Composite material, conductive material, conductive particles, and conductive film
US-2021193347-A1 · Jun 24, 2021 · US
US12404411B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12404411-B2 |
| Application number | US-202318458504-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 30, 2023 |
| Priority date | Oct 19, 2018 |
| Publication date | Sep 2, 2025 |
| Grant date | Sep 2, 2025 |
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Hybrid particles having improved electrical conductivity and thermal and chemical stabilities are disclosed. The hybrid particles are for use in conductive pastes. The hybrid particles include a nanoparticle selected from a graphene-containing material, a dichalcogenide material, a conducting polymer, or a combination thereof encapsulated in a conducting metal. The hybrid particles include a nanoparticle selected from a graphene-containing material, a dichalcogenide material, or a combination thereof encapsulated in a conducting polymer, and optionally further in a conducting metal. Suitable conducting metals include nickel or silver. Suitable conducting polymers include polyaniline, polypyrrole, or polythiophene. Suitable dichalcogenide materials include MoS 2 or MoSe 2 . The hybrid particles can further include a conducting polymer layer on an outer surface of the conducting metal. Methods of making the hybrid particles are also disclosed.
Opening claim text (preview).
What is claimed is: 1. A particle comprising a nanoparticle core selected from a graphene-containing material, a dichalcogenide material, or a combination thereof and a shell at least partially surrounding the core, wherein the shell comprises a conducting polymer, wherein the nanoparticle core material is functionalized with a polyanion. 2. The particle of claim 1 , wherein the polyanion is a salt of polystyrene sulfonate. 3. The particle of claim 1 , wherein the nanoparticle core is selected from a graphene-containing material or a dichalcogenide material. 4. The particle of claim 1 , wherein the graphene-containing material is selected from graphene, graphene oxide, carbon nanoparticle, or a combination thereof. 5. The particle of claim 1 , wherein the core comprises the dichalcogenide material selected from molybdenum disulphide, molybdenum diselenide, molybdenum ditelluride, tungsten disulphide, tungsten diselenide, tungsten ditelluride, titanium diselenide, titanium disulphide, titanium ditelluride, zirconium disulphide, zirconium diselenide, zirconium ditelluride, tin disulphide, tin diselenide, tantalum disulphide, tantalum diselenide, vanadium tantalum ditelluride, or a combination thereof. 6. The particle of claim 1 , wherein the particle comprises the conducting polymer selected from polyaniline, polypyrrole, polythiophene, polyethylenedioxythiophene, poly (ortho-anisidine), poly (methyl aniline), poly(o-ethoxyaniline), poly (o-toluidine), poly (ethoxy-aniline), substituted polyaniline, substituted polypyrrole, polyindole, polycarbazole, substituted polycarbazole, polyaniline-polypyrrole copolymers, polyaniline-polythiophene copolymers, blends thereof, or copolymers thereof. 7. The particle of claim 1 , wherein the particles have an average particle size of 50 nm to 10 microns. 8. A composition comprising the particle of claim 1 . 9. The composition according to claim 8 , wherein the particle is present in an amount of 50-90 wt % of the composition. 10. The composition of claim 9 , further comprising a dispersant, an adhesive material, or a combination thereof. 11. The composition of claim 10 , wherein the adhesive material includes an epoxy resin, a vinyl ester resin, a polystyrene resin, an acrylic resin, a polyamide resin, a polyamide-amine resin, a carboxyl group-containing resin, or a combination thereof. 12. The composition according to claim 10 , wherein the adhesive is present in an amount of 10-50 wt % of the composition. 13. The composition of claim 10 , wherein the composition is a conductive paste. 14. The composition of claim 10 , wherein the composition exhibits an electrical resistivity of at least 13×10−5 ohm·cm, a thermal conductivity of at least 8 W/mK, and chemical stability at room temperature.
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