Epoxy resin composition and cured product thereof

Patent metadata

Field	Value
Publication number	US-12415921-B2
Application number	US-202117927561-A
Country	US
Kind code	B2
Filing date	May 14, 2021
Priority date	May 27, 2020
Publication date	Sep 16, 2025
Grant date	Sep 16, 2025

Abstract

Provided is an epoxy resin composition containing an epoxy resin (A), a curing agent (B) and an imidazole adduct-type curing accelerator (C), in which the curing agent (B) contains a compound (B-1) represented by formula (B-1) [R 1 represents a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms] and a compound (B-2) represented by formula (B-2) [R 2 represents a hydrogen atom, a halogen atom, a methyl group or a methoxy group] and the content of the compound (B-2) is 2 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the epoxy resin (A).

First claim

The invention claimed is:

1. An epoxy resin composition comprising:
an epoxy resin (A);
a curing agent (B); and
an imidazole adduct-type curing accelerator (C),
wherein the curing agent (B) contains a compound (B-1) represented by the following formula (B-1):

[in the formula, R 1 represents a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms] and a compound (B-2) represented by the following formula (B-2):

[in the formula, R 2 represents a hydrogen atom, a halogen atom, a methyl group or a methoxy group,] and
a content of the compound (B-2) is 2 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the epoxy resin (A).

2. The epoxy resin composition according to claim 1 , wherein a mole ratio of a phenolic hydroxyl group content to an epoxy group content in the epoxy resin composition is 0.20 or more and 0.75 or less.

3. The epoxy resin composition according to claim 1 , wherein a content of the compound (B-2) is 2.5 parts by mass or more and 4 parts by mass or less with respect to 100 parts by mass of the epoxy resin (A).

4. The epoxy resin composition according to claim 1 , wherein a ratio of a content of the compound (B-2) to a content of the compound (B-1) is 0.20 or more and 0.95 or less in terms of mass ratio.

5. The epoxy resin composition according to claim 1 , wherein the epoxy resin (A) contains an epoxy resin having two epoxy groups in a molecule.

6. The epoxy resin composition according to claim 1 , further comprising a Lewis acid compound (D) having a boron atom or an aluminum atom.

7. A cured product of the epoxy resin composition according to claim 1 .

8. A prepreg comprising the epoxy resin composition according to claim 1 , and a fiber.

9. A composition comprising a cured product of the epoxy resin composition according to claim 1 , and a fiber.

Assignees

• Sumitomo Chemical Co

Inventors

• Takeuchi Kenichi
• Kato Hirofumi

Classifications

• C08G59/626

  Lactones · CPC title

• C08G59/621 Primary

  Phenols · CPC title

• C08K5/3445

  Five-membered rings · CPC title

• C08K5/1545

  Six-membered rings · CPC title

• C08K5/13

  Phenols; Phenolates · CPC title