Substrate and method for manufacturing the same, and display panel

Patent metadata

Field	Value
Publication number	US-12414374-B2
Application number	US-202117550244-A
Country	US
Kind code	B2
Filing date	Dec 14, 2021
Priority date	Mar 19, 2021
Publication date	Sep 9, 2025
Grant date	Sep 9, 2025

Abstract

A substrate includes: a base substrate; an organic layer on the base substrate with openings defined through the organic layer; a first metal layer including first metal patterns, where the first metal pattern is in the opening, and includes a first portion parallel to a bottom of the opening and a second portion parallel to a lateral wall of the opening; a second metal layer having a thickness greater than a thickness of the first metal layer; where the second metal layer includes second metal patterns, the second metal pattern is located in the opening and is in contact with the first metal layer; and, a distance from a surface of the first metal layer away from the base substrate to a plane where the base substrate is located is smaller than a distance from a surface of the organic layer away from the base substrate to the plane.

First claim

What is claimed is:

1. A substrate, comprising:
a base substrate;
an organic layer on one side of the base substrate with a plurality of openings defined through the organic layer;
a first metal layer including a plurality of first metal patterns, wherein the first metal pattern is located in the opening, and includes a first portion parallel to a bottom of the opening and a second portion parallel to a lateral wall of the opening;
a second metal layer having a thickness greater than a thickness of the first metal layer; wherein the second metal layer includes a plurality of second metal patterns, the second metal pattern is located in the opening and is in contact with the first metal layer; and, a maximum distance from a surface of the first metal layer away from the base substrate to a plane where the base substrate is located is smaller than a maximum distance from a surface of the organic layer away from the base substrate to the plane where the base substrate is located;
wherein the substrate further includes: an adhesion enhancement layer between the organic layer and the first metal layer;
wherein the adhesion enhancement layer covers the surface of the organic layer and the bottom of the opening.

2. The substrate according to claim 1 , wherein the second metal pattern includes a first region having a first thickness, and a second region around the first region and having a second thickness; and the second thickness is not less than 90% of the first thickness.

3. The substrate according to claim 1 , wherein the organic layer is made of photosensitive resin; and a thickness of the organic layer is in a range of 5 μm to 8 μm;
the second metal layer is made of material including copper, and a thickness of the second metal layer is in a range of 3 μm to 7 μm.

4. The substrate according to claim 1 , wherein the first metal layer and the second metal layer are stacked on the base substrate.

5. A display panel, comprising: a substrate and a light-emitting diode electrically coupled to the substrate;
wherein the substrate includes:
a base substrate;
an organic layer on one side of the base substrate with a plurality of openings defined through the organic layer;
a first metal layer including a plurality of first metal patterns, wherein the first metal pattern is located in the opening, and includes a first portion parallel to a bottom of the opening and a second portion parallel to a lateral wall of the opening;
a second metal layer having a thickness greater than a thickness of the first metal layer; wherein the second metal layer includes a plurality of second metal patterns, the second metal pattern is located in the opening and is in contact with the first metal layer; and, a maximum distance from a surface of the first metal layer away from the base substrate to a plane where the base substrate is located is smaller than a maximum distance from a surface of the organic layer away from the base substrate to the plane where the base substrate is located;
wherein the substrate further includes:
a first insulating layer on one side of the second metal layer away from the base substrate; a first planarization layer on one side of the first insulating layer away from the base substrate; a third metal layer on one side of the first planarization layer away from the base substrate, wherein the third metal layer includes a plurality of third metal patterns, each of the third metal patterns is electrically coupled to one of the second metal patterns; a second insulating layer on one side of the third metal layer away from the base substrate; and a second planarization layer on one side of the second insulating layer away from the base substrate;
or,
an adhesion enhancement layer between the organic layer and the first metal layer, wherein the adhesion enhancement layer covers the surface of the organic layer and the bottom of the opening.

6. The display panel according to claim 5 , wherein the second metal pattern includes a first signal line and a second signal line; the third metal pattern includes a first electrode and a second electrode; the first electrode is electrically coupled to one first signal line; and the second electrode is electrically coupled to one second signal line.

7. The display panel according to claim 6 , wherein the light-emitting diode includes a first pin and a second pin; the first pin is electrically coupled to the first electrode, and the second pin is electrically coupled to the second electrode.

8. The display panel according to claim 5 , wherein the substrate further includes:
a buffer layer between the base substrate and the organic layer;
an active layer between the buffer layer and the organic layer, wherein the active layer includes a plurality of active islands;
a third insulating layer between the active layer and the organic layer;
a fourth metal layer between the third insulating layer and the organic layer, wherein the fourth metal layer includes a plurality of gates;
a fourth insulating layer between the fourth metal layer and the organic layer;
a fifth metal layer between the fourth insulating layer and the organic layer, wherein the fifth metal layer includes a source electrode, a drain electrode and a power supply line;
a fifth insulating layer between the fifth metal layer and the organic layer;
wherein the second metal pattern includes a first sub-pattern electrically coupled to the power supply line and a second sub-pattern electrically coupled to the drain electrode;
the third metal pattern includes a first electrode and a second electrode, the first electrode is electrically coupled to one first sub-pattern, and the second electrode is electrically coupled to one second sub-pattern.

9. The display panel according to claim 8 , wherein the light-emitting diode includes a first pin and a second pin; the first pin is electrically coupled to the first electrode, and the second pin is electrically coupled to the second electrode.

10. The display panel according to claim 5 , wherein the second metal pattern includes a first region having a first thickness, and a second region around the first region and having a second thickness; and the second thickness is not less than 90% of the first thickness.

11. A method for manufacturing the substrate according to claim 1 , including:
forming an organic layer on one side of a base substrate, and patterning the organic layer to form a plurality of openings defined through the organic layer;
forming a first metal layer on one side of the organic layer away from the base substrate;
forming a second metal layer on one side of the first metal layer away from the base substrate by electroplating, wherein a thickness of the second metal layer is greater than a thickness of the first metal layer;
patterning the first metal layer and the second metal layer, so that the second metal layer includes a plurality of second metal patterns and the first metal layer includes a plurality of first metal patterns; wherein the first metal pattern is located in the opening, and includes a first portion parallel to a bottom of the opening and a second portion parallel to a lateral wall of the opening; the second metal pattern is located in the opening and is in contact with the first metal pattern; a maximum distance from a surface of the second metal layer away from the base substrate to a plane where the base substrate is located is smaller than a maximum distance from a surface of the organic layer away from the base substrate to the plane where the base substrate is located.

12. The method according to claim 11 , further including:
before forming the first metal layer, forming an adhes

Assignees

• Boe Technology Group Co Ltd

Inventors

• Liu Yingwei
• Cao Zhanfeng
• Wang Ke
• Zhang Guocai
• Yan Junwei

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10D86/451

  characterised by the compositions or shapes of the interlayer dielectrics · CPC title

• H10D86/0241

  using liquid deposition, e.g. printing · CPC title

• H10D86/0231

  using masks, e.g. half-tone masks · CPC title

• H10D86/443

  adapted for preventing breakage, peeling or short circuiting · CPC title