Methods and apparatuses for protecting a seal in a pressure vessel of a photolithography system
US-2019086817-A1 · Mar 21, 2019 · US
US12426145B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12426145-B2 |
| Application number | US-202218550841-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 21, 2022 |
| Priority date | Mar 25, 2021 |
| Publication date | Sep 23, 2025 |
| Grant date | Sep 23, 2025 |
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There is described a connection assembly (24) for a high-pressure liquid metal supply system used in an EUV light source comprising a monolithic block, wherein the monolithic block includes: at least one connection (21) for connecting to a reservoir (18,19) configured to hold liquid metal; interior passages (25) configured to fluidly connect the at least one connection with at least two liquid metal outlets/inlets (22, 23); at least two freeze valves (15,16,17) configured to block a passage by solidifying liquid metal therein. Also described is a liquid metal storage assembly including such a connection assembly, a lithography apparatus including such a liquid metal storage assembly or such a connection assembly, as well as the use of such assemblies or apparatus in a lithographic apparatus or method.
Opening claim text (preview).
The invention claimed is: 1. An assembly comprising: at least one connection configured to connect to a reservoir that is configured to hold liquid metal; interior passages configured to fluidly connect the at least one connection with at least one liquid metal input and at least one liquid metal outlet; and at least two freeze valves configured to block a passage by solidifying liquid metal therein, and wherein the interior passages and the at least two freeze valves are integrally formed as a monolithic block. 2. The assembly of claim 1 , further comprising one or more thermal conditioning elements in thermal connection with the freeze valves. 3. The assembly of claim 2 , wherein the one or more thermal conditioning elements include one or more cooling elements, and/or one or more heating elements in thermal connection with the freeze valves. 4. The assembly of claim 2 , further comprising one or more controllers configured to control the one or more thermal conditioning elements to selectively open or close the freeze valves. 5. The assembly of claim 2 , wherein the one or more thermal conditioning elements are configured to locally cool each freeze valve to below the melting point of the metal therein and/or to heat each freeze valve to above the melting point of the metal therein. 6. The assembly of claim 1 , wherein the assembly is configured to operate at pressures of up to around 30 kpsi or at pressures of at least around 3000 psi or at least around 4000 psi. 7. The assembly of claim 1 , wherein each freeze valve is at least partially thermally isolated from the other freeze valve(s). 8. The assembly of claim 7 , wherein each freeze valve is at least partially thermally isolated from the other freeze valve(s) by a section of the monolithic block having a decreased cross-sectional area. 9. The assembly of claim 1 , wherein: a first one of the at least two freeze valves is in fluid communication with one of the at least two liquid metal outlets/inlets configured to receive liquid metal, the first freeze valve is in fluid communication with the at least one connection for connecting to a reservoir configured to hold liquid metal, and the first freeze valve is also in fluid communication with a second one of the at least two freeze valves. 10. The assembly of claim 1 , wherein: a second one of the at least two freeze valves is in fluid communication with the at least one connection configured to connect to a first liquid metal reservoir, and a first one of the at least two freeze valves, an optional third freeze valve, and one of the at least two liquid metal outlets/inlets are configured to discharge liquid metal. 11. The assembly of claim 1 , further comprising: a third freeze valve in fluid communication with a second one of the at least two freeze valves, in fluid communication with a connection configured to connect to a second liquid metal reservoir, and in communication with an outlet of the at least two liquid metal outlets/inlets configured to discharge liquid metal. 12. The assembly of claim 1 , wherein the assembly is formed from a material which is resistant to liquid tin, molybdenum, or a molybdenum alloy. 13. A liquid metal supply assembly for an EUV lithography apparatus or source including the assembly of claim 1 . 14. A lithography apparatus including the assembly of claim 1 .
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