Modular heatsink and methods of use thereof

Patent metadata

Field	Value
Publication number	US-12416459-B2
Application number	US-202318534309-A
Country	US
Kind code	B2
Filing date	Dec 8, 2023
Priority date	Dec 8, 2023
Publication date	Sep 16, 2025
Grant date	Sep 16, 2025

Abstract

Heatsinks and methods are provided for dissipating thermal energy from a substrate in thermal contact therewith. The heatsinks include a plurality of sequentially coupled links. Each of the links includes a hub portion elongated along a central longitudinal axis thereof, a male connector on a first side of the hub portion and elongated along the central longitudinal axis, a female connector on a second side of the hub portion and elongated along the central longitudinal axis, wherein the female connector of each of the links is configured to couple with the male connector of an adjacent one of the links, a planar contact portion on a third side of the hub portion configured to receive thermal energy via conduction from the substrate, and a fin extending from a fourth side of the hub portion configured to dissipate the thermal energy to a surrounding environment via convection.

First claim

What is claimed is:

1. A heatsink for dissipating thermal energy from a substrate in thermal contact therewith, the heatsink comprising:
a plurality of sequentially coupled links, each of the plurality of sequentially coupled links including:
a hub portion elongated along a central longitudinal axis thereof;
a male connector on a first side of the hub portion and elongated along a male connector axis that is parallel to the central longitudinal axis;
a female connector on a second side of the hub portion and elongated along a female connector axis that is parallel to the central longitudinal axis, wherein the female connector of each of the plurality of sequentially coupled links is configured to couple with the male connector of an adjacent one of the plurality of sequentially coupled links;
a planar contact portion on a third side of the hub portion configured to receive thermal energy via conduction from the substrate; and
a fin extending from a fourth side of the hub portion configured to dissipate the thermal energy to a surrounding environment via convection; and

an extension link that includes:
a male connector member elongated along a longitudinal axis thereof that is configured to couple with the female connector of a first link of the plurality of sequentially coupled links;
a female connector member elongated along a longitudinal axis thereof that is configured to couple with the male connector of a second link of the plurality of sequentially coupled links; and
an elongated tether configured to secure the male connector member and the female connector member to each other, wherein the elongated tether is configured to adjust a dimension between the male connector member and the female connector member.

2. The heatsink of claim 1 , wherein the male connector includes a protruding portion extending from the hub portion and a rounded pin disposed on a distal end of the protruding portion, the female connector includes a barrel socket having a first opening along a distal side thereof defined between a pair of edges and a second opening on an end thereof, and the barrel socket of each of the plurality of sequentially coupled links is configured to slidably receive an end of the rounded pin of the adjacent one of the plurality of sequentially coupled links through the second opening to dispose the rounded pin within the barrel socket and the protruding portion extending through the first opening.

3. The heatsink of claim 2 , wherein the first opening of each of the plurality of sequentially coupled links has a dimension measured between the pair of edges that is smaller than a diameter of the rounded pin such that the rounded pin of the adjacent one of the plurality of sequentially coupled links is restricted from passing through the first opening.

4. The heatsink of claim 2 , wherein the male connector and the female connector are configured such that when the male connector of a third link of the plurality of sequentially coupled links is coupled with the female connector of a fourth link of the plurality of sequentially coupled links and the planar contact portion of each of the third link and the fourth link are aligned, a gap is provided between the protruding portion of the third link and a first edge of the pair of edges of the fourth link that is sufficient to provide for pivoting of the male connector in a first rotational direction until the protruding portion of the third link contacts the first edge of the fourth link.

5. The heatsink of claim 4 , wherein the male connector and the female connector are configured such that when the male connector of the third link is coupled with the female connector of the fourth link and the planar contact portion of each of the third link and the fourth link are aligned, a gap is provided between the protruding portion of the third link and a second edge of the pair of edges of the fourth link that is sufficient to provide for pivoting of the male connector in a second rotational direction until the protruding portion of the third link contacts the second edge of the fourth link.

6. The heatsink of claim 1 , wherein the female connector of each of the plurality of sequentially coupled links is configured to provide for pivoting of the male connector of the adjacent one of the plurality of sequentially coupled links coupled thereto about an axis parallel to the central longitudinal axis of the hub portion.

7. The heatsink of claim 1 , wherein each of the plurality of sequentially coupled links includes a curved portion on the hub portion extending along the central longitudinal axis that is configured to promote convective thermal energy transfer therefrom.

8. The heatsink of claim 1 , wherein the fin of a first of the plurality of sequentially coupled links extends from the hub portion by a first dimension, the fin of a second of the plurality of sequentially coupled links extends from the hub portion by a second dimension, and the first dimension is less than the second dimension.

9. A heatsink for dissipating thermal energy from a substrate in thermal contact therewith, the heatsink comprising:
a plurality of sequentially coupled links, each of the plurality of sequentially coupled links including:
a hub portion elongated along a central longitudinal axis thereof;
a male connector on a first side of the hub portion and elongated along a male connector axis that is parallel to the central longitudinal axis;
a female connector on a second side of the hub portion and elongated along a female connector axis that is parallel to the central longitudinal axis, wherein the female connector of each of the plurality of sequentially coupled links is configured to couple with the male connector of an adjacent one of the plurality of sequentially coupled links;
a planar contact portion on a third side of the hub portion configured to receive thermal energy via conduction from the substrate; and
a fin extending from a fourth side of the hub portion configured to dissipate the thermal energy to a surrounding environment via convection; and

a finless link that consists of:
a second hub portion elongated along a second central longitudinal axis thereof;
a second male connector on a first side of the second hub portion and elongated along a second male connector axis that is parallel to the second central longitudinal axis that is configured to couple with the female connector of an adjacent first link of the plurality of sequentially coupled links;
a second female connector on a second side of the second hub portion and elongated along a second female connector axis that is parallel to the second central longitudinal axis that is configured to couple with the male connector of an adjacent second link of the plurality of sequentially coupled links; and
a second contact portion on a third side of the second hub portion.

10. The heatsink of claim 1 , wherein the plurality of sequentially coupled links form an assembly configured to be secured to the substrate such that the planar contact portion of each of the plurality of sequentially coupled links directly contact surfaces of the substrate that are concave, convex, rounded, or combinations thereof.

11. A method of dissipating thermal energy from a substrate, comprising:
assembling a heatsink by sequentially coupling a plurality of links, wherein each of the plurality of links include a hub portion elongated along a central longitudinal axis thereof, a male connector on a first side of the hub portion and elongated along the central longitudinal axis, a female connector on a second side of the hub portion and elongated along the central longitudinal axis, a planar contact portion on a third sid

Assignees

• Gm Global Tech Operations Llc

Inventors

• Howitt Timothy James
• Miller Ronald
• Farbar Erin

Classifications

• H10W40/037

  Assembling together parts thereof · CPC title

• H10W40/226 Primary

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• F28F2275/14

  by using form fitting connection, e.g. with tongue and groove · CPC title

• F28F2280/105

  with hinged connections · CPC title

• F28F3/06

  the means being attachable to the element · CPC title