Component embedded in component carrier and having an exposed side wall

Patent metadata

Field	Value
Publication number	US-12424504-B2
Application number	US-202218147276-A
Country	US
Kind code	B2
Filing date	Dec 28, 2022
Priority date	Aug 4, 2017
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

A method for manufacturing a component carrier includes i) providing a metal layer, in particular a copper layer; ii) forming a film on the metal layer; iii) patterning the film in order to expose a part of the metal layer; iv) carrying out a first etch, thereby thinning the film and removing a further part of the exposed metal layer; and thereafter v) carrying out a second etch, thereby forming at least one metal trace that is spatially separated from the metal layer. A component carrier made by the method is further described.

First claim

We claim:

1. A component carrier, comprising:
a stack comprising a plurality of electrically conductive layer structures and/or electrically insulating layer structures;
an optical component embedded in the stack;
wherein at least a portion of a side wall of the optical component is exposed;
an access recess formed in the stack, wherein the access recess extends from a lateral side wall of the stack to the side wall of the optical component and the access recess exposes the side wall of the optical component; and
wherein the access recess is a slit-shaped recess exposing a first side wall of the optical component and a second side wall of a further component, wherein the first side wall and the second side wall oppose each other, the optical component and the further component are arranged opposite to each other, and the optical component and the further component are communicatively coupled.

2. The component carrier according to claim 1 , wherein the access recess is configured as a blind hole.

3. The component carrier according to claim 1 , wherein the further component is inserted in the access recess.

4. The component carrier according to claim 1 , wherein the further component is an optically transparent component.

5. The component carrier according to claim 1 , wherein the further component is configured as at least one of (i) a light guide and (ii) an optical fiber.

6. The component carrier according to claim 1 , wherein the further component is configured as at least one of (i) a light detecting element and (ii) a light emitting element.

7. The component carrier according to claim 1 , wherein the further component comprises at least one reflecting surface which is configured to diverge a light beam.

8. The component carrier according to claim 1 , wherein the further component comprises at least one optical lens which is configured to change a focus of a light beam.

9. The component carrier according to claim 1 , wherein the
optical component and the further component are communicatively coupled for a wireless data communication via the slit-shaped access.

10. The component carrier according to claim 1 , wherein the optical component and the further component are embedded in the stack.

11. The component carrier according to claim 1 , further comprising:
a transparent material arranged between the side wall of the optical component and a lateral side wall of the stack.

12. The component carrier according to claim 11 , wherein the transparent material forms part of an optical path for propagating electromagnetic radiation.

13. The component carrier according to claim 11 , wherein the transparent material comprises at least one of (i) a fiber free material, (ii) glass, and (iii) epoxy.

14. The component carrier according to claim 11 , wherein the transparent material comprises at least one of (i) at least one reflecting surface which is configured to diverge a light beam, and (ii) at least one optical lens which is configured to change a focus of a light beam.

15. A method of manufacturing a component carrier, the method comprising:
forming a stack of a plurality of electrically conductive layer structures and/or electrically insulating layer structures;
embedding an optical component in the stack; and
subsequently removing material of the stack to thereby expose at least a portion of a side wall of the optical component with regard to an environment of the component carrier, wherein removing material of the stack comprises forming an access recess in the stack, the access recess extending from a lateral side wall of the stack to the side wall of the optical component, the access recess exposing the side wall of the optical component with regard to the environment of the component carrier.

16. The method according to claim 15 , wherein removing material of the stack further comprises performing a cutting procedure of the stack.

17. The method according to claim 16 , wherein the optical component is at least in part circumferentially covered by a transparent material.

18. The method according to claim 17 , wherein removing material of the stack further comprises:
after performing the cutting procedure,
performing a lateral polishing procedure which smoothes a side wall surface of the transparent material.

19. A component carrier, comprising:
a stack comprising a plurality of electrically conductive layer structures and/or electrically insulating layer structures;
an optical component embedded in the stack;
wherein at least a portion of a side wall of the optical component is exposed;
an access recess formed in the stack, wherein the access recess extends from a lateral side wall of the stack to the side wall of the optical component and the access recess exposes the side wall of the optical component; and
a further component being inserted in the access recess,

wherein the further component is configured as an optical fiber.

Assignees

• At&Saustria Tech & Systemtechnik Ag
• At & S Austria Tech & Systemtechnik Ag

Inventors

• Schuster Bettina
• De Sousa Jonathan Silvano
• Zluc Andreas
• Leitgeb Markus
• Stahr Hannes

Classifications

• H10W74/01

  Manufacture or treatment · CPC title

• H10W74/131 Primary

  the semiconductor body being only partially enclosed · CPC title

• H10W74/114 Primary

  by a substrate and the encapsulations · CPC title

• H10H20/8506

  Containers · CPC title

• H10F77/50

  Encapsulations or containers (for photovoltaic modules H10F19/80) · CPC title