Plasma-assisted techniques for fabricating semiconductor devices
US-2015255661-A1 · Sep 10, 2015 · US
US12408474B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12408474-B2 |
| Application number | US-202318151341-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 6, 2023 |
| Priority date | Jan 6, 2022 |
| Publication date | Sep 2, 2025 |
| Grant date | Sep 2, 2025 |
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Contacts for solar cells and other optoelectronic devices are provided. Embodiments described herein take advantage of the surface Fermi level pinning effect to build an electrical field inside of a semiconductor to extract or inject carriers for solar cells, photodetectors, and light-emitting device applications. For example, n-type or p-type two-dimensional (2D) materials can be used in contact with an n-type semiconductor to form a “p-region” so that a p-n junction, or an i-n or n-n+ junction can be constructed. Similarly, n-type or p-type 2D materials can be used in contact with a p-type semiconductor to form an “n-region” so that an n-p junction, or an i-p or p-p+ junction can be constructed. These structures can provide sufficiently high electrical field inside the semiconductor to extract photogenerated carriers in solar cells and photodetectors or inject minority carriers for light-emitting devices.
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What is claimed is: 1. An optoelectronic junction, comprising: a thin-film doped semiconductor; and a p-contact layer comprising a two-dimensional (2D) material deposited at an interface of the thin-film doped semiconductor forming the optoelectronic junction, a thickness of the two-dimensional (2D) material being chosen to tailor a Fermi level of the two-dimensional (2D) material to overlap or fall below a valence band edge of the thin-film doped semiconductor at the interface, wherein the thin-film doped semiconductor comprises a p-type semiconductor, wherein the p-contact layer comprising the two-dimensional (2D) material comprises a single-layer p-type material or a double-layer p-type material, and wherein the optoelectronic junction is a p-p+ junction. 2. The optoelectronic junction of claim 1 , wherein the two-dimensional (2D) material induces a sufficiently high electrical field inside the thin-film doped semiconductor to extract photogenerated carriers from the optoelectronic junction or inject minority carriers into the optoelectronic junction. 3. The optoelectronic junction of claim 1 , further comprises indium tin oxide disposed over the p-contact layer forming an ohmic contact. 4. The optoelectronic junction of claim 1 , wherein the p-contact layer comprises a doped Cu/Au. 5. The optoelectronic junction of claim 1 , wherein the two-dimensional (2D) material comprises one of ZnTe:As, ZnTe:Cu, or CuZnS. 6. The optoelectronic junction of claim 5 , wherein the p-contact layer comprises: a pre-selected work-function and a pre-selected interface recombination. 7. The optoelectronic junction of claim 1 , wherein the p-contact layer comprises: a single layer or double-layer stack of transition-metal oxide (TMO) and dichalcogenides (TMD) [(Mo, W)(O, S, Se, Te)], and GaSe two-dimensional (2D) materials configured to tailor a work-function of the p-contact layer to realize ohmic hole-selective contact with CdTe. 8. A method for forming a thin-film optoelectronic device, the method comprising: providing a thin-film doped semiconductor; and creating a p-contact layer by depositing a two-dimensional (2D) material at an interface of the thin-film doped semiconductor to form an optoelectronic junction, wherein a thickness of the two-dimensional (2D) material being chosen to tailor a Fermi level of the two-dimensional (2D) material to overlap or fall below a valence band edge of the thin-film doped semiconductor at the interface, wherein the thin-film doped semiconductor comprises a p-type semiconductor, wherein the p-contact layer comprising the two-dimensional (2D) material comprises a single-layer p-type material or a double-layer p-type material, and wherein the optoelectronic diode junction is a p-p+ junction. 9. The method of claim 8 , further comprising: depositing indium tin oxide over the p-contact layer forming an ohmic contact. 10. The method of claim 8 , wherein the two-dimensional (2D) material induces a sufficiently high electrical field inside the thin-film doped semiconductor to extract photogenerated carriers from the optoelectronic diode junction or inject minority carriers into the optoelectronic diode junction. 11. The method of claim 10 , wherein the two-dimensional (2D) material comprises one of: ZnTe:As, ZnTe:Cu, or CuZnS). 12. The method of claim 8 , wherein the p-contact layer comprises a doped Cu/Au. 13. The method of claim 12 , wherein the p-contact layer comprises: a pre-selected work-function and a pre-selected interface recombination. 14. A contact for a solar cell comprising a thin-film doped semiconductor, the contact comprising: a p-contact layer including a two-dimensional (2D) material deposited at an interface of the thin-film doped semiconductor forming an optoelectronic junction, a thickness of the two-dimensional (2D) material being chosen to tailor a Fermi level of the two-dimensional (2D) material to overlap or fall below a valence band edge of the thin-film doped semiconductor at the interface; and indium tin oxide disposed over the p-contact layer forming an ohmic contact, wherein the thin-film doped semiconductor comprises a p-type semiconductor, wherein the p-contact layer comprising the two-dimensional (2D) material comprises a single-layer p-type material or a double-layer p-type material, and wherein an optoelectronic junction including the thin-film doped semiconductor and the p-contact layer is a p-p+ junction. 15. The contact of claim 14 , wherein the two-dimensional (2D) material induces a sufficiently high electrical field inside the thin-film doped semiconductor to extract photogenerated carriers from the optoelectronic junction or inject minority carriers into the optoelectronic junction. 16. The contact of claim 14 , wherein the p-contact layer comprises a doped Cu/Au. 17. The contact of claim 14 , wherein the two-dimensional (2D) material comprises one of ZnTe:As, ZnTe:Cu, or CuZnS. 18. The contact of claim 14 , wherein the p-contact layer comprises a pre-selected work-function and a pre-selected interface recombination. 19. The contact of claim 14 , wherein the p-contact layer comprises a single layer or double-layer stack of transition-metal oxide (TMO) and dichalcogenides (TMD) [(Mo, W) (O, S, Se, Te)], and GaSe two-dimensional (2D) materials configured to tailor a work-function to realize ohmic hole-selective contact with CdTe.
Solar cells from Group II-VI materials · CPC title
Manufacture or treatment of devices covered by this subclass (patterning processes to connect thin photovoltaic cells in integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/33; manufacture or treatment of encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/80; manufacture or treatment of integrated devices, or assemblies of multiple devices, comprising at least one element in which radiation controls the flow of current H10F39/00) · CPC title
Manufacture of transparent electrodes, e.g. transparent conductive oxides [TCO] or indium tin oxide [ITO] electrodes · CPC title
the potential barrier being a PN heterojunction · CPC title
Photovoltaic cells having only PN heterojunction potential barriers · CPC title
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