Electronic device having ceramic element and metal terminals

Patent metadata

Field	Value
Publication number	US-12412702-B2
Application number	US-202318331652-A
Country	US
Kind code	B2
Filing date	Jun 8, 2023
Priority date	Jun 14, 2022
Publication date	Sep 9, 2025
Grant date	Sep 9, 2025

Abstract

An electronic device includes: a ceramic element including a first electrode portion and a second electrode portion; a first metal terminal including a first external connection portion and a first electrode connection portion connected to the first electrode portion through solder; and a second metal terminal including a second external connection portion and a second electrode connection portion connected to the second electrode portion through solder. The first electrode connection portion includes a first solder stopper formed by undulation of at least a part of a facing surface of the first electrode connection portion facing the first electrode portion to control a range of an adhesion region of solder to the first electrode portion. The second electrode connection portion includes a second solder stopper that is formed by undulation of at least a part of a facing surface of the second electrode connection portion facing the second electrode portion.

First claim

What is claimed is:

1. An electronic device, comprising:
a ceramic element including a first electrode portion and a second electrode portion;
a first metal terminal including a first electrode connection portion and a first external connection portion, the first electrode connection portion being connected to the first electrode portion through solder; and
a second metal terminal including a second electrode connection portion and a second external connection portion, the second electrode connection portion being connected to the second electrode portion through solder, wherein
the first electrode connection portion includes a first solder stopper formed by undulation of at least a part of a facing surface of the first electrode connection portion facing the first electrode portion to control a range of an adhesion region of solder to the first electrode portion,
the second electrode connection portion includes a second solder stopper formed by undulation of at least a part of a facing surface of the second electrode connection portion facing the second electrode portion to control a range of an adhesion region of solder to the second electrode portion,
at least one of the first solder stopper and the second solder stopper includes an electrode proximity portion on the facing surface and a solder storage portion for storing solder,
the solder storage portion includes a recessed portion extending in a direction away from the ceramic element, and an edge of the recessed portion is closed by the electrode proximity portion.

2. The electronic device according to claim 1 , wherein at least one of the first solder stopper and the second solder stopper includes a solder outflow prevention portion for controlling spread of solder, which is formed adjacent to an electrode proximity portion on the facing surface.

3. The electronic device according to claim 2 , wherein the solder outflow prevention portion includes a recessed portion extending in a direction away from the ceramic element.

4. The electronic device according to claim 2 , wherein
the solder outflow prevention portion includes a recessed portion extending in a direction away from the ceramic element, and
a part of an edge of the recessed portion has an opening portion that is not closed by the electrode proximity portion.

5. The electronic device according to claim 1 , further comprising a case in which the ceramic element is housed in a housing recess.

6. The electronic device according to claim 5 , wherein the first external connection portion and the second external connection portion are arranged on an opening edge portion of the housing recess.

7. The electronic device according to claim 6 , wherein the first external connection portion and the second external connection portion are arranged approximately parallel to a first main surface and a second main surface of the ceramic element.

8. The electronic device according to claim 6 , wherein the first external connection portion and the second external connection portion are arranged approximately perpendicular to a first main surface and a second main surface of the ceramic element.

9. An electronic device, comprising:
a ceramic element including a first electrode portion and a second electrode portion;
a first metal terminal including a first electrode connection portion and a first external connection portion, the first electrode connection portion being connected to the first electrode portion through solder; and
a second metal terminal including a second electrode connection portion and a second external connection portion, the second electrode connection portion being connected to the second electrode portion through solder, wherein
the first electrode connection portion includes a first solder stopper formed by undulation of at least a part of a facing surface of the first electrode connection portion facing the first electrode portion to control a range of an adhesion region of solder to the first electrode portion,
the second electrode connection portion includes a second solder stopper formed by undulation of at least a part of a facing surface of the second electrode connection portion facing the second electrode portion to control a range of an adhesion region of solder to the second electrode portion,
at least one of the first solder stopper and the second solder stopper includes a solder outflow prevention portion for controlling spread of solder, which is formed adjacent to an electrode proximity portion on the facing surface,
the first electrode connection portion has an approximately rectangular shape extending along a first main surface of the ceramic element,
the second electrode connection portion has an approximately rectangular shape extending along a second main surface of the ceramic element, and at least one of the first electrode connection portion and the second electrode connection portion has the solder outflow prevention portion arranged so as to extend in a direction crossing a longitudinal direction of the first electrode connection portion or the second electrode connection portion.

10. The electronic device according to claim 9 , wherein the adhesion region and a non-adhesion region of the first electrode portion or the second electrode portion to which solder does not adhere are separated from each other with the solder outflow prevention portion as a boundary.

11. The electronic device according to claim 9 , wherein at least one of the first solder stopper and the second solder stopper includes a protruding portion that protrudes in a direction approaching the ceramic element.

12. The electronic device according to claim 9 , wherein at least one of the first solder stopper and the second solder stopper includes an electrode proximity portion on the facing surface and a solder storage portion for storing solder.

13. The electronic device according to claim 12 , wherein the solder storage portion includes a recessed portion extending in a direction away from the ceramic element.

14. An electronic device, comprising:
a ceramic element including a first electrode portion and a second electrode portion;
a case in which the ceramic element is housed in a housing recess;
a first metal terminal including a first electrode connection portion and a first external connection portion, the first electrode connection portion being connected to the first electrode portion through solder; and
a second metal terminal including a second electrode connection portion and a second external connection portion, the second electrode connection portion being connected to the second electrode portion through solder, wherein
the first electrode connection portion includes a first solder stopper formed by undulation of at least a part of a facing surface of the first electrode connection portion facing the first electrode portion to control a range of an adhesion region of solder to the first electrode portion,
the second electrode connection portion includes a second solder stopper formed by undulation of at least a part of a facing surface of the second electrode connection portion facing the second electrode portion to control a range of an adhesion region of solder to the second electrode portion, and
the housing recess is filled with mold resin.

Assignees

• Tdk Corp

Inventors

• Masuda Akihiro
• Sato Takaaki
• Ito Shinya
• Ando Norihisa
• Kaneko Hideki
• Aburakawa Ken
• Tamaki Kenya
• Yoshii Akitoshi

Classifications

• H01G4/224

  Housing; Encapsulation · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/2325

  characterised by the material of the terminals · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title