Method for preparing pixel define layer
US-2024134272-A1 · Apr 25, 2024 · US
US12416859B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12416859-B2 |
| Application number | US-202318450452-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 16, 2023 |
| Priority date | Aug 19, 2022 |
| Publication date | Sep 16, 2025 |
| Grant date | Sep 16, 2025 |
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An object of the present disclosure is to improve display reliability and lifetime as well as vivid colors. When there remain residues in the washing part due to incomplete removal during the developing step, it can cause dark spots or pixel off due to the residues, and thus residue-free pixels can be formed by optimizing the temperature and time for developing. Additionally, when the amount of outgas in the panel after post-baking is 15 ppm or more, it may cause a reduction in luminance and lifetime due to pixel shrinkage. Therefore, in order to minimize the amount of outgas after completion of the post-baking process, the generation of outgas in the panel state can be minimized by generating sufficient fume in the post-baking step, in addition to forming clean pixels in the developing step.
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What is claimed is: 1. A method for preparing a pixel defining layer comprising application and coating; pre-baking; exposure to light; developing; and post-baking of a photosensitive composition, comprising a cardo-based binder resin comprising Formula (1); a reactive unsaturated compound; a photoinitiator which has a molar absorption coefficient of 10,000 (L/mol·cm) or more in the region of 330 nm to 380 nm, and a 5 wt % loss occurring at 200° C. or less; and a solvent, wherein the developing step is performed at a temperature of 19° C. to 27° C. for 30 to 90 seconds; a thickness of the pixel defining layer after the developing step is 1.70 μm to 1.90 μm; and there is no residual film on the pixel after the developing step; wherein the post-baking step is performed at an oven temperature of 250° C. to 270° C. for 60 to 120 minutes; the amount of fume generated in the post-baking is 86 ppm or more; and the amount of outgas generated in the pixel defining layer is 15 ppm or less: wherein 1) R 1 and R 2 are each independently deuterium; a halogen; a C 6-30 aryl group; a C 2-30 heterocyclic group comprising at least one heteroatom among O, N, S, Si, and P; a fused ring group of a C 6-30 aliphatic ring and a C 6-30 aromatic ring; a C 1-20 alkyl group; a C 2-20 alkenyl group; a C 2-20 alkynyl group; a C 1-20 alkoxy group; a C 6-30 aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C 1-20 alkoxycarbonyl group, 2) m and n are each independently an integer of 0 to 4, 3) A 1 and A 2 are each independently Formula 2 or Formula 3: in Formula 2 and Formula 3, 3-1) * represents a binding part, 3-2) R 3 to R 6 are each independently hydrogen; deuterium; a halogen; a C 6-30 aryl group; a C 2-30 heterocyclic group comprising at least one heteroatom among O, N, S, Si, and P; a fused ring group of a C 6-30 aliphatic ring and a C 6-30 aromatic ring; a C 1-20 alkyl group; a C 2-20 alkenyl group; a C 2-20 alkynyl group; a C 1-20 alkoxy group; a C 6-30 aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C 1-20 alkoxycarbonyl group, 3-3) Y 1 and Y 2 are each independently Formula 6 or Formula 7: in Formula 6 and Formula 7, 3-3-1) * represents a binding position, 3-3-2) R 9 is hydrogen or methyl, 3-3-3) R 10 to R 13 are each independently hydrogen; deuterium; a halogen; a C 6-30 aryl group; a C 2-30 heterocyclic group comprising at least one heteroatom among O, N, S, Si, and P; a fused ring group of a C 6-30 aliphatic ring and a C 6-30 aromatic ring; a C 1-20 alkyl group; a C 2-20 alkenyl group; a C 2-20 alkynyl group; a C 1-20 alkoxy group; a C 6-30 aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C 1-20 alkoxycarbonyl group, 3-3-4) L 1 to L 3 are each independently a single bond, a fluorenylene group; C 2-30 alkylene; C 6-30 arylene; a C 2-30 heterocyclic ring; C 1-30 alkoxylene, C 