Antenna package and image display device including the same

Patent metadata

Field	Value
Publication number	US-12418094-B2
Application number	US-202318125271-A
Country	US
Kind code	B2
Filing date	Mar 23, 2023
Priority date	Sep 29, 2020
Publication date	Sep 16, 2025
Grant date	Sep 16, 2025

Abstract

An antenna package includes a first antenna device including a first antenna unit, a second antenna device disposed at a level different from that of the first antenna device, the second antenna device including a second antenna unit that has a radiation direction different from that of the first antenna unit, a first circuit board electrically connected to the first antenna unit, a second circuit board electrically connected to the second antenna unit, and a third circuit board electrically and independently connected to the first circuit board and the second circuit board, the third circuit board having at least one antenna driving integrated circuit (IC) chip mounted thereon.

First claim

What is claimed is:

1. An antenna package comprising:
a first antenna device comprising a first antenna unit;
a second antenna device disposed at a level different from a level of the first antenna device, the second antenna device comprising a second antenna unit having a radiation direction different from a radiation direction of the first antenna unit;
a first circuit board electrically connected to the first antenna unit;
a second circuit board electrically connected to the second antenna unit; and
a third circuit board electrically and independently connected to the first circuit board and the second circuit board, the third circuit board having at least one antenna driving integrated circuit (IC) chip mounted thereon,
wherein the antenna driving IC chip comprises a first antenna driving IC chip and a second antenna driving IC chip which are separately disposed on the third circuit board, and
the first antenna driving IC chip and the second antenna driving IC chip are coupled to the first circuit board and the second circuit board, respectively.

2. The antenna package of claim 1 , wherein the first antenna unit comprises a first radiator radiating in a vertical direction with respect to a top surface of the third circuit board.

3. The antenna package of claim 2 , wherein the second antenna unit comprises a second radiator radiating in a horizontal direction with respect to the top surface of the third circuit board.

4. The antenna package of claim 3 , wherein the first radiator has a mesh structure, and the second radiator has a solid structure.

5. The antenna package of claim 2 , wherein the second antenna unit comprises a second radiator radiating in a direction perpendicular to the top surface of the third circuit board and opposite to a radiation direction of the first radiator.

6. The antenna package of claim 1 , further comprising:
a first connector disposed on the first circuit board and electrically connected to the first antenna unit; and
a second connector disposed on the second circuit board and electrically connected to the second antenna unit.

7. The antenna package of claim 6 , further comprising:
a third connector disposed on the third circuit board and coupled to the first connector to electrically connect the first antenna unit and the first antenna driving IC chip with each other; and
a fourth connector disposed on the third circuit board and coupled to the second connector to electrically connect the second antenna unit and the second antenna driving IC chip with each other.

8. The antenna package of claim 1 , wherein the first circuit board and the second circuit board are flexible printed circuit boards (FPCBs), and the third circuit board is a rigid printed circuit board.

9. The antenna package of claim 1 , wherein the first antenna device further comprises a first dielectric layer on which the first antenna unit is disposed, and the second antenna device further comprises a second dielectric layer on which the second antenna unit is disposed.

10. The antenna package of claim 9 , wherein the first circuit board is integral with the first dielectric layer, and the second circuit board is integral with the second dielectric layer.

11. The antenna package of claim 1 , further comprising a circuit device or control device mounted on the third circuit board.

12. An image display device comprising:
a display panel; and
an antenna package of claim 1 combined with the display panel.

13. The image display device of claim 12 , wherein the first antenna unit comprises a first radiator radiating in an upward direction from a top surface of the display panel; and
the second antenna unit comprises a second radiator radiating in a lateral side direction of the display panel or in a downward direction from a bottom surface of the display panel.

14. The image display device of claim 13 , wherein the third circuit board is disposed under the display panel; and
the first circuit board is bent to extend from the top surface of the display panel along a lateral surface and the bottom surface of the display panel to be electrically connected to the third circuit board.

15. The image display device of claim 13 , wherein the second circuit board is bent to extend from the lateral surface of the display panel to the bottom surface of the display panel to be electrically connected to the third circuit board.

Assignees

• Dongwoo Fine Chem Co Ltd

Inventors

• Kim Young Ju
• Park Dong Pil
• Choi Byung Jin
• Kim Na Yeon
• Ryu Han Sub

Classifications

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H05K2201/05

  Flexible printed circuits [FPCs] · CPC title

• H05K3/4691

  Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers · CPC title

• H05K1/0216

  Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215) · CPC title

• H04M1/0277

  for a printed circuit board assembly · CPC title