Package structure of micro speaker

Patent metadata

Field	Value
Publication number	US-12413909-B2
Application number	US-202318302207-A
Country	US
Kind code	B2
Filing date	Apr 18, 2023
Priority date	Apr 18, 2023
Publication date	Sep 9, 2025
Grant date	Sep 9, 2025

Abstract

A package structure of a micro speaker is provided, and includes a substrate, a membrane, a coil, and a magnetic element. The substrate has a hollow chamber. The membrane is disposed on the substrate and covers the hollow chamber. The coil is embedded in the membrane. The magnetic element is disposed in the hollow chamber. A vent hole is formed in and penetrates the membrane, and the vent hole is separated from the coil and communicates with the hollow chamber.

First claim

What is claimed is:

1. A package structure of a micro speaker, comprising: a substrate having a hollow chamber; a membrane, disposed on the substrate, covering the hollow chamber;
a multi-layers coil includes a first metal layer and a second metal layer embedded in the membrane, wherein the coil comprises: a spiral structure located in a center of the membrane; and a wavy structure extending from the spiral structure to a periphery of the membrane; and a magnetic element disposed in the hollow chamber, wherein a vent hole is formed in and penetrates the membrane, and in a top view, the vent hole is separated from the coil, located on a side opposite to the wavy structure, and is in fluid communication with and is aligned communicates with and overlaps with the hollow chamber.

2. The package structure of the micro speaker as claimed in claim 1 , wherein the vent hole has a bow profile in the top view and divides the membrane into a main body and a vent portion connected to the main body.

3. The package structure of the micro speaker as claimed in claim 2 , wherein the vent hole has a bow portion and a linear portion connected to the bow portion.

4. The package structure of the micro speaker as claimed in claim 3 , wherein the vent portion of the membrane comprises a round portion and a linear portion connected to the round portion.

5. The package structure of the micro speaker as claimed in claim 2 , wherein the vent portion is movable relative to the main body.

6. The package structure of the micro speaker as claimed in claim 1 , further comprising:
a carrier board bonded to the substrate, wherein the magnetic element is disposed on the carrier board.

7. The package structure of the micro speaker as claimed in claim 1 , wherein a plurality of vent holes are formed in the membrane and arranged parallel to an edge of the membrane.

8. The package structure of the micro speaker as claimed in claim 1 , wherein the vent hole has an elongated shape.

9. The package structure of the micro speaker as claimed in claim 1 , wherein a diameter of the vent hole is between 1 μm and 100 μm.

10. A package structure of a micro speaker, comprising: a substrate having a hollow chamber; a membrane, disposed on the substrate, covering the hollow chamber, wherein the membrane has at least one straight edge;
a multi-layers coil includes a first metal layer and a second metal layer embedded in the membrane, wherein the coil comprises: a spiral structure located in a center of the membrane; and a wavy structure extending from the spiral structure to a periphery of the membrane; and a magnetic element disposed in the hollow chamber, wherein a vent hole is formed in and penetrates the membrane, and in a top view, the vent hole is separated from the coil, located on a side opposite to the wavy structure, and is aligned overlaps with the hollow chamber.

11. The package structure of the micro speaker as claimed in claim 10 , wherein the membrane has a rectangular shape with rounded corners.

12. The package structure of the micro speaker as claimed in claim 10 , wherein the straight edge of the membrane is parallel to an edge of the substrate.

13. A package structure of a micro speaker, comprising: a substrate having a hollow chamber; a membrane, disposed on the substrate, covering the hollow chamber, wherein the membrane has at least one straight edge;
a multi-layers coil includes a first metal layer and a second metal layer embedded in the membrane, wherein the coil comprises: a spiral structure located in a center of the membrane; and a wavy structure extending from the spiral structure to a periphery of the membrane; and a magnetic element disposed in the hollow chamber, wherein a vent hole is formed in and penetrates the membrane, and in a top view, the vent hole is separated from the coil, located on a side opposite to the wavy structure, and is in fluid communication with and is aligned communicates with the hollow chamber.

14. The package structure of the micro speaker as claimed in claim 13 , wherein the straight edge of the membrane is parallel to an edge of the substrate.

15. The package structure of the micro speaker as claimed in claim 13 , wherein the vent hole has a bow profile in the top view and divides the membrane into a main body and a vent portion connected to the main body.

16. The package structure of the micro speaker as claimed in claim 15 , wherein the vent hole has a bow portion and a linear portion connected to the bow portion.

17. The package structure of the micro speaker as claimed in claim 15 , wherein the vent portion of the membrane comprises a round portion and a linear portion connected to the round portion.

18. The package structure of the micro speaker as claimed in claim 13 , wherein a plurality of vent holes are formed in the membrane and arranged parallel to the edge of the membrane.

19. The package structure of the micro speaker as claimed in claim 13 , wherein the vent hole has an elongated shape.

20. The package structure of the micro speaker as claimed in claim 13 , wherein a diameter of the vent hole is between 1 μm and 100 μm.

Assignees

• Fortemedia Inc

Inventors

• Xu Yu-Xuan
• Gong Shih-Chin

Classifications

• H04R9/025

  Magnetic circuit · CPC title

• H04R9/047 Primary

  in which the windings of the moving coil lay in the same plane · CPC title

• H04R9/06 Primary

  Loudspeakers · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title

• H04R1/025

  Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture · CPC title