Sensor module

US12422284B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12422284-B2
Application numberUS-202118039199-A
CountryUS
Kind codeB2
Filing dateNov 10, 2021
Priority dateDec 4, 2020
Publication dateSep 23, 2025
Grant dateSep 23, 2025

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

[Object] To provide a sensor module and a method for producing the sensor module, the sensor module making it possible to improve a degree of freedom in design, to facilitate the operation, and to reduce costs by reducing the number of components. [Solving Means] A sensor module according to an embodiment of the present technology includes a first member, a second member, a third member, and a sensor element. The first member is made of a synthetic resin material that has absorptive properties with respect to first laser light. The second member is made of a synthetic resin material that has transmissive properties with respect to second laser light of a wavelength that is different from a wavelength of the first laser light. The third member is made of a synthetic resin material that has transmissive properties with respect to the first laser light and has absorptive properties with respect to the second laser light, the third member including a first surface and a second surface, the first surface including a first welding portion that is welded to the first member, the second surface including a second welding portion that is welded to the second member.

First claim

Opening claim text (preview).

The invention claimed is: 1. A sensor module, comprising: a first member that is made of a synthetic resin material that has absorptive properties with respect to first laser light; a second member that is made of a synthetic resin material that has transmissive properties with respect to second laser light of a wavelength that is different from a wavelength of the first laser light; a third member that is made of a synthetic resin material that has transmissive properties with respect to the first laser light and has absorptive properties with respect to the second laser light, the third member including a first surface and a second surface, the first surface including a first welding portion that is welded to the first member, the second surface including a second welding portion that is welded to the second member; and a sensor element that is accommodated between the first member and the second member. 2. The sensor module according to claim 1 , wherein the first welding portion is provided along a peripheral edge of the first surface, and the second welding portion is provided along a peripheral edge of the second surface. 3. The sensor module according to claim 2 , wherein the first welding portion is continuously provided along the peripheral edge of the first surface, or the second welding portion is continuously provided along the peripheral edge of the second surface. 4. The sensor module according to claim 2 , wherein the first welding portion is partially provided along the peripheral edge of the first surface, or the second welding portion is partially provided along the peripheral edge of the second surface. 5. The sensor module according to claim 1 , wherein the first member is a front case that accommodates therein the sensor element, the second member is a harness that includes a cable that is electrically connected to the sensor element, and the third member is a rear case that is connected between the front case and the harness. 6. The sensor module according to claim 1 , wherein the first member is a front case that accommodates therein the sensor element, the second member is a bracket used to fix the front case to a vehicle body, and the third member is a rear case that is connected between the front case and the bracket. 7. The sensor module according to claim 1 , wherein the third member is a front case that accommodates therein the sensor element, the front case including an opening at an end of the front case, and a through hole that is situated opposite to the end, the first member is a rear case that is joined to the opening, and the second member is a translucent protection cover that covers the through hole. 8. The sensor module according to claim 1 , wherein the sensor element is an imaging device. 9. The sensor module according to claim 1 , wherein the sensor element is a ranging sensor. 10. The sensor module according to claim 1 , wherein the first laser light is laser light of a wavelength in an infrared band, and the second laser light is laser light of a wavelength in a green band.

Assignees

Inventors

Classifications

  • at least passing through one of the parts to be joined, i.e. laser transmission welding · CPC title

  • Measuring equipment · CPC title

  • Optical viewing arrangements; Real-time viewing arrangements for drivers or passengers using optical image capturing systems, e.g. cameras or video systems specially adapted for use in or on vehicles · CPC title

  • making use of an absorber or impact modifier · CPC title

  • Housings or casings incorporating or embedding electric or electronic elements · CPC title

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Frequently asked questions

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What does patent US12422284B2 cover?
[Object] To provide a sensor module and a method for producing the sensor module, the sensor module making it possible to improve a degree of freedom in design, to facilitate the operation, and to reduce costs by reducing the number of components. [Solving Means] A sensor module according to an embodiment of the present technology includes a first member, a second member, a third member, …
Who is the assignee on this patent?
Sony Semiconductor Solutions Corp
What technology area does this patent fall under?
Primary CPC classification B29C65/1635. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 23 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).