Cooling system comprising a serpentine passageway

Patent metadata

Field	Value
Publication number	US-12424512-B2
Application number	US-202017766560-A
Country	US
Kind code	B2
Filing date	Oct 7, 2020
Priority date	Oct 9, 2019
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

A cooling system ( 26 ) comprising a cooling arrangement ( 24, 24′, 24″ ) having a serpentine passageway ( 20 ) for a circulating fluid coolant is disclosed. The serpentine passageway ( 20 ) is provided between a plurality of walls ( 6, 8 ) displaced from each other. A series of baffles ( 10 ) each having a proximal portion ( 12 ) and a distal portion ( 14 ) are disposed within the passageway ( 20 ). The baffles ( 10 ) extend from one of the walls into the passageway ( 20 ). The distal portion ( 14 ) has a width (W 2 ) that is larger than the width (W 1 ) of the proximal portion ( 12 ).

First claim

What is claimed is:

1. A cooling system comprising a serpentine passageway for a circulating fluid coolant, wherein the passageway is provided between a plurality of walls displaced from each other, wherein a series of baffles each having a proximal portion and a distal portion are disposed within the passageway, said baffles extending from one of the walls into the passageway, wherein the distal portion has a width that is larger than the width of the proximal portion and that the proximal portion and the distal portion comprise adjacent side walls, wherein the angle between said adjacent sidewalls is less than 180°.

2. The cooling system according to claim 1 , wherein the baffles are designed to create a flow on either side of a baffle, wherein the flow on either side of the baffle is in opposite directions.

3. The cooling system according to claim 1 , wherein the length of the proximal portion is larger than the length of the distal portion.

4. The cooling system according to claim 1 , wherein a number of indentations are provided in the proximal portion.

5. The cooling system according to claim 1 , wherein a number of indentations are provided in the distal portion.

6. The cooling system according to claim 1 , wherein a number of protrusions are provided in the proximal portion.

7. The cooling system according to claim 1 , wherein a number of protrusions are provided in the distal portion.

8. The cooling system according to claim 1 , wherein the cooling system comprises a single cooling arrangement.

9. The cooling system according to claim 8 , wherein the cooling arrangement is arranged on a baseplate.

10. The cooling system according to claim 1 , wherein the cooling system comprises two cooling arrangements disposed on a baseplate.

11. The cooling system according to claim 1 , wherein the cooling system comprises three or more cooling arrangements disposed on a baseplate.

12. The cooling system according to claim 1 , wherein the cross section of the distal portion is circular.

13. The cooling system according to claim 1 , wherein the baffles extend parallel to each other.

14. The cooling system according to claim 1 , wherein the baffles extend basically perpendicular to the wall, from which the baffles extend into the passageway.

15. The cooling system according to claim 1 , wherein the baffles are fixed to the wall from which they extend.

16. An electronic device comprising a cooling system according to claim 1 .

17. A computer-readable medium having computer-executable instructions adapted to cause a 3D-printer to print a cooling system according to claim 1 .

Assignees

• Danfoss Silicon Power Gmbh

Inventors

• Ströbel-Maier Henning
• Olesen Klaus

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H01L25/072

  Electricity · mapped topic

• H01L23/473 Primary

  Electricity · mapped topic