Thermally conductive composite and a method for preparing the same

Patent metadata

Field	Value
Publication number	US-12404405-B2
Application number	US-202017604871-A
Country	US
Kind code	B2
Filing date	Apr 20, 2020
Priority date	Apr 24, 2019
Publication date	Sep 2, 2025
Grant date	Sep 2, 2025

Abstract

The purpose of the present invention is therefore to provide a thermally conductive composite tape which is in a form of sheet and, therefore, easy to handle, excellent in strength and electrical insulation, easily stick to an element or heat release-member, and shows strong adhesion to the heat-release member. The present invention provides a thermally conductive composite comprising a first thermally conductive adhesive layer, a reinforcing layer (A) layered on one surface of the first thermally conductive adhesive layer, and a second thermally conductive adhesive layer layered on a free surface of the reinforcing layer (A), wherein the first and second thermally conductive adhesive layers comprise, independently of each other, a silicone composition comprising the following components (a) to (e): 100 parts by mass of (a) linear or branched organopolysiloxane, 1,000 to 3,000 parts by mass of (b) thermally conductive filler, 100 to 500 parts by mass of (c) silicone resin, 1 to 10 parts by mass of (d) organohydrogenpolysiloxane, and 0.5 to 5 parts by mass of (e) organic peroxide.

First claim

The invention claimed is:

1. A thermally conductive composite comprising a first thermally conductive adhesive layer, a reinforcing layer (A) layered on one surface of the first thermally conductive adhesive layer, and a second thermally conductive adhesive layer layered on a free surface of the reinforcing layer (A),
wherein the first and second thermally conductive adhesive layers comprise, independently of each other, a silicone composition consisting of the following components (a) to (e) and optional additives selected from the group consisting of surface treatment agents, pigments, dyes, and flame retardants:
100 parts by mass of (a) linear or branched organopolysiloxane,
1,000 to 3,000 parts by mass of (b) thermally conductive filler,
100 to 500 parts by mass of (c) silicone resin,
1 to 10 parts by mass of (d) organohydrogenpolysiloxane, and
0.5 to 5 parts by mass of (e) organic peroxide.

2. The thermally conductive composite according to claim 1 , wherein (c) silicone resin comprises R 3 SiO 1/2 units and SiO 4/2 units with a molar ratio of R 3 SiO 1/2 units to SiO 4/2 units of 0.1 to 3.0, wherein R is an unsubstituted or substituted monovalent hydrocarbon group having no aliphatic unsaturated bond.

3. A thermally conductive composite comprising a first thermally conductive adhesive layer, a reinforcing layer (A) layered on one surface of the first thermally conductive adhesive layer, and a second thermally conductive adhesive layer layered on a free surface of the reinforcing layer (A),
wherein the first and second thermally conductive adhesive layers comprise, independently of each other, a silicone composition consisting of the following components (a) to (f) and optional additives selected from the group consisting of surface treatment agents, pigments, dyes, and flame retardants:
100 parts by mass of (a) linear or branched organopolysiloxane,
1,000 to 3,000 parts by mass of (b) thermally conductive filler,
100 to 500 parts by mass of (c) silicone resin,
1 to 10 parts by mass of (d) organohydrogenpolysiloxane,
0.5 to 5 parts by mass of (e) organic peroxide, and
(f) at least one selected from the following components (f-1) and (f-2) in an amount of 1 to 20 parts by mass;
(f-1) alkoxysilane compound represented by the following general formula (1):
R 2 a R 3 b Si(OR 4 ) 4-a-b   (1)

wherein R 2 is, independently of each other, an alkyl group having 6 to 15 carbon atoms, R 3 is, independently of each other, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, R 4 is, independently of each other, an alkyl group having 1 to 6 carbon atoms, “a” is an integer of 1 to 3, and b is an integer of 0 to 2, provided that a total of a and b is an integer of 1 to 3,
(f-2) dimethylpolysiloxane represented by the following general formula (2):

wherein R 5 is, independently of each other, an alkyl group having 1 to 6 carbon atoms and c is an integer of 5 to 100.

4. The thermally conductive composite according to claim 1 , wherein the reinforcing layer (A) is a synthetic resin layer or a glass cloth.

5. The thermally conductive composite according to claim 4 , wherein the synthetic resin is selected from aromatic polyimides, polyamides, polyamide-imides, polyesters and fluorinated polymers.

6. The thermally conductive composite according to claim 1 , having a thickness of 150 to 500 μm.

7. The thermally conductive composite according to claim 1 , wherein the thermally conductive filler (b) is at least one selected from the group consisting of metals, metal oxides and metal nitrides.

8. The thermally conductive composite according to claim 1 , wherein the thermally conductive composite further comprises a substrate surface-treated with a release agent with the treated surface of the substrate being in contact with the free surface of at least one of the first and second thermally conductive adhesive layers.

9. The thermally conductive composite according to claim 8 , wherein the release agent is a fluorine-modified silicone having a fluorine substituent bonding to a main chain of the silicone.

10. A method for preparing the thermally conductive composite according to claim 1 , the method comprises steps of layering the first and second thermally conductive adhesive layers, respectively, on surfaces of the reinforcing layer (A), and bonding each conductive adhesive layer to each surface of the reinforcing layer under pressure at room temperature or under heating and pressure to obtain the thermally conductive composite.

11. The thermally conductive composite according to claim 3 , wherein (c) silicone resin comprises R 3 SiO 1/2 units and SiO 4/2 units with a molar ratio of R 3 SiO 1/2 units to SiO 4/2 units of 0.1 to 3.0, wherein R is an unsubstituted or substituted monovalent hydrocarbon group having no aliphatic unsaturated bond.

12. The thermally conductive composite according to 11 , wherein the reinforcing layer (A) is a synthetic resin layer or a glass cloth.

13. The thermally conductive composite according to claim 2 , wherein the reinforcing layer (A) is a synthetic resin layer or a glass cloth.

14. The thermally conductive composite according to claim 3 , wherein the reinforcing layer (A) is a synthetic resin layer or a glass cloth.

15. The thermally conductive composite according to claim 2 , having a thickness of 150 to 500 μm.

16. The thermally conductive composite according to claim 3 , having a thickness of 150 to 500 μm.

17. The thermally conductive composite according to claim 4 , having a thickness of 150 to 500 μm.

18. The thermally conductive composite according to claim 5 , having a thickness of 150 to 500 μm.

19. The thermally conductive composite according to claim 2 , wherein the thermally conductive filler (b) is at least one selected from the group consisting of metals, metal oxides and metal nitrides.

20. The thermally conductive composite according to claim 3 , wherein the thermally conductive filler (b) is at least one selected from the group consisting of metals, metal oxides and metal nitrides.

Assignees

• Shinetsu Chemical Co

Inventors

• Ito Takanori
• Endo Akihiro

Classifications

• C09J2483/00

  Presence of polysiloxane · CPC title

• C09J2479/086

  in the substrate · CPC title

• C09J183/00

  Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers · CPC title

• C08K5/541

  containing oxygen · CPC title

• C08K5/14

  Peroxides · CPC title