: (a) a first solder connecting portion connecting the heat radiating portion and the first mounting portion, and (b) a first flux contacting a side of first solder connecting portion and contacting the insulating substrate,
a first space is a first volume defined by the heat radiating portion projecting directly downward to a central portion of the wiring board,
a second space is a second volume defined by the first mounting portion projecting directly upward to a central portion of the heat radiating portion,
a third space is a third volume defined by subtracting the second space from the first space, the first solder connecting portion occupies substantially all of the second space and occupies a portion of the third space, and
the first flux is located within an unoccupied portion of the third space that is not occupied by the first solder.

2. The electric component of claim 1 , wherein
the first flux includes a first flux residue having less liquid component than a center portion of the first flux, and
the first flux residue is located within the unoccupied portion of the third space that is not occupied by the first solder.

3. The electric component of claim 1 , wherein
the first mounting portion is inserted into the insulating substrate, and
an insulating upper surface of the insulating substrate and a first upper surface of the first mounting portion are flush with each other.

4. The electric component of claim 1 , further comprising:
an insulating sealing portion for sealing (i) an exposed portion of the lead terminal exposed from the coating resin and (ii) the second solder.

5. The electric component of claim 1 , wherein
a cross sectional area of the first solder connecting portion reduces from the heat radiating portion toward the first mounting portion in an arrangement direction in which the heat radiating portion and the semiconductor element are arranged.

6. The electric component of claim 1 , wherein
in the third space, the first solder connecting portion overlaps the first flux in an arrangement direction in which the heat radiating portion and the semiconductor element are arranged.

7. The electric component of claim 1 , wherein
the third space comprises an annular shape that surrounds the second space.

8. The electric component of claim 1 , wherein
the first solder connecting portion comprises a regular square pyramid pedestal shape.

9. An electronic component comprising:
a wiring board including:
(i) an insulating substrate including an insulating upper surface,
(ii) a first land including a first upper surface, and
(iii) second land including a second upper surface;

a semiconductor component including:
(i) a heat radiating portion including a heat radiating lower surface and a heat radiating upper surface,
(ii) a semiconductor element including a semiconductor lower surface in thermal communication with the heat radiating upper surface of the heat radiating portion,
(iii) a lead terminal in electrical communication the semiconductor element, and including an extension exposed lower surface, and
(iv) a coating resin coating portions of: the heat radiation portion, the semiconductor element, and the lead terminal;

a first solder connecting portion connecting substantially all of the first upper surface to substantially all of the heat radiating lower surface,
a second solder connecting portion connecting substantially all of the second upper surface to substantially all of the extension exposed lower surface, and
a first flux residue bounded on a substantially diagonal upper surface by a portion of the first solder connecting portion, and bounded on a lower surface by the insulating upper surface.

10. The electronic component of claim 9 , wherein, when viewed vertically:
the heat radiating lower surface completely overlaps the first upper surface, and a perimeter of the heat radiating lower surface completely surrounds a perimeter of the first upper surface.

11. The electronic component of claim 10 , wherein, when viewed vertically:
the second upper surface completely overlaps the extension exposed lower surface, and

a portion of the second upper surface extends horizontally outwardly beyond the extension exposed lower surface.

12. The electronic component of claim 11 , wherein
the first solder connecting portion forms a truncated square pyramid having a base surface contacting the heat radiating lower surface and having truncated surface contacting the first upper surface.

13. The electronic component of claim 12 , wherein
the insulating upper surface, the second upper surface, and the first upper surface are all coplanar.

14. The electronic component of claim 9 , wherein
a first space is a first volume defined by the heat radiating portion projecting directly downward to a central portion of the wiring board,
a second space is a second volume defined by the wiring board and projecting directly upward to a central portion of the heat radiating portion,
a third space is a third volume defined by subtracting the second space from the first space, the first solder connecting portion occupies substantially all of the second space and occupies a portion of the third space, and
the third space comprises an annular shape that surrounds the second space.

15. The electronic component of claim 9 , wherein
the first solder connecting portion comprises a regular square pyramid pedestal shape.

Assignees

• Denso Corp

Inventors

• Sato Go
• IZAKI Taito

Classifications

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W70/461 Primary

  specially adapted for cooling · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W70/427

  Bent parts · CPC title