Interleaved heterogeneous heat pipes with different Qmax

Patent metadata

Field	Value
Publication number	US-12414269-B2
Application number	US-202017090624-A
Country	US
Kind code	B2
Filing date	Nov 5, 2020
Priority date	Nov 5, 2020
Publication date	Sep 9, 2025
Grant date	Sep 9, 2025

Abstract

Heterogeneous heat pipe solutions provide both low thermal resistance and a high Qmax. Some heterogeneous heat pipe solutions comprise multiple homogenous heat pipes operating in parallel, with each homogeneous heat pipe having its thermal performance tailored to handle a processor operating in a particular power mode. Other heterogeneous heat pipe solutions comprise one or more heterogeneous heat pipes, each heterogeneous heat pipe having more than wick, each wick having a different set of wick characteristics (wick material, wick thickness, etc.). Heterogeneous heat pipes can provide a thermal management solution for processors over their full operating power range.

First claim

We claim:

1. A computing device comprising:
a processor;
a heat sink;
a plurality of first heat pipes, individual of the plurality of first heat pipes thermally coupled to the processor at a first end of the individual first heat pipe and thermally coupled to the heat sink at a second end of the individual first heat pipe;
a plurality of second heat pipes, individual of the plurality of second heat pipes thermally coupled to the processor at a first end of the individual second heat pipe and thermally coupled to the heat sink at a second end of the individual second heat pipe; and
a plurality of third heat pipes, individual of the plurality of third heat pipes thermally coupled to the processor at a first end of the individual third heat pipe and thermally coupled to the heat sink at a second end of the individual third heat pipe;
wherein:
individual of the plurality of first heat pipes have a first thermal resistance and a first Q max , individual of the plurality of second heat pipes have a second thermal resistance and a second Q max , the first thermal resistance lower than the second thermal resistance, and the first Q max lower than the second Q max ;
the plurality of first heat pipes is interleaved with the plurality of second heat pipes, wherein no first heat pipe is positioned adjacent to another first heat pipe and no second pipe is positioned adjacent to another second heat pipe;
individual of the plurality of third heat pipes have a third thermal resistance different from the first thermal resistance and the second thermal resistance and a third Q max different from the first Q max and the second Q max ; and
the plurality of third heat pipes is interleaved with the plurality of first heat pipes and the plurality of second heat pipes.

2. The computing device of claim 1 , wherein individual of the plurality of first heat pipes comprise a first wick material and individual of the plurality of second heat pipes comprise a second wick material, the first wick material different than the second wick material.

3. The computing device of claim 1 , wherein individual of the plurality of first heat pipes comprise a wick material having a first thickness and individual of the plurality of second heat pipes comprise the wick material having a second thickness, the first thickness different than the second thickness.

4. The computing device of claim 1 , wherein individual of the plurality of first heat pipes have a first transverse cross-sectional area and individual of the plurality of second heat pipes have a second transverse cross-sectional area, the first transverse cross-sectional area different than the second transverse cross-sectional area.

5. The computing device of claim 1 , wherein individual of the plurality of first heat pipes comprise a first working fluid and individual of the plurality of second heat pipes comprise a second working fluid, the first working fluid different than the second working fluid.

6. The computing device of claim 1 , wherein individual of the plurality of first heat pipes comprise a working fluid charged to a first charging level and individual of the plurality of second heat pipes comprise the working fluid charged to a second charging level.

7. The computing device of claim 6 , wherein the first charging level corresponds to a first mode of the processor and the second charging level corresponds to a second mode of the processor.

8. The computing device of claim 7 , wherein the first mode of the processor is a steady state mode and the second mode of the processor is a short-term high-performance mode.

9. The computing device of claim 1 , wherein the processor is capable of operating in a short-term high-performance mode and the first Q max is less than a power consumption level of the processor when the processor is operating in the short-term high-performance mode.

10. The computing device of claim 1 , further comprising one or more memories communicatively coupled to the processor.

11. The computing device of claim 1 , wherein individual of the plurality of first heat pipes comprise a first casing material and individual of the plurality of second heat pipes comprise a second casing material, the first casing material different than the second casing material.

Assignees

• Intel Corp

Inventors

• Patankar Gaurav
• Cardenas Ruander
• Macdonald Mark
• Rallabandi Akhilesh P

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• F28D15/04

  with tubes having a capillary structure · CPC title

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• G06F1/20 Primary

  Cooling means · CPC title

• F28D2021/0029

  Heat sinks · CPC title