Integrated circuit, system for and method of forming an integrated circuit

Patent metadata

Field	Value
Publication number	US-12417332-B2
Application number	US-202418768895-A
Country	US
Kind code	B2
Filing date	Jul 10, 2024
Priority date	Nov 29, 2016
Publication date	Sep 16, 2025
Grant date	Sep 16, 2025

Abstract

An integrated circuit structure includes a first and second power rail on a first level, a first and second set of conductive structures on a second level and a first, second and third conductive structure on a third level. The first set of conductive structures is over the first power rail. The second set of conductive structures is over the second power rail. The first conductive structure overlaps a first conductive structure of the first set of conductive structures and a first conductive structure of the second set of conductive structures. The second conductive structure overlaps a second conductive structure of the first set of conductive structures and a second conductive structure of the second set of conductive structures. The third conductive structure overlaps a third conductive structure of the first set of conductive structures and a third conductive structure of the second set of conductive structures.

First claim

What is claimed is:

1. An integrated circuit structure comprising:
a first power rail extending in a first direction and being located at a first level;
a second power rail extending in the first direction and being located at the first level, the second power rail being separated from the first power rail in a second direction different from the first direction;
a first set of conductive structures extending in the second direction, over the first power rail and being located at a second level different than the first level;
a second set of conductive structures extending in the second direction, over the second power rail, being located at the second level, and being separated from the first set of conductive structures in the second direction;
a first conductive structure extending in the second direction, overlapping a first conductive structure of the first set of conductive structures and a first conductive structure of the second set of conductive structures, and being located at a third level different than the first level and the second level;
a second conductive structure extending in the second direction, overlapping a second conductive structure of the first set of conductive structures and a second conductive structure of the second set of conductive structures, being located at the third level, and being separated from the first conductive structure in the first direction; and
a third conductive structure extending in the second direction, overlapping a third conductive structure of the first set of conductive structures and a third conductive structure of the second set of conductive structures, being located at the third level, and being separated from the first conductive structure in the first direction.

2. The integrated circuit structure of claim 1 , further comprising:
a fourth conductive structure extending in the first direction, being over the first power rail and the first set of conductive structures, and being located at a fourth level different than the first level, the second level and the third level; and
a fifth conductive structure extending in the first direction, being over the second power rail and the second set of conductive structures, and being located at the fourth level, and being separated from the fourth conductive structure in the second direction.

3. The integrated circuit structure of claim 2 , further comprising:
a first set of vias coupling the first power rail and the first set of conductive structures to each other; and
a second set of vias coupling the second power rail and the second set of conductive structures to each other.

4. The integrated circuit structure of claim 3 , further comprising:
a third set of vias between the fourth conductive structure and the first set of conductive structures, and the third set of vias coupling the fourth conductive structure to the first set of conductive structures; and
a fourth set of vias between the fifth conductive structure and the second set of conductive structures, and the fourth set of vias coupling the fifth conductive structure to the second set of conductive structures.

5. The integrated circuit structure of claim 4 , further comprising:
a fifth set of vias between the first conductive structure and the fourth conductive structure, and the fifth set of vias coupling the first conductive structure to the fourth conductive structure; and
a sixth set of vias between the second conductive structure and the fifth conductive structure, and the sixth set of vias coupling the second conductive structure to the fifth conductive structure.

6. The integrated circuit structure of claim 2 , wherein
each of the first power rail and the second power rail have a first width in the second direction; and
each of the fourth conductive structure and the fifth conductive structure have a second width in the second direction different than the first width.

7. The integrated circuit structure of claim 1 , wherein
the first set of conductive structures and the second set of conductive structures are aligned in the second direction.

8. The integrated circuit structure of claim 1 , wherein
the first set of conductive structures does not overlap the second power rail; and
the second set of conductive structures does not overlap the first power rail.

9. The integrated circuit structure of claim 1 , further comprising:
a third set of conductive structures extending in the second direction, being between the first set of conductive structures and the second set of conductive structures, and being separated from the first set of conductive structures and the second set of conductive structures in the second direction.

10. The integrated circuit structure of claim 9 , wherein the third set of conductive structures comprises:
a fourth conductive structure having a first length in the second direction, the fourth conductive structure being aligned with the first conductive structure of the first set of conductive structures in the second direction; and
a fifth conductive structure having a second length in the second direction, the fifth conductive structure being aligned with the second conductive structure of the first set of conductive structures in the second direction.

11. The integrated circuit structure of claim 10 , wherein
the first length being different than the second length; or
the first length being substantially equal to the second length.

12. An integrated circuit structure comprising:
a first power rail extending in a first direction, being located at a first level, and configured to provide a first supply voltage;
a second power rail extending in the first direction, being located at the first level, and configured to provide a second supply voltage different from the first supply voltage, the second power rail being separated from the first power rail in a second direction different from the first direction;
a first set of conductive structures extending in the second direction, over the first power rail and being located at a second level different than the first level;
a second set of conductive structures extending in the second direction, over the second power rail, being located at the second level, and being separated from the first set of conductive structures in at least the first direction or the second direction, the first set of conductive structures and the second set of conductive structures are not aligned with each other in the second direction;
a first conductive structure extending in the first direction, covering a portion of the first power rail, overlapping the first set of conductive structures, and being located at a third level different than the first level and the second level; and
a second conductive structure extending in the first direction, covering a portion of the second power rail, overlapping the second set of conductive structures, being located at the third level, and being separated from the first conductive structure in the second direction.

13. The integrated circuit structure of claim 12 , wherein
each conductive structure of the first set of conductive structures is offset in the first direction from a corresponding conductive structure in the second set of conductive structures in the first direction by a first distance.

14. The integrated circuit structure of claim 12 , further comprising:
a first set of vias coupling the first power rail and the first set of conductive structures to each other; and
a second set of vias coupling the second power rail and the second set of conductive structures to each other.

15. The integrated circuit struc

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Yang Jung-Chan
• Chiang Ting-Wei
• Huang Cheng-I
• Zhuang hui-zhong
• Lu Chi-Yu
• Rusu Stefan

Classifications

• H10W20/42

  Vias, e.g. via plugs · CPC title

• H10W20/427

  Power or ground buses · CPC title

• H10W20/43

  Layouts of interconnections · CPC title

• H10W10/01

  Manufacture or treatment · CPC title

• H10W10/00

  Isolation regions in semiconductor bodies between components of integrated devices · CPC title