Heater apparatus for a computing device

Patent metadata

Field	Value
Publication number	US-12426149-B2
Application number	US-202217576708-A
Country	US
Kind code	B2
Filing date	Jan 14, 2022
Priority date	Jan 14, 2022
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

A computing device includes a printed circuit board, a base, and a heater apparatus. The printed circuit board is secured to the base. The heater apparatus includes a heater component and a plurality of heater wires, and the heater component is disposed between the printed circuit board and the base.

First claim

The invention claimed is:

1. An information handling system, comprising
a plurality of computing devices, each computing device comprising:
a printed circuit board;
a base, wherein the printed circuit board is secured to the base; and
a heater apparatus, wherein the heater apparatus comprises a heater component and a plurality of heater wires, wherein the heater component is disposed between the printed circuit board and the base.

2. The information handling system of claim 1 , wherein the heater component has a shape that is aligned with the printed circuit board and the base.

3. The information handling system of claim 1 , further comprising:
a second heater component disposed between the printed circuit board and the base.

4. The information handling system of claim 3 , wherein the heater component and the second heater component operate independently.

5. The information handling system of claim 1 , wherein the heater component is a silicon rubber heater.

6. The information handling system of claim 1 , wherein an area of the heater component is less than an area of the printed circuit board.

7. The information handling system of claim 1 , wherein the heater apparatus comprises a plurality of holes that are aligned with a plurality of mounting holes on top of the base.

8. The information handling system of claim 7 , wherein the plurality of holes allows a plurality of screws to pass through the printed circuit board and the heater component, and interface with the plurality of mounting holes.

9. The information handling system of claim 1 , wherein the printed circuit board is in direct thermal contact with the heater component, and the heater component is in direct thermal contact with the base.

10. A method for heating a printed circuit board, comprising:
determining an environmental condition of a computing device; and
in response to determination, initiating heating of at least a portion of the printed circuit board using a heater component, wherein the heater component is disposed between the printed circuit board and a base, wherein the printed circuit board is secured to the base.

11. The method of claim 10 , further comprising:
based on the determination:
initiating heating of at least a portion of the printed circuit board using a second heater component, wherein the second heater component is disposed between the printed circuit board and the base, wherein the printed circuit board is secured to the base.

Assignees

• Dell Products Lp

Inventors

• Tunks Eric Michael
• Eiland Richard Mark

Classifications

• H05K3/325

  by abutting or pinching; Mechanical auxiliary parts therefor · CPC title

• H05K2201/10409

  Screws · CPC title

• G06F1/183

  Internal mounting support structures, e.g. for supporting printed circuit boards · CPC title

• G06F1/206

  comprising thermal management · CPC title

• G06F1/20

  Cooling means · CPC title