Flexible connector with permeability shield to reduce antenna loss

Patent metadata

Field	Value
Publication number	US-12418106-B2
Application number	US-202318525735-A
Country	US
Kind code	B2
Filing date	Nov 30, 2023
Priority date	Nov 27, 2023
Publication date	Sep 16, 2025
Grant date	Sep 16, 2025

Abstract

This document describes apparatuses and techniques for providing a flexible connector between a secondary circuit board and a main logic board with a permeability shield to increase impedance of the flexible connector to reduce antenna loss from an antenna via the flexible connector to the main logic board. For example, an apparatus includes a secondary circuit board supporting one or more control pads and an antenna. A flexible connector includes a plurality of conductive traces configured to electrically couple the one or more control pads of the secondary circuit board to a coupling on a main logic board. A permeability shield is configured to be disposed along one or more portions of the flexible connector. The permeability shield is configured to increase impedance of the flexible connector to reduce antenna loss of the antenna via the control pads and the flexible connector to the main logic board.

First claim

What is claimed is:

1. An apparatus comprising:
a secondary circuit board supporting one or more control pads and an antenna;
a flexible connector including a plurality of conductive traces configured to electrically couple the one or more control pads of the secondary circuit board to a coupling on a main logic board; and
a permeability shield configured to be disposed along one or more portions of the flexible connector, the permeability shield being configured to increase impedance of the flexible connector to reduce antenna loss of the antenna via the control pads and the flexible connector to the main logic board.

2. The apparatus of claim 1 , wherein the permeability shield includes an electromagnetic compatibility (EMC) suppression film.

3. The apparatus of claim 2 , wherein the EMC suppression film includes a polyimide film supporting or incorporating a high permeability material.

4. The apparatus of claim 3 , wherein the EMC suppression film includes a self-adhesive EMC suppression tape.

5. The apparatus of claim 1 , wherein the flexible connector includes a flat body having a first surface and an opposite second surface, and the permeability shield is disposed on one or both of the first surface and the second surface.

6. The apparatus of claim 1 , wherein the secondary circuit board and the main logic board are received within an electronic device and the one or more portions of the flexible connector where the permeability shield is disposed are selected to avoid sections of the flexible connector where the flexible connector is configured to directly impinge upon surfaces of the main logic board or a housing of the electronic device.

7. The apparatus of claim 1 , wherein the antenna includes a Bluetooth® antenna or a Wi-Fi™ antenna.

Assignees

• Google Llc

Inventors

• Ding Yao
• Qi Qi

Classifications

• H05K1/0216 Primary

  Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215) · CPC title

• H05K2201/0715

  provided by an outer layer of PCB · CPC title

• H05K2201/10098

  Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas · CPC title

• H01Q1/50

  Structural association of antennas with earthing switches, lead-in devices or lightning protectors · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title