Management device, management method, management program, and recording medium

Patent metadata

Field	Value
Publication number	US-12416604-B2
Application number	US-202217690305-A
Country	US
Kind code	B2
Filing date	Mar 9, 2022
Priority date	Mar 12, 2021
Publication date	Sep 16, 2025
Grant date	Sep 16, 2025

Abstract

A management device includes: an acquisition unit that acquires inspection result data indicating an inspection result of each of a plurality of workpieces and processing condition data indicating a processing condition used for processing each of the plurality of workpieces; an analysis unit that selects a specific parameter correlated with the inspection result among a plurality of processing parameters; and a prediction unit that predicts predict whether or not the processing device will become abnormal in future based on a temporal change in a value of the specific parameter.

First claim

What is claimed is:

1. A management device for managing a shot peening device that sequentially processes a plurality of workpieces under a processing condition including a plurality of processing parameters, the management device comprising:
a controller configured to acquire inspection result data indicating an inspection result of each of the plurality of workpieces and processing condition data indicating the processing condition used for shot peening processing each of the plurality of workpieces, the inspection result including electromagnetic characteristics and residual stress before and after shot peening processing, the processing condition data measured by a sensor provided in the shot peening device, wherein
the controller is further configured to select, as a specific parameter, a processing parameter of which an absolute value of a correlation coefficient between the inspection result and the processing parameter is larger than a correlation threshold value, among the plurality of processing parameters; and
the controller is further configured to predict whether or not the shot peening device will become abnormal in future based on a temporal change in a value of the specific parameter.

2. The management device according to claim 1 ,
wherein the controller predicts that the shot peening device will become abnormal in future when the value of the specific parameter indicates an increasing tendency or a decreasing tendency.

3. The management device according to claim 2 ,
wherein the shot peening device includes components respectively associated with the plurality of processing parameters, and
wherein the controller predicts whether or not a component associated with the specific parameter will become abnormal in future.

4. The management device according to claim 3 ,
wherein the controller predicts a time when the inspection result indicates an abnormality based on a temporal change in the inspection result.

5. The management device according to claim 4 ,
wherein the controller determines whether or not a sudden abnormality has occurred in the shot peening device based on the inspection result.

6. The management device according to claim 3 ,
wherein the controller determines whether or not a sudden abnormality has occurred in the shot peening device based on the inspection result.

7. The management device according to claim 2 ,
wherein the controller predicts a time when the inspection result indicates an abnormality based on a temporal change in the inspection result.

8. The management device according to claim 7 ,
wherein the controller determines whether or not a sudden abnormality has occurred in the shot peening device based on the inspection result.

9. The management device according to claim 2 ,
wherein the controller determines whether or not a sudden abnormality has occurred in the shot peening device based on the inspection result.

10. The management device according to claim 1 ,
wherein the shot peening device includes components respectively associated with the plurality of processing parameters, and
wherein the controller predicts whether or not a component associated with the specific parameter will become abnormal in future.

11. The management device according to claim 10 ,
wherein the controller predicts a time when the inspection result indicates an abnormality based on a temporal change in the inspection result.

12. The management device according to claim 11 ,
wherein the controller determines whether or not a sudden abnormality has occurred in the shot peening device based on the inspection result.

13. The management device according to claim 10 ,
wherein the controller determines whether or not a sudden abnormality has occurred in the shot peening device based on the inspection result.

14. The management device according to claim 1 ,
wherein the controller predicts a time when the inspection result indicates an abnormality based on a temporal change in the inspection result.

15. The management device according to claim 14 ,
wherein the controller determines whether or not a sudden abnormality has occurred in the shot peening device based on the inspection result.

16. The management device according to claim 1 ,
wherein the controller determines whether or not a sudden abnormality has occurred in the shot peening device based on the inspection result.

17. The management device according to claim 16 ,
wherein the controller sets a normal range based on an inspection result of a workpiece processed normally, and determines that the sudden abnormality has occurred when the inspection result indicated by the inspection result data is out of the normal range.

18. The management device according to claim 1 , further comprising an output unit configured to output a prediction result by the controller.

19. A management method of managing a shot peening device that sequentially processes a plurality of workpieces under a processing condition including a plurality of processing parameters, the management method comprising:
a step of acquiring inspection result data indicating an inspection result of each of the plurality of workpieces and processing condition data indicating the processing condition used for shot peening processing each of the plurality of workpieces, the inspection result including electromagnetic characteristics and residual stress before and after shot peening processing, the processing condition data measured by a sensor provided in the shot peening device;
a step of selecting, as a specific parameter, a processing parameter of which an absolute value of a correlation coefficient between the inspection result and the processing parameter is larger than a correlation threshold value, among the plurality of processing parameters; and
a step of predicting whether or not the shot peening device will become abnormal in future based on a temporal change in a value of the specific parameter.

20. A non-transitory computer-readable recording medium recording a management program that causes a computer to operate so as to manage a shot peening device that sequentially processes a plurality of workpieces under a processing condition including a plurality of processing parameters, the management program configured to cause a computer to execute:
a step of acquiring inspection result data indicating an inspection result of each of the plurality of workpieces and processing condition data indicating the processing condition used for shot peening processing each of the plurality of workpieces, the inspection result including electromagnetic characteristics and residual stress before and after shot peening processing, the processing condition data measured by a sensor provided in the shot peening device;
a step of selecting, as a specific parameter, a processing parameter of which an absolute value of a correlation coefficient between the inspection result and the processing parameter is larger than a correlation threshold value, among the plurality of processing parameters; and
a step of predicting whether or not the shot peening device will become abnormal in future based on a temporal change in a value of the specific parameter.

Assignees

• Sintokogio Ltd

Inventors

• Makino Yoshiyasu
• Aoki Kan
• Hayashida Shuji

Classifications

• B24C1/10 Primary

  for compacting surfaces, e.g. shot-peening (for deforming sheet metal, tubes or profiles B21D31/06; as a metallurgical treatment C21D7/00, C22F1/00) · CPC title

• G01N27/90 Primary

  using eddy currents · CPC title

• B24C9/00

  Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material · CPC title

• B24C3/02

  characterised by the arrangement of the component assemblies with respect to each other (B24C3/08, B24C3/18 take precedence) · CPC title

• G06Q50/04

  Manufacturing · CPC title