Pattern measurement device

Patent metadata

Field	Value
Publication number	US-12422386-B2
Application number	US-202018034322-A
Country	US
Kind code	B2
Filing date	Dec 16, 2020
Priority date	Dec 16, 2020
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

The purpose of the present disclosure is to provide a pattern measurement device that can accurately measure positional deviation between a center of gravity of a top surface of a pattern and a center of gravity of a bottom surface of the pattern, even when an incidence angle of a charged particle beam varies for each irradiation position of the charged particle beam. The pattern measurement device according to the present disclosure acquires an angular deviation amount corresponding to coordinates in a visual field of a pattern in accordance with a relationship between the coordinates in the visual field of the pattern and an angular deviation amount of the charged particle beam, and acquires a positional deviation amount corresponding to the coordinates in the visual field of the pattern in accordance with a relationship between the angular deviation amount and the center of gravity positional deviation amount (see FIG. 3 c ).

First claim

The invention claimed is:

1. A pattern measurement device that measures a size of a pattern formed on a sample, the device comprising:
a computer system that calculates a positional deviation amount between a center of gravity of a top surface of the pattern and a center of gravity of a bottom surface of the pattern by using an observation image obtained by irradiating the sample with a charged particle beam; and
a storage unit that stores relationship data describing a first relationship between an angular deviation amount from an optic axis of an irradiation angle of the charged particle beam and the positional deviation amount, characterized in that
the relationship data further describes a second relationship between coordinates in a visual field of the pattern and the angular deviation amount,
the computer system refers to the relationship data using the coordinates in the visual field of the pattern to acquire the angular deviation amount corresponding to the coordinates in the visual field of the pattern,
the computer system refers to the relationship data using the acquired angular deviation amount to acquire the positional deviation amount corresponding to the coordinates in the visual field of the pattern, and
the computer system uses the acquired positional deviation amount to correct a measurement positional deviation between the center of gravity of the top surface of the pattern and the center of gravity of the bottom surface of the pattern.

2. The pattern measurement device according to claim 1 , wherein
the second relationship describes a relationship between coordinates of the center of gravity of the top surface of the pattern in a first direction and the angular deviation amount in the first direction,
the second relationship also describes a relationship between coordinates of the center of gravity of the top surface of the pattern in a second direction perpendicular to the first direction and the angular deviation amount in the second direction, and
the computer system refers to the second relationship using the coordinates of the pattern in the visual field in the first direction and the second direction to acquire the angular deviation amounts in the first direction and the second direction, respectively.

3. The pattern measurement device according to claim 2 , wherein
the second relationship further describes a relationship between the coordinates of the center of gravity of the top surface of the pattern in the second direction and the angular deviation amount in the first direction,
the second relationship also describes a relationship between the coordinates in the center of gravity of the top surface of the pattern in the first direction and the angular deviation amount in the second direction, and
the computer system refers to the second relationship by using the coordinates in the visual field of the pattern in the first direction and the second direction to acquire the angular deviation amounts of the first direction and the second direction, respectively.

4. The pattern measurement device according to claim 3 , wherein
the second relationship describes a sum of
the angular deviation amount in the first direction, which is caused by a deviation amount in the first direction from center coordinates of an observation visual field to the center of gravity of the top surface of the pattern, and
the angular deviation amount in the first direction, which is caused by a deviation amount in the second direction from the center coordinates of the observation visual field to the center of gravity of the top surface of the pattern,

as the angular deviation amount in the first direction, and
the second relationship describes a sum of
the angular deviation amount in the second direction, which is caused by the deviation amount in the second direction from the center coordinates of the observation visual field to the center of gravity of the top surface of the pattern, and
the angular deviation amount in the second direction, which is caused by the deviation amount in the first direction from the center coordinates of the observation visual field to the center of gravity of the top surface of the pattern,

as the angular deviation amount in the second direction.

5. The pattern measurement device according to claim 2 , wherein
the first relationship describes a relationship between the angular deviation amount in the first direction and the positional deviation amount in the first direction,
the first relationship also describes a relationship between the angular deviation amount in the second direction and the positional deviation amount in the second direction, and
the computer system refers to the first relationship by using the angular deviation amount in the first direction and the second direction to acquire the positional deviation amount in the first direction and the second direction.

6. The pattern measurement device according to claim 2 , wherein the computer system performs
a step of acquiring the observation image of the sample of which a shape and a size are known for each center coordinate, while changing center coordinates of the observation visual field,
a step of calculating a deviation amount between the center of gravity of the top surface and the center of gravity of the bottom surface by using the observation image to calculate the angular deviation amount for each set of the center coordinates, and
a step of calculating the second relationship by using the angular deviation amount for each center coordinate.

7. The pattern measurement device according to claim 6 , wherein the computer system
moves a stage on which the sample is placed to change the center coordinates of the observation visual field, or
changes an irradiation position of the charged particle beam to change the center coordinates of the observation visual field.

8. The pattern measurement device according to claim 1 , wherein the computer system performs
a step of acquiring an observation image of a pattern of a wafer to be measured for each inclination angle while changing an inclination angle of the charged particle beam,
a step of calculating a deviation amount between the center of gravity of the top surface and the center of gravity of the bottom surface by using the observation image to calculate the positional deviation amount for each inclination angle, and
a step of calculating the first relationship by using the positional deviation amount for each inclination angle.

9. The pattern measurement device according to claim 1 , wherein the computer system outputs at least any of
the positional deviation amount for each pattern,
a correction amount in the correction for each pattern, and
an average value of the correction amount for each type of the pattern.

10. The pattern measurement device according to claim 1 , wherein
the relationship data describes the angular deviation amount for each lattice point in the visual field, and
the computer system refers to the relationship data to acquire the angular deviation amount for each lattice point.

11. The pattern measurement device according to claim 10 , wherein the computer system calculates the angular deviation amounts in intermediate coordinates surrounded by four lattice points by
proportionally allocating the angular deviation amounts at the four lattice points in accordance with distances between the intermediate coordinates and the four lattice points.

12. The pattern measurement device according to claim 1 , wherein
the relationship data describes the first relationship and the second relationship for each optical condition of the charged particle beam device

Assignees

• Hitachi High Tech Corp

Inventors

• Zhang Long
• Yamamoto Takuma

Classifications

• G01N2223/633

  thickness, density, surface weight (unit area) · CPC title

• G01N2223/6116

  semiconductor wafer · CPC title

• G01N2223/306

  computer control · CPC title

• G01N2223/303

  calibrating, standardising · CPC title

• G01N23/225

  using electron or ion · CPC title