Integral features providing improved flexible printed circuit folding and connection capability

Patent metadata

Field	Value
Publication number	US-12418979-B2
Application number	US-202218084906-A
Country	US
Kind code	B2
Filing date	Dec 20, 2022
Priority date	Dec 14, 2020
Publication date	Sep 16, 2025
Grant date	Sep 16, 2025

Abstract

A flexible circuit (FC) and a method of forming the FC each include providing a first dielectric layer, applying a plurality of conductive circuit traces that are substantially parallel to each other to the first dielectric layer, providing a second dielectric layer atop the first dielectric layer and the plurality of conductive circuit traces to form a third dielectric layer having the plurality of conductive traces disposed therein and being configured to support and insulate the plurality of conductive traces, and forming a plurality of channels extending at least partially through a thickness of the third dielectric layer, wherein the plurality of channels are arranged between the plurality of conductive circuit traces and substantially parallel thereto and are configured to provide increased flexibility of the FC.

First claim

What is claimed is:

1. A flexible circuit (FC) comprising:
a first portion;
a second portion connected to and extending from the first portion at a junction;
a third portion connected to and extending from the first and second portions at the junction, the first, second, and third portions defining a branching configuration, and the first, second, and third portions each including:
a plurality of conductive circuit traces that are substantially parallel to each other, the junction extending along a length of the FC parallel to at least one conductive circuit trace of the plurality of conductive circuit traces of the first portion; and
a dielectric layer having been laser-processed such that the dielectric layer defines a structure that supports and insulates the plurality of conductive circuit traces therewithin; and

at least one laser-etched identifier disposed on at least one of the first portion, the second portion, or the third portion, the at least one laser-etched identifier defining at least one of (i) a type of the FC or (ii) an installation location for the FC.

2. The FC of claim 1 , wherein the at least one laser-etched identifier defines both (i) the type of the FC and (ii) the installation location for the FC.

3. The FC of claim 1 , wherein the defined structure is an outer shape of the FC.

4. The FC of claim 1 , further comprising at least one channel extending at least partially through the dielectric layer.

5. The FC of claim 1 , wherein the at least one laser-etched identifier is a scannable code that is identifiable by a robotic installer.

6. The FC of claim 5 , wherein the scannable code is one of a barcode and a quick response (QR) code.

7. The FC of claim 1 , wherein the at least one laser-etched identifier is a numerical code, an alphabetical code, or an alphanumeric code.

8. The FC of claim 7 , wherein the numerical, alphabetical, or alphanumeric code is identified by a robotic installer or a human installer.

9. The FC of claim 1 , wherein the junction extends parallel to the plurality of conductive circuit traces.

10. The FC of claim 1 , wherein the third portion is configured to fold relative to at least one of the first portion or the second portion.

11. The FC of claim 1 , further comprising a fourth portion,
wherein a first end of the third portion is connected to the junction, and
wherein the fourth portion extends from a second end of the third portion opposite the first end.

12. The FC of claim 11 , wherein the fourth portion is configured to fold relative to the third portion.

13. A method of forming a flexible circuit (FC), the method comprising:
providing a first portion;
providing a second portion connected to and extending from the first portion at a junction;
providing a third portion connected to and extending from the first and second portions at the junction, the first, second, third portions defining a branching configuration;
for each of the first, second, and third portions:
providing a plurality of conductive circuit traces that are substantially parallel to each other, the junction extending along a length of the FC parallel to at least one conductive circuit trace of the plurality of conductive circuit traces of the first portion; and
providing a dielectric layer having been laser-processed such that the dielectric layer defines a structure that supports and insulates the plurality of conductive circuit traces therewithin; and

providing at least one laser-etched identifier on at least one of the first portion, the second portion, or the third portion, the at least one laser-etched identifier defining at least one of (i) a type of the FC or (ii) an installation location for the FC.

14. The method of claim 13 , wherein the at least one laser-etched identifier defines both (i) the type of the FC and (ii) the installation location for the FC.

15. The method of claim 13 , wherein the defined structure is an outer shape of the FC.

16. The method of claim 13 , further comprising providing at least one channel extending at least partially through the dielectric layer.

17. The method of claim 13 , wherein the at least one laser-etched identifier is a scannable code that is identifiable by a robotic installer.

18. The method of claim 17 , wherein the scannable code is one of a barcode and a quick response (QR) code.

19. The method of claim 13 , wherein the at least one laser-etched identifier is a numerical code, an alphabetical code, or an alphanumeric code.

20. The method of claim 19 , wherein the numerical, alphabetical, or alphanumeric code is identified by a robotic installer or a human installer.

Assignees

• Aptiv Tech Ltd
• Aptiv Technologies AG

Inventors

• Peterson David R
• Sudik Jr Joseph
• Siegfried David G
• Bilas Jared

Classifications

• H05K1/0296

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title

• H05K2201/09936

  Marks, inscriptions, etc. for information · CPC title

• H05K2203/107

  Using laser light · CPC title

• H05K2201/09236

  Parallel layout · CPC title

• H05K3/107

  by filling grooves in the support with conductive material (H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence) · CPC title