Electronic component and manufacturing method for the same

Patent metadata

Field	Value
Publication number	US-12412688-B2
Application number	US-202217935412-A
Country	US
Kind code	B2
Filing date	Sep 26, 2022
Priority date	Oct 12, 2017
Publication date	Sep 9, 2025
Grant date	Sep 9, 2025

Abstract

A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.

First claim

What is claimed is:

1. An electronic component comprising:
an element body containing magnetic particles and resin;
a coil incorporated in the element body and formed by winding a conductive wire;
a marker area disposed on a surface of the element body and containing non-conductive particles; and
a pair of outer electrodes disposed on the surface of the element body and connected to the coil,
wherein
the non-conductive particles have a smaller volume average particle diameter than that of the magnetic particles, and
the non-conductive particles are disposed between the magnetic particles in the marker area.

2. The electronic component according to claim 1 , wherein
a ratio of the volume average particle diameter of the magnetic particles to the volume average particle diameter of the non-conductive particles is equal to or greater than 30.

3. The electronic component according to claim 1 , wherein the magnetic particles are metal magnetic particles.

4. The electronic component according to claim 1 , wherein
at least one of the outer electrodes is spaced from the marker area.

5. The electronic component according to claim 1 , wherein
at least one of the outer electrodes covers a portion of a surface of the molded body including the marker area.

6. The electronic component according to claim 1 , wherein the non-conductive particles are metallic oxide particles.

Assignees

• Murata Manufacturing Co

Inventors

• Iso Eiji
• Ida Isao
• Okuizumi Hiroshi
• Kawachi Takao

Classifications

• H01F27/292

  Surface mounted devices · CPC title

• H01F27/2852

  Construction of conductive connections, of leads · CPC title

• H01F2017/048

  with encapsulating core, e.g. made of resin and magnetic powder · CPC title

• H01F17/04

  with magnetic core · CPC title

• H01F17/0013

  with stacked layers · CPC title