Bonded abrasive with low wetting bond material

Patent metadata

Field	Value
Publication number	US-12409530-B2
Application number	US-202318501651-A
Country	US
Kind code	B2
Filing date	Nov 3, 2023
Priority date	Nov 4, 2022
Publication date	Sep 9, 2025
Grant date	Sep 9, 2025

Abstract

The subject application relates to bonded abrasive with low wetting bond material. An abrasive article including a bonded abrasive body having a particular MOR/EMOD ratio associated with a particular bond vol %. The body also can include a) an average Bond Post Area (BPA) of not greater than microns 2 ; b) an average Bond Post Count (BPC) of at least 140 per 1536 mm 2 ; c) an average bond wetting radius of at least 30/microns; or d) a combination of a) and b).

First claim

What is claimed is:

1. An abrasive article comprising:
a body comprising:
a bond material comprising an inorganic material;
abrasive particles contained in a bond material;
a MOR/EMOD ratio of at least 0.92; a bond vol % of less than 18%, a porosity of at least 1 vol % and not greater than 65 vol %, and
wherein the body further comprises at least one of:
a) an average Bond Post Area (BPA) of not greater than 2400 microns 2 ;
b) an average Bond Post Count (BPC) of at least 140 per 1.536 mm 2 ;
c) an average bond wetting radius of at least 30 microns; and
d) a combination of a) and b).

2. The abrasive article of claim 1 , further comprising an average Bond Post Area (BPA) of not greater 2400 micron 2 .

3. The abrasive article of claim 1 , further comprising an average Bond Post Count (BPC) per 1.536 mm 2 of at least 140 bond posts per 1.536 mm 2 .

4. The abrasive article of claim 1 , further comprising an average Bond Post Area (BPA) of at least 400 micron 2 and not greater than 925 micron 2 , and further comprising an average Bond Post Count (BPC) per 1.536 mm 2 of at least 40 and not greater than 300 bond posts per 1.536 mm 2 .

5. The abrasive article of claim 1 , further comprising an average bond wetting radius of at least 30 microns.

6. The abrasive article of claim 1 , wherein the 25 th percentile bond post area is at least 770 micron 2 and not greater than 795 micron 2 .

7. The abrasive article of claim 1 , wherein the 50 th percentile bond post area is at least 1830 micron 2 and not greater than 1880 micron 2 .

8. The abrasive article of claim 1 , wherein the 75 th percentile bond post area is at least 4600 micron 2 and not greater than 4850 micron 2 .

9. The abrasive article of claim 1 , comprising an average Bond Post Volume BPV) per vol % bond material of not greater than 6000 micron 3 .

10. The abrasive article of claim 1 , wherein the abrasive particles define a multimodal particle size distribution.

Assignees

• Saint Gobain Abrasives Inc
• Saint Gobain Abrasifs Sa
• Saint Gobain Surface Solutions France

Inventors

• Wang Qing
• Lin Guangyong
• Sarangi Nilanjan
• Luo Zhenyu
• Lu Lu

Classifications

• B24D18/0009 Primary

  using moulds or presses · CPC title

• B24D18/0072

  using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing · CPC title

• B24D5/02 Primary

  Wheels in one piece · CPC title

• B24D3/14 Primary

  ceramic, i.e. vitrified bondings · CPC title

• B24D3/00

  Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents · CPC title