Electronic device and method of fabricating electronic device

Patent metadata

Field	Value
Publication number	US-12408273-B2
Application number	US-202218264093-A
Country	US
Kind code	B2
Filing date	Nov 18, 2022
Priority date	Nov 18, 2022
Publication date	Sep 2, 2025
Grant date	Sep 2, 2025

Abstract

An electronic device is provided. The electronic device includes electric components in an effective area; and a retaining structure substantially surrounding a boundary of the effective area. The electronic device includes a base substrate, and multiple conductive layer and multiple insulating layers alternately stacked on the base substrate. The retaining structure is configured to enhance adhesion between conductive layers adjacent to each other in the electronic device. The retaining structure includes one or more retaining layers. A respective retaining layer of the one or more retaining layers is in direct contact with at least one insulating layer of the electronic device.

First claim

What is claimed is:

1. An electronic device, comprising:
electric components in an effective area; and
a retaining structure substantially surrounding a boundary of the effective area;
wherein the electronic device comprises a base substrate, and multiple conductive layer and multiple insulating layers alternately stacked on the base substrate;
the retaining structure is configured to enhance adhesion between conductive layers adjacent to each other in the electronic device;
the retaining structure comprises one or more retaining layers; and
a respective retaining layer of the one or more retaining layers is in direct contact with at least one insulating layer of the electronic device;
wherein the respective retaining structure comprises a respective ring substantially surrounding the effective area of the electronic device; and
the respective ring is a discontinuous ring substantially surrounding the effective area of the electronic device, the discontinuous ring comprising a plurality of segments.

2. The electronic device of claim 1 , wherein the retaining structure is between the boundary of the effective area and an edge of the electronic device.

3. The electronic device of claim 1 , wherein at least two adjacent retaining layers of the one or more retaining layers are connected through a via in an insulating layer between the two adjacent retaining layers.

4. The electronic device of claim 1 , wherein the one or more retaining layers comprises a first respective retaining layer and a second respective retaining layer on a side of the first respective retaining layer away from a base substrate;
wherein the retaining structure further comprises a first connecting structure connecting the first respective retaining layer with the second respective retaining layer;
the second respective retaining layer and the first connecting structure are parts of a first unitary structure;
the first respective retaining layer is in a same layer as a first conductive layer in the effective area of the electronic device; and
the second respective retaining layer is in a same layer as a second conductive layer in the effective area of the electronic device.

5. The electronic device of claim 4 , wherein the one or more retaining layers further comprises a third respective retaining layer on a side of the second respective retaining layer away from the base substrate;
wherein the retaining structure further comprises a second connecting structure connecting the second respective retaining layer with the third respective retaining layer;
the third respective retaining layer and the second connecting structure are parts of a second unitary structure; and
the third respective retaining layer is in a same layer as a third conductive layer in the effective area of the electronic device.

6. The electronic device of claim 1 , wherein the one or more retaining layers comprises a first respective retaining layer, a second respective retaining layer on a side of the first respective retaining layer away from a base substrate, and a third respective retaining layer on a side of the second respective retaining layer away from the base substrate;
wherein the retaining structure further comprises a connecting structure connecting the third respective retaining layer with the second respective retaining layer;
the third respective retaining layer and the connecting structure are parts of a unitary structure;
the first respective retaining layer is in a same layer as a first conductive layer in the effective area of the electronic device;
the second respective retaining layer is in a same layer as a second conductive layer in the effective area of the electronic device; and
the third respective retaining layer is in a same layer as a third conductive layer in the effective area of the electronic device.

7. The electronic device of claim 1 , wherein the one or more retaining layers comprises a first respective retaining layer, a second respective retaining layer on a side of the first respective retaining layer away from a base substrate, and a third respective retaining layer on a side of the second respective retaining layer away from the base substrate;
wherein the retaining structure further comprises a connecting structure connecting the first respective retaining layer with the second respective retaining layer;
the second respective retaining layer and the connecting structure are parts of a unitary structure;
the first respective retaining layer is in a same layer as a first conductive layer in the effective area of the electronic device;
the second respective retaining layer is in a same layer as a second conductive layer in the effective area of the electronic device; and
the third respective retaining layer is in a same layer as a third conductive layer in the effective area of the electronic device.

8. The electronic device of claim 1 , wherein the one or more retaining layers comprises a first respective retaining layer and a second respective retaining layer on a side of the first respective retaining layer away from a base substrate;
wherein the retaining structure further comprises a connecting structure connecting the first respective retaining layer with the second respective retaining layer;
the second respective retaining layer and the connecting structure are parts of a first unitary structure;
the first respective retaining layer is in a same layer as a first conductive layer in the effective area of the electronic device; and
the second respective retaining layer is in a same layer as a third conductive layer in the effective area of the electronic device;
wherein the electronic device further comprises a second conductive layer in the effective area, the second conductive layer on a side of the first conductive layer closer to the third conductive layer;
the electronic device further comprises a first insulating layer spacing apart the first conductive layer and the second conductive layer, and a second insulating layer spacing apart the second conductive layer and the third conductive layer; and
the connecting structure extends through a via extending through the first insulating layer and the second insulating layer.

9. The electronic device of claim 1 , further comprising one or more auxiliary retaining layers;
wherein a respective auxiliary retaining layer of the one or more auxiliary retaining layers is in direct contact with at least one retaining layer of the one or more retaining layers.

10. The electronic device of claim 9 , wherein the respective auxiliary retaining layer comprises a material different from a material in the at least one retaining layer.

11. The electronic device of claim 9 , comprising:
a first respective auxiliary retaining layer;
a first respective retaining layer on a side of the first respective auxiliary retaining layer away from a base substrate;
a second respective auxiliary retaining layer on a side of the first respective retaining layer away from the base substrate;
a second respective retaining layer on a side of the second respective auxiliary retaining layer away from the base substrate; and
a first connecting structure connecting the first respective retaining layer with the second respective retaining layer;
wherein the first connecting structure comprises at least a portion of the second respective auxiliary retaining layer and a portion connected with the second respective retaining layer;
the second respective retaining layer and the portion of the first connecting structure connected with the second respective retaining layer are parts of a unitary structure;
the first respective retaining layer is in a sam

Assignees

• Beijing Boe Optoelectronics Tech Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Li Huiying
• Li Yue
• Xiao Yuelei
• Feng Yulin
• Cao Xue
• An Qichang
• Wu Yifan
• Li Biqi

Classifications

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10D86/85 Primary

  characterised by only passive components · CPC title

• H05K3/4644

  by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title

• H05K3/30

  Assembling printed circuits with electric components, e.g. with resistors · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title