Apparatuses, systems, and methods for sample testing

Patent metadata

Field	Value
Publication number	US-12422360-B2
Application number	US-202117447994-A
Country	US
Kind code	B2
Filing date	Sep 17, 2021
Priority date	May 7, 2020
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

Methods, apparatuses, and systems associated with a sample testing device are provided. For example, an example sample testing device may include a substrate layer defining a bottom surface of the sample testing device, as well as a waveguide disposed on the substrate layer and includes at least one reference channel and at least one sample channel.

First claim

The invention claimed is:

1. A sample sensing device comprising:
a waveguide holder component, wherein a first surface of the waveguide holder component comprises at least one alignment feature;
a waveguide component comprising at least one etched edge; and
wherein the at least one alignment feature comprises at least one protrusion on the first surface of the waveguide holder component, wherein the at least one protrusion is configured to align the waveguide component to allow media to flow through a plurality of flow channels within the waveguide component, wherein, when in an alignment arrangement, the at least one etched edge of the waveguide component is configured to be in contact with the at least one protrusion of the at least one alignment feature of the waveguide holder component.

2. The sample sensing device of claim 1 , wherein the waveguide holder component comprises:
a holder cover element; and
a fluid gasket element secured to the holder cover element, wherein the fluid gasket element is positioned between the holder cover element and the waveguide component.

3. The sample sensing device of claim 2 , wherein the holder cover element comprises a plurality of input openings on a top surface of the holder cover element, wherein the fluid gasket element comprises a plurality of input channels protruding from a top surface of the fluid gasket element.

4. The sample sensing device of claim 1 , wherein the sample sensing device further comprises:
a thermal pad component disposed on a bottom surface of the waveguide component.

5. The sample sensing device of claim 1 , wherein the waveguide component comprises:
a plurality of optical channels within the waveguide component, wherein each of the plurality of optical channels defines an optical path.

6. The sample sensing device of claim 5 , wherein the waveguide component comprises:
an input edge comprising a plurality of input openings, wherein each of the plurality of input openings corresponds to one of the plurality of optical channels.

7. The sample sensing device of claim 6 , wherein the input edge is configured to receive light.

8. The sample sensing device of claim 6 , wherein each of the plurality of input openings is configured to receive light.

9. The sample sensing device of claim 8 , wherein each of the plurality of optical channels is configured to guide the light from a corresponding input opening through a corresponding optical channel.

10. The sample sensing device of claim 6 , wherein each of the plurality of optical channels comprises a curved portion and a straight portion.

11. The sample sensing device of claim 1 , wherein the waveguide component comprises:
a substrate layer;
an intermediate layer attached on the substrate layer; and
a waveguide layer attached on the intermediate layer.

12. The sample sensing device of claim 11 , wherein a first edge of the waveguide layer comprises an input opening, wherein a second edge of the waveguide layer comprises an output opening.

13. The sample sensing device of claim 12 , wherein the first edge of the waveguide layer comprises a recessed optical edge.

14. The sample sensing device of claim 12 , wherein the second edge of the waveguide layer comprises a recessed optical edge.

15. The sample sensing device of claim 12 , further comprising:
a light source component coupled to the first edge of the waveguide layer.

16. The sample sensing device of claim 11 , further comprising:
a cover glass component attached to the waveguide component with on-chip fluidics.

17. The sample sensing device of claim 16 , further comprising:
an on-chip fluidics layer attached to a top surface of the waveguide layer.

18. The sample sensing device of claim 16 , further comprising:
an adhesive layer attached on a top surface of the waveguide component with on-chip fluidics.

19. The sample sensing device of claim 18 , further comprising:
a cover glass layer attached on a top surface of the adhesive layer.

Assignees

• Hand Held Prod Inc

Inventors

• Feng Chen
• Shafai Moin
• Venkatarayalu Suresh

Classifications

• C23C2/51

  Computer-controlled implementation · CPC title

• C02F2209/006

  comprising a software program or a logic diagram · CPC title

• B29C2037/903

  by means of a computer · CPC title

• B23D63/008

  using computer control means · CPC title

• B01D2313/701

  comprising a software program or a logic diagram · CPC title