Electronic device including antenna

US12424725B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12424725-B2
Application numberUS-202217976449-A
CountryUS
Kind codeB2
Filing dateOct 28, 2022
Priority dateOct 13, 2021
Publication dateSep 23, 2025
Grant dateSep 23, 2025

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An example electronic device including an antenna includes a housing including a first conductive portion, a first support member disposed inside the housing, a printed circuit board disposed on one surface of the first support member and including a wireless communication module, an electronic component electrically connected to the printed circuit board, and a conductive plate supporting the electronic component. The conductive plate is constituted such that a first portion is electrically connected to the wireless communication module and a second portion is electrically connected to the first conductive portion, and thereby broadband radiation characteristics can be provided.

First claim

Opening claim text (preview).

What is claimed is: 1. An electronic device comprising: a housing including a first conductive portion; a first support member disposed inside the housing; a printed circuit board disposed on one surface of the first support member and including a wireless communication module; an electronic component electrically connected to the printed circuit board; a conductive plate supporting the electronic component, the conductive plate including a first portion electrically connected to the wireless communication module and a second portion electrically connected to the first conductive portion; and a heat dissipation member disposed in one direction of the conductive plate and operating as an antenna radiator by coupling with the conductive plate. 2. The electronic device of claim 1 , wherein the first portion of the conductive plate is electrically connected to the printed circuit board through a first connecting member, and the second portion is electrically connected to the first conductive portion through a second connecting member. 3. The electronic device of claim 2 , wherein the first connecting member includes one of a screw, a conductive foam spring, solder, a C clip, or a conductive tape. 4. The electronic device of claim 1 , wherein the conductive plate operates as a first antenna radiator, and the first conductive portion is configured to operate as a second antenna radiator. 5. The electronic device of claim 1 , wherein the electronic component includes one of a speaker module, a motor, or a cable to cable (CTC) connector. 6. The electronic device of claim 1 , wherein heat generated from the electronic component is dissipated to outside the electronic device through the conductive plate and the first conductive portion. 7. The electronic device of claim 1 , wherein the second portion of the conductive plate is configured to be combined with the first conductive portion through a non-conductive member and a conductive member. 8. The electronic device of claim 7 , wherein the second portion is configured to couple with the conductive member with the non-conductive member therebetween. 9. The electronic device of claim 1 , wherein the second portion of the conductive plate is electrically connected to the first conductive portion through a second connecting member and a third PCB. 10. The electronic device of claim 9 , wherein the third PCB is configured to adjust a time constant of the conductive plate and the first conductive portion. 11. The electronic device of claim 9 , wherein the third PCB is electrically connected to the first conductive portion through a third connecting member. 12. The electronic device of claim 1 , wherein the first conductive portion is formed between a first segmenting part and a second segmenting part of the housing. 13. The electronic device of claim 1 , wherein the heat dissipation member includes a conductive graphite sheet. 14. The electronic device of claim 1 , wherein the heat dissipation member is configured to receive heat generated from the electronic component through the conductive plate and dissipate the heat to outside the electronic device. 15. An electronic device comprising: a housing; a printed circuit board disposed inside the housing and including a wireless communication module; an electronic component electrically connected to the printed circuit board; a conductive plate supporting the electronic component, the conductive plate including a first portion electrically connected to the wireless communication module; and a heat dissipation member disposed in one direction of the conductive plate and operating as an antenna radiator by coupling with the conductive plate. 16. The electronic device of claim 15 , wherein the housing includes a first conductive portion separated by a first segmenting part and a second segmenting part formed in at least a part of a side surface, and a second portion of the conductive plate is electrically connected to the first conductive portion. 17. The electronic device of claim 16 , wherein the first portion of the conductive plate is electrically connected to the printed circuit board through a first connecting member, and the second portion is electrically connected to the first conductive portion through a second connecting member. 18. The electronic device of claim 15 , wherein the heat dissipation member is configured to receive heat generated from the electronic component through the conductive plate and dissipate the heat to outside the electronic device.

Assignees

Inventors

Classifications

  • used in mobile communications, e.g. GSM (H01Q1/247, H01Q1/248 take precedence) · CPC title

  • Details of the structure or mounting of specific components · CPC title

  • formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

  • Constructional features of telephone sets · CPC title

  • Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)} · CPC title

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12424725B2 cover?
An example electronic device including an antenna includes a housing including a first conductive portion, a first support member disposed inside the housing, a printed circuit board disposed on one surface of the first support member and including a wireless communication module, an electronic component electrically connected to the printed circuit board, and a conductive plate supporting the …
Who is the assignee on this patent?
Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01Q1/02. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 23 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).