Flexible printed circuit board comprising power transmission line

Patent metadata

Field	Value
Publication number	US-12426155-B2
Application number	US-202117997930-A
Country	US
Kind code	B2
Filing date	Nov 25, 2021
Priority date	Dec 3, 2020
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

The present invention provides a flexible printed circuit board comprising: a first power line formed on one surface of a first dielectric layer; and a second power line formed on one surface of a second dielectric layer spaced apart from the first dielectric layer on a bottom surface of the first dielectric layer. There is an overlapping area in which the first power line and the second power line overlap, the first power line and the second power line are connected at a first end of the overlapping area through a via hole, and the first power line and the second power line are connected at a second end of the overlapping area through another via hole.

First claim

The invention claimed is:

1. A flexible printed circuit board, comprising: a first power line formed on one surface of a first dielectric layer; and a second power line formed on one surface of a second dielectric layer formed on a bottom surface of the first dielectric layer to be spaced apart from the first dielectric layer, wherein there is an overlapping region where the first power line and the second power line overlap, wherein the first power line and the second power line are connected at a first end of the overlapping region through one via hole, and the first power line and the second power line are connected at a second end of the overlapping region through another via hole to connect the first power line and the second power line in parallel, wherein there is a non-overlapping region where a length of the first power line is formed to be longer than a length of the overlapping region so that the first power line does not overlap the second power line, wherein a width of the overlapping region is formed to be narrower than a width of the non-overlapping region, wherein the flexible printed circuit board further comprises: a first connector connected to one end of the first power line and connected to a first signal processing unit; a second connector connected to the other end of the first power line and connected to a second signal processing unit; and signal lines configured to connect the first connector and the second connector, and wherein the first power line is disposed at one side of the signal lines.

2. A flexible printed circuit board, comprising: a first power line formed on one surface of a first dielectric layer; a second power line formed on one surface of a second dielectric layer formed on a bottom surface of the first dielectric layer to be spaced apart from the first dielectric layer; and a third power line formed on one surface of a third dielectric layer formed on a bottom surface of the second dielectric layer to be spaced apart from the second dielectric layer, wherein the second power line is formed to correspond to the first power line, wherein there is an overlapping region where the second power line and the third power line overlap, wherein at least two or more power lines selected from the first, second, and third power lines are connected in parallel, wherein there is a non-overlapping region where a length of the second power line is formed to be longer than a length of the overlapping region so that the second power line does not overlap the third power line, wherein a width of the overlapping region is formed to be narrower than a width of the non-overlapping region, wherein the flexible printed circuit board further comprising: a first connector connected to one end of the first power line and connected to a first signal processing unit; a second connector connected to the other end of the first power line and connected to a second signal processing unit; and signal lines configured to connect the first connector and the second connector, and wherein the first power line is disposed at one side of the signal lines.

3. The flexible printed circuit board of claim 2 , further comprising:
a first via hole configured to connect the first power line and the second power line at both ends of the second power line; and a second via hole configured to connect the first, second, and third power lines at both ends of a portion of the second power line.

4. The flexible printed circuit board of claim 2 , further comprising a fourth power line formed on one surface of a fourth dielectric layer formed on a bottom surface of the third dielectric layer to be spaced apart from the third dielectric layer, wherein at least two or more power lines selected from the first, second, third, and fourth power lines are connected in parallel.

5. The flexible printed circuit board of claim 4 , wherein the fourth power line is formed to correspond to the third power line, and wherein the flexible printed circuit board further comprises: a first via hole configured to connect the first power line and the second power line at both ends of the second power line; and a second via hole configured to connect the first, second, third, and fourth power lines at both ends of a portion of the second power line.

6. A flexible printed circuit board, comprising: a first power line formed on one surface of a first dielectric layer; and a plurality of slits formed in the first power line to be spaced apart from each other, wherein an orientation of each of the plurality of slits follows a longitudinal direction of the first power line, wherein a current is formed to flow through the first power line in one direction, wherein each of the plurality of slits is formed to have a length in one direction and a width shorter than the length, wherein a longitudinal direction of the plurality of slits is parallel to the direction of the current flowing through the first power line, and wherein the plurality of slits include long slits for increasing an amount of current allowed in the first power line, and short slits for minimizing a shape change due to thermal expansion of the first power line.

7. The flexible printed circuit board of claim 6 , wherein: a through hole passing through the first dielectric layer and the first power line is formed;
and at least some of the long slits are formed around the through hole to surround a portion of the through hole.

8. The flexible printed circuit board of claim 6 , further comprising a third power line formed on one surface of a third dielectric layer formed on a bottom surface of the first dielectric layer to be spaced apart from the first dielectric layer, wherein the first and third power lines are connected in parallel.

9. The flexible printed circuit board of claim 8 , wherein: a width of a middle region of the first power line is narrower than widths of both end regions of the first power line; and the third power line is formed to face only the middle region of the first power line.

10. The flexible printed circuit board of claim 9 , wherein the both end regions of the first power line are bent with respect to the middle region of the first power line on one surface of the first dielectric layer.

Assignees

• Gigalane Co Ltd

Inventors

• Jo Byung Hoon
• Kim Ik Soo
• Kim Byung Yeol
• Jung Hee Seok

Classifications

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K1/0237

  High frequency adaptations (H05K1/0216 takes precedence) · CPC title

• H05K2201/09672

  Superposed layout, i.e. in different planes · CPC title

• H05K1/0298

  Multilayer circuits · CPC title