Light emitting diode device and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-12418008-B2
Application number	US-202318233190-A
Country	US
Kind code	B2
Filing date	Aug 11, 2023
Priority date	Dec 6, 2017
Publication date	Sep 16, 2025
Grant date	Sep 16, 2025

Abstract

A light emitting diode device includes a thin film transistor substrate having a plurality of light emitting areas, a first diode electrode and a second diode electrode on the thin film transistor substrate, a first passivation pattern between the first diode electrode and the second diode electrode, a plurality of micro light emitting diodes on the first passivation pattern, a first bridge pattern on the micro light emitting diodes and electrically connecting the first diode electrode to the micro light emitting diodes, and a second bridge pattern on the first bridge pattern and electrically connecting the second diode electrode to the micro light emitting diodes, wherein each sidewall of each of the micro light emitting diodes and each sidewall of the first passivation pattern form a same plane.

First claim

What is claimed is:

1. A light emitting diode device comprising:
a substrate;
a first electrode disposed on a surface of the substrate;
a second electrode disposed on the substrate and spaced apart from the first electrode;
a first passivation layer disposed between the first electrode and the second electrode;
a light emitting element disposed on the first passivation layer;
a second passivation layer disposed on the light emitting element,
a first bridge electrode disposed on the first electrode and electrically connecting the first electrode to the light emitting element; and
a second bridge electrode disposed on the second electrode and electrically connecting the second electrode to the light emitting element,
wherein the light emitting element comprises a first surface facing the substrate a second surface opposite to the first surface, a first side surface disposed between the first surface and the second surface, and a second side surface disposed between the first surface and the second surface,
wherein the second side surface of the light emitting element is opposite to the first side surface of the light emitting element along a direction parallel to the surface of the substrate,
wherein the first bridge electrode contacts the first side surface of the light emitting element and a first side surface of the second passivation layer, and
wherein the second bridge electrode contacts the second side surface of the light emitting element and a second side surface of the second passivation layer.

2. The light emitting diode device of claim 1 , wherein the first bridge electrode contacts the first side surface of the light emitting element and a first side surface of the first passivation layer, and
wherein the second bridge electrode contacts the second side surface of the light emitting element and a second side surface of the first passivation layer.

3. The light emitting diode device of claim 2 , wherein the first side surface of the light emitting element is aligned with the first side surface of the first passivation layer on a same plane, and
wherein the second side surface of the light emitting element is aligned with the second side surface of the first passivation layer on the same plane.

4. The light emitting diode device of claim 2 , wherein a width of the second passivation layer is smaller than a length of the light emitting element, and
wherein the first side surface and the second side surface of the light emitting element do not overlap the second passivation layer.

5. The light emitting diode device of claim 4 , wherein the width of the second passivation layer is smaller than a width of the first passivation layer.

6. The light emitting diode device of claim 1 , wherein the first side surface and the second side surface of the second passivation layer do not overlap with the first electrode and the second electrode, respectively.

7. The light emitting diode device of claim 1 , further comprising: a third passivation layer disposed on the first bridge electrode,
wherein at least portion of the second bridge electrode is disposed on the third passivation layer.

8. The light emitting diode device of claim 7 , wherein an upper surface of the first bridge electrode contacts the third passivation layer, and
wherein a lower surface of the second bridge electrode contacts the third passivation layer.

9. The light emitting diode device of claim 7 , wherein at least portion of the third passivation layer is directly disposed on the second passivation layer.

10. The light emitting diode device of claim 1 , wherein the first bridge electrode surrounds a first end portion of the light emitting element, and
wherein the second bridge electrode surrounds a second end portion of the light emitting element.

11. The light emitting diode device of claim 1 , further comprising:
a first pattern disposed between the first electrode and the substrate; and
a second pattern disposed between the second electrode and the substrate,
wherein the light emitting element is disposed between the first pattern and the second pattern.

12. The light emitting diode device of claim 1 , further comprising:
a lower layer disposed between the first and second electrode and the substrate,
wherein at least portion of the first electrode and the second electrode is directly disposed on the lower layer, and
wherein at least portion of the first passivation layer is directly disposed on the lower layer.

13. The light emitting diode device of claim 12 , wherein at least portion of the first bridge electrode and the second bridge electrode is directly disposed on the lower layer.

14. The light emitting diode device of claim 1 , wherein the light emitting element comprises: a first semiconductor layer; an active layer on the first semiconductor layer; a second semiconductor layer on the active layer; and at least one insulating film covering at least an outer surface of the active layer.

15. The light emitting diode device of claim 14 , wherein the light emitting element further comprises at least one contact electrode layer on end of the first semiconductor layer or the second semiconductor layer, and
wherein at least portion of a side surface of the contact electrode layer is exposed by the at least one insulating film.

16. A light emitting diode device comprising:
a first electrode extending in a first direction;
a second electrode extending in the first direction and spaced apart from the first electrode in a second direction intersect with the first direction;
a first passivation layer disposed between the first electrode and the second electrode;
a plurality of light emitting elements disposed on the first passivation layer and disposed on the first electrode and the second electrode;
a second passivation layer disposed on a light emitting element of the plurality of light emitting elements,
a first bridge electrode disposed on the first electrode and extending in the first direction; and
a second bridge electrode disposed on the second electrode and extending in the first direction,
wherein the light emitting element comprises a first surface facing the first passivation layer, a second surface opposite to the first surface, a first side surface disposed between the first surface and the second surface, and a second side surface disposed between the first surface and the second surface,
wherein the second side surface of the light emitting element is opposite to the first side surface of the light emitting element along the second direction,
wherein the first bridge electrode contacts a first side surface of the light emitting element and a first side surface of the second passivation layer, and
wherein the second bridge electrode contacts a second side surface of the light emitting element and a second side surface of the second passivation layer.

17. The light emitting diode device of claim 16 , further comprising: first electrode line extending in the second direction intersect with the first direction, and
a second electrode line extending in the second direction and spaced apart from the first electrode line,
wherein the light emitting element is disposed between the first electrode line and the second electrode line.

18. The light emitting diode device of claim 17 , wherein the first electrode line is electrically connected to the first electrode, and
wherein the second electrode line is electrically connected to the second electrode.

19. The light emitting diode device of claim 16 , furt

Assignees

• Samsung Display Co Ltd

Inventors

• Bae Su Bin
• Jeong Yu Gwang
• Choi Shin Il
• Lee Joon Geol
• Kim Sang Gab

Classifications

• H10P50/246

  of Group III-V materials · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10D86/441

  Interconnections, e.g. scanning lines · CPC title

• H10D86/60

  wherein the TFTs are in active matrices · CPC title

• H10H20/0364

  of interconnections · CPC title