Light-emitting substrate and method of manufacturing the same, backlight module and display apparatus

US12422712B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12422712-B2
Application numberUS-202218264451-A
CountryUS
Kind codeB2
Filing dateMay 31, 2022
Priority dateMay 31, 2022
Publication dateSep 23, 2025
Grant dateSep 23, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A light-emitting substrate includes a substrate, and a plurality of light-emitting devices and a reflective layer that are disposed on a side of the substrate. The reflective layer has a plurality of openings, and the plurality of openings include a plurality of first openings; a light-emitting device is located in a first opening. A surface of the reflective layer away from the substrate has a plurality of protruding structures.

First claim

Opening claim text (preview).

What is claimed is: 1. A light-emitting substrate, comprising: a substrate; a plurality of light-emitting devices and a reflective layer that are disposed on a side of the substrate; and a plurality of driving chips disposed on a side, the same as the side where the plurality of light-emitting devices are located, of the substrate, wherein the reflective layer has a plurality of openings, and the plurality of openings include a plurality of first openings; a light-emitting device of the plurality of light-emitting devices is located in a first opening of the plurality of first openings; a surface of the reflective layer away from the substrate has a plurality of protruding structures; a driving chip of the plurality of driving chips is electrically connected to at least one light-emitting device of the plurality of light-emitting devices, and the driving chip is configured to drive the at least one light-emitting device to emit light; and an orthographic projection of at least one driving chip of the plurality of driving chips on the substrate is located within an orthographic projection of the reflective layer on the substrate. 2. The light-emitting substrate according to claim 1 , wherein the reflective layer includes a plurality of first portions and a plurality of second portions, a first portion of the plurality of first portions is a portion, corresponding to a protruding structure of the plurality of protruding structures, of the reflective layer, and a second portion of the plurality of second portions is a portion, located between two adjacent protruding structures of the plurality of protruding structures, of the reflective layer; wherein a difference between a thickness of the first portion and a thickness of the second portion is less than or equal to 20 μm; and/or the difference between the thickness of the first portion and the thickness of the second portion is less than or equal to 20% of a thickness of the reflective layer. 3. The light-emitting substrate according to claim 1 , wherein a distance between the light-emitting device and a sidewall of the respective first opening is in a range from 0.05 mm to 0.3 mm. 4. The light-emitting substrate according to claim 1 , wherein an included angle between at least one sidewall of the first opening and the substrate is an acute angle; and/or at least one sidewall of the first opening is in a shape of a curved surface. 5. The light-emitting substrate according to claim 1 , wherein a surface of a protruding structure of the plurality of protruding structures away from the substrate is in a shape of a cambered surface. 6. The light-emitting substrate according to claim 1 , wherein the plurality of protruding structures include a plurality of first protruding structures and a plurality of second protruding structures; the plurality of first protruding structures each extend in a first direction and are arranged in rows in a second direction; the plurality of second protruding structures each extend in the first direction and are arranged in rows in the second direction; or the plurality of second protruding structures each extend in the second direction and are arranged in columns in the first direction; wherein the first direction intersects the second direction. 7. The light-emitting substrate according to claim 6 , wherein a dimension, in a direction where the plurality of first protruding structures are arranged, of a first protruding structure of the plurality of first protruding structures is greater than or equal to a dimension, in a direction where the plurality of second protruding structures are arranged, of a second protruding structure of the plurality of second protruding structures. 8. The light-emitting substrate according to claim 1 , wherein at least one edge of an orthographic projection, on the substrate, of the reflective layer includes a plurality of curved segments, and at least one curved segment of the plurality of curved segments protrudes towards a direction where an edge of the substrate is located; and/or an included angle between at least one side surface, proximate to an edge of the substrate, of the reflective layer and the substrate is an acute angle. 9. The light-emitting substrate according to claim 1 , wherein a thickness of a portion, in contact with a top surface of the at least one driving chip, of the reflective layer is less than or equal to a thickness of a portion, in contact with the substrate, of the reflective layer. 10. The light-emitting substrate according to claim 1 , wherein at least one side surface of the at least one driving chip and the reflective layer are provided with a gap therebetween. 11. The light-emitting substrate according to claim 1 , wherein the reflective layer is discontinuous at at least one side surface of the at least one driving chip. 12. A method of manufacturing a light-emitting substrate, comprising: providing a substrate; fixing a plurality of light-emitting devices on the substrate; and forming a reflective layer on the substrate by three-dimensional (3D) printing; wherein the reflective layer has a plurality of openings, and the plurality of openings include a plurality of first openings; a light-emitting device of the plurality of light-emitting devices is located in a first opening of the plurality of first openings; a surface of the reflective layer away from the substrate has a plurality of protruding structures; wherein the plurality of light-emitting devices are arranged in a plurality of columns in a first direction, and are arranged in a plurality of rows in a second direction; the first direction intersects the second direction; the substrate has a plurality of first printing regions, a plurality of second printing regions and a plurality of third printing regions each extending in the first direction; the plurality of second printing regions and the plurality of third printing regions are alternately arranged, and any adjacent second printing region and third printing region are provided a first printing region therebetween; a row of light-emitting devices of the plurality of light-emitting devices are located in a second printing region of the plurality of second printing regions; and forming the reflective layer on the substrate by 3D printing includes: forming, by straight line printing, first reflective patterns in two first printing regions that are on two opposite sides of each row of light-emitting devices; forming, by dashed line printing, a second reflective pattern between any two adjacent light-emitting devices in each second printing region; wherein first reflective patterns and second reflective patterns that are around each light-emitting device enclose a respective first opening of the plurality of first openings; an included angle between at least one sidewall of the first opening and the substrate is an acute angle, and/or at least one sidewall of the first opening is a curved surface; and forming third reflective patterns in the third printing regions by straight line printing. 13. The method according to claim 12 , wherein before forming the reflective layer on the substrate by 3D printing, the method further comprises: fixing a plurality of driving chips on the substrate; wherein the plurality of driving chips are arranged in columns in the first direction, and are arranged in rows in the second direction; a row of driving chips of the plurality of driving chips are located in another second printing region of the plurality of second printing regions; the plurality of openings further include a plurality of second openings; forming the reflective layer on the sub

Assignees

Inventors

Classifications

  • Package configurations · CPC title

  • Interconnections (of active-matrix LED displays H10H29/49) · CPC title

  • comprising multiple light-emitting semiconductor devices · CPC title

  • Reflecting means · CPC title

  • including means for improving the brightness uniformity · CPC title

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What does patent US12422712B2 cover?
A light-emitting substrate includes a substrate, and a plurality of light-emitting devices and a reflective layer that are disposed on a side of the substrate. The reflective layer has a plurality of openings, and the plurality of openings include a plurality of first openings; a light-emitting device is located in a first opening. A surface of the reflective layer away from the substrate has a…
Who is the assignee on this patent?
Hefei Boe Ruisheng Tech Co Ltd, Boe Technology Group Co Ltd
What technology area does this patent fall under?
Primary CPC classification G02F1/133605. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Sep 23 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).