Resin composition

US12404388B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12404388-B2
Application numberUS-202017770503-A
CountryUS
Kind codeB2
Filing dateOct 12, 2020
Priority dateOct 30, 2019
Publication dateSep 2, 2025
Grant dateSep 2, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a curable resin composition, etc., having an excellent transparency, applicability, and workability. Specifically, the present invention relates to a resin composition, etc., including: (A) a polymer having two or more (meth)acryloyl groups in one molecule thereof; (B) a silica powder surface-treated with an alkyl silane; and (C) boric acid or a borate ester.

First claim

Opening claim text (preview).

What is claimed is: 1. A resin composition comprising: (A) a polymer having two or more (meth)acryloyl groups in one molecule thereof; (B) a silica powder surface-treated with an alkyl silane; and (C) boric acid or a borate ester, wherein a mass ratioofthecomponent(B):the component (C) is 9:1 to 1:9, and said two or more (meth)acryloyl groups are represented by —C(═O)—CR=CH 2 , wherein R is hydrogen or a methyl group. 2. The resin composition according to claim 1 , wherein the component (C) is a compound represented by the following general formula (1): B—(OR) 3   (1) wherein R may be the same as or different from one another, and are each hydrogen, or a functional group selected from an alkyl group, an aryl group, a carbonyl group, and an acetyl group each having 1 to 6 carbon atoms which may have a substituent. 3. The resin composition according to claim 1 , wherein the silica powder of the component (B) is a fumed silica powder. 4. The resin composition according to claim 1 , wherein the number of carbon atoms of an alkyl group of the component (B) is 3 to 15. 5. The resin composition according to claim 1 , wherein an alkyl group of the component (B) is an octyl group. 6. The resin composition according to claim 1 , wherein an average particle size of primary particles of the component (B) is 1 to 300 nm. 7. The resin composition according to claim 1 , wherein the mass ratioofthecomponent(B):the component (C) is 8:2 to 2:8. 8. A curable resin composition comprising: the resin composition according to claim 1 ; and a radical polymerization initiator. 9. A cured product obtained by curing the curable resin composition according to claim 8 . 10. An adhesive comprising: the curable resin composition according to claim 8 . 11. A sealant comprising: the curable resin composition according to claim 8 . 12. A method for producing a resin composition comprising: mixing (A) a polymer having two or more (meth)acryloyl groups in one molecule thereof, (B) a silica powder surface-treated with an alkyl silane, and (C) boric acid or a borate ester, wherein a mass ratioofthecomponent(B):the component (C) is 9:1 to 1:9, and said two or more (meth)acryloyl groups are represented by —C(═O)—CR—CH 2 , wherein R is hydrogen or a methyl group. 13. A method for producing a cured product comprising the steps of: producing a resin composition by mixing (A) a polymer having two or more (meth)acryloyl groups in one molecule thereof, (B) a silica powder surface-treated with an alkyl silane, and (C) boric acid or a borate ester, wherein a mass ratioofthecomponent(B):the component (C) is 9:1 to 1:9, and said two or more (meth)acryloyl groups are represented by —C(═O)—CR=CH 2 , wherein R is hydrogen or a methyl group; mixing the resin composition with (D) a radical polymerization initiator; and producing a cured product by curing the resin composition with light or heating. 14. A curable resin composition comprising: the resin composition according to claim 1 ; and a radical polymerization initiator, wherein the resin composition meets at least one of the following conditions: (i) the component (C) is a compound represented by the following general formula (1): B—(OR) 3   (1) wherein R may be the same as or different from one another, and are each hydrogen, or a functional group selected from an alkyl group, an aryl group, a carbonyl group, and an acetyl group each having 1 to 6 carbon atoms which may have a substituent, (ii) the silica powder of the component (B) is a fumed silica powder, (iii) the number of carbon atoms of an alkyl group of the component (B) is 3 to 15, (iv) an alkyl group of the component (B) is an octyl group, or (v) an average particle size of primary particles of the component (B) is 1 to 300 nm. 15. A cured product obtained by curing the curable resin composition according to claim 14 . 16. An adhesive comprising: the curable resin composition according to claim 14 . 17. A sealant comprising: the curable resin composition according to claim 14 . 18. The method according to claim 12 , wherein the mass ratioofthecomponent(B):the component (C) is 8:2 to 2:8. 19. The method according to claim 13 , wherein the mass ratioofthecomponent(B):the component (C) is 8:2 to 2:8. 20. The curable resin composition according to claim 14 , wherein the mass ratioofthecomponent(B):the component (C) is 8:2 to 2:8.

Assignees

Inventors

Classifications

  • Polyacrylic esters or derivatives thereof · CPC title

  • {Materials in mouldable or extrudable form} for sealing or packing joints or covers (filling pastes C09D5/34) · CPC title

  • Homopolymers or copolymers of esters (C09J135/06, C09J135/08 take precedence) · CPC title

  • organic · CPC title

  • inorganic · CPC title

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What does patent US12404388B2 cover?
The present invention relates to a curable resin composition, etc., having an excellent transparency, applicability, and workability. Specifically, the present invention relates to a resin composition, etc., including: (A) a polymer having two or more (meth)acryloyl groups in one molecule thereof; (B) a silica powder surface-treated with an alkyl silane; and (C) boric acid or a borate ester.
Who is the assignee on this patent?
Three Bond Co Ltd
What technology area does this patent fall under?
Primary CPC classification C08K9/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 02 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).