Heat pump

Patent metadata

Field	Value
Publication number	US-12422170-B2
Application number	US-202117802055-A
Country	US
Kind code	B2
Filing date	Feb 24, 2021
Priority date	Feb 25, 2020
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

A heat pump is provided that includes a first pipe in which a first refrigerant flows; a second pipe disposed at a side of the first pipe and in which a second refrigerant flows; a first heat exchanger connected with the first pipe and the second pipe and in which the first refrigerant exchanges heat with the second refrigerant; a boiler connected with the first pipe and in which the first refrigerant flows; a compressor connected with the second pipe and that compresses the second refrigerant; a second heat exchanger connected with the second pipe and in which the second refrigerant exchanges heat with outdoor air; a bypass pipe branched from first pipe and configured to exchange heat with the second heat exchanger; and a three-way valve that directs the first refrigerant to pass through the bypass pipe. When the outdoor heat exchanger operates as an evaporator, frost formation thereon may be prevented.

First claim

The invention claimed is:

1. A heat pump, comprising:
a first pipe in which a first refrigerant flows;
a second pipe disposed at a side of the first pipe and in which a second refrigerant flows;
a first heat exchanger connected with the first pipe and the second pipe and in which the first refrigerant exchanges heat with the second refrigerant;
a boiler connected with the first pipe and in which the first refrigerant flows;
a compressor connected with the second pipe and that compresses the second refrigerant;
a second heat exchanger connected with the second pipe and in which the second refrigerant exchanges heat with an outdoor air;
a bypass pipe branched from the second pipe and spaced apart from a first side of the second heat exchanger to perform exchange heat with the second heat exchanger;
a blowing fan disposed on a second side of the second heat exchanger, opposite to the first side, to form an air flow through the second heat exchanger; and
a three-way valve that directs the second refrigerant to pass through the bypass pipe, wherein a first flow path of the three-way valve is connected with the second pipe, a second flow path of the three-way valve is connected with the second heat exchanger, and a third flow path of the three-way valve joins to the second flow path via the bypass pipe, wherein the heat pump operates in a heating mode, in which the second refrigerant discharged from the compressor flows to the first heat exchanger, and in a cooling mode, in which the second refrigerant discharged from the compressor flows to the second heat exchanger, and wherein in the heating mode, the second refrigerant discharged from the first heat exchanger is sent to the bypass pipe.

2. The heat pump according to claim 1 , further comprising:
an accumulator disposed between the compressor and the second heat exchanger.

3. The heat pump according to claim 2 , further comprising:
an expansion valve disposed between the second pipe and the second heat exchanger.

4. The heat pump according to claim 3 , further comprising:
a four-way valve disposed between the compressor, the first heat exchanger, the accumulator, and the second heat exchanger and configured to change a flow direction of the second refrigerant between the compressor, the first heat exchanger, the accumulator, and the second heat exchanger.

5. The heat pump according to claim 3 , wherein the first heat exchanger comprises a plate heat exchanger.

6. The heat pump according to claim 5 , wherein the first refrigerant comprises water.

7. The heat pump according to claim 5 , wherein the second refrigerant comprises either R32 or R290, or a mixture thereof.

8. The heat pump according to claim 5 , further comprising:
a muffler disposed between the four-way valve and the compressor.

Assignees

• Lg Electronics Inc

Inventors

• Lee Youngmin
• Ryu Jihyeong
• Cho Eunjun
• Kim Minsoo

Classifications

• F25B2500/09

  Improving heat transfers · CPC title

• F25B41/26

  of fluid flow reversing valves · CPC title

• F25B41/31

  Expansion valves · CPC title

• F24H4/00

  Fluid heaters characterised by the use of heat pumps · CPC title

• F28D9/0037

  the conduits for the other heat-exchange medium also being formed by paired plates touching each other (F28D9/0043 takes precedence) · CPC title