2-30 alkyleneoxy; C 6-30 aryloxy; or C 2-30 polyethyleneoxy, 3-3-5) q and r are each independently an integer of 0 to 3 with the proviso that q+r=3, and 4) the ratio of A 1 and A 2 in the polymer chain of the resin including a repeating unit represented by Formula 1 above is 9:1 to 1:9, 5) X 1 is a single bond; O; CO; SO 2 ; CR′R″; SiR′R″; Formula 4; or Formula 5, 5-1) R′ and R″ are each independently hydrogen; deuterium; a halogen; a C 6-30 aryl group; a C 2-30 heterocyclic group comprising at least one heteroatom among O, N, S, Si, and P; a fused ring group of a C 6-30 aliphatic ring and a C 6-30 aromatic ring; a C 1-20 alkyl group; a C 2-20 alkenyl group; a C 2-20 alkynyl group; a C 1-20 alkoxy group; a C 6-30 aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C 1-20 alkoxycarbonyl group, in Formula 4 and Formula 5, 5-2) * represents a binding position, 5-3) R 7 and R 8 are each independently deuterium; a halogen; a C 6-30 aryl group; a C 2-30 heterocyclic group comprising at least one heteroatom among O, N, S, Si, and P; a fused ring group of a C 6-30 aliphatic ring and a C 6-30 aromatic ring; a C 1-20 alkyl group; a C 2-20 alkenyl group; a C 2-20 alkynyl group; a C 1-20 alkoxy group; a C 6-30 aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C 1-20 alkoxycarbonyl group, 5-4) o and p are each independently an integer of 0 to 4, 6) X 2 is a C 6-30 aryl group; a C 2-30 heterocyclic group comprising at least one heteroatom among O, N, S, Si, and P; a fused ring group of a C 6-30 aliphatic ring and a C 6-30 aromatic ring; a C 1-20 alkyl group; a C 2-20 alkenyl group; a C 2-20 alkynyl group; a C 1-20 alkoxy group; a C 6-30 aryloxy group; a fluorenylene group; a carbonyl group; an ether group; or a C 1-20 alkoxycarbonyl group, and 7) the R′, R″, X 2 , L 1 to L 3 , R 1 to R 8 , and R 10 to R 13 may each be further substituted with one or more substituents selected from the group consisting of deuterium; a halogen; a silane group substituted or unsubstituted with a C 1-30 alkyl group or C 6-30 aryl group; a siloxane group; a boron group; a germanium group; a cyano group; an amino group; a nitro group; a C 1-30 alkylthio group; a C 1-30 alkoxy group; a C 6-30 arylalkoxy group; a C 1-30 alkyl group; a C 2-30 alkenyl group; a C 2-30 alkynyl group; a C 6-30 aryl group; a C 6-30 aryl group substituted with deuterium; a fluorenyl group; a C 2-30 heterocyclic group comprising at least one heteroatom among O, N, S, Si, and P; a C 3-30 alicyclic group; a C 7-30 arylalkyl group; a C 8-30 arylalkenyl group; and a combination thereof. 2. The method of claim 1 , wherein the developing step is performed at a temperature range of 21° C. to 25° C. 3. The method of claim 1 , wherein the developing step is performed at a time range of 40 to 80 seconds. 4. The method of claim 1 , wherein the developing step is performed at a temperature of 21° C. to 25° C. for 40 to 80 seconds. 5. The method of claim 1 , wherein the photosensitive composition further comprises a colorant. 6. The method of claim 5 , wherein the colorant comprises at least one of inorganic dyes, organic dyes, inorganic pigments, and organic pigments. 7. The method of claim 5 , wherein the colorant is included in an amount of 1 wt % to 40 wt % based on the total amount of the photosensitive composition. 8. The method of claim 5 , wherein the colorant is pretreated using a dispersant; or a water-soluble inorganic salt and a wetting agent. 9. The method of claim 5 , wherein the average particle diameter of the colorant is 20 nm to 110 nm. 10. The method of claim 1 , wherein the photosensitive composition comprises a patterning resin which further comprises an acryl-based binder resin. 11. The method of claim 10 , wherein the average molecular weight of the acryl-based binder resin is 3,000 g/mol to 150,000 g/mol. 12. The method of claim 1 , wherein the average molecular weight of the cardo-based binder resin is 1,000 g/mol to 100,000 g/mol. 13. The method of claim 1 , wherein the cardo-based resin is included in an amou
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