Fiber bundling agent, fiber material, forming material, and formed product

US12404377B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12404377-B2
Application numberUS-202118012642-A
CountryUS
Kind codeB2
Filing dateJun 3, 2021
Priority dateJun 23, 2020
Publication dateSep 2, 2025
Grant dateSep 2, 2025

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

To provide a fiber bundling agent containing: a vinyl ester resin (A) having an alkoxy polyoxyalkylene structure, a urethane bond, a (meth)acryloyl group, and an epoxy group; and an aqueous medium, in which the vinyl ester resin (A) has an epoxy equivalent of 3,500 g/eq to 11,000 g/eq. Since the fiber bundling agent is excellent in bundling properties and in interfacial shear strength between fiber resins, the fiber bundling agent is suitably used for production of a fiber material capable of imparting excellent strength to a molded product.

First claim

Opening claim text (preview).

The invention claimed is: 1. A fiber bundling agent comprising: a vinyl ester resin (A) having an alkoxy polyoxyalkylene structure, a urethane bond, a (meth)acryloyl group, and an epoxy group; and an aqueous medium, wherein the vinyl ester resin (A) has an epoxy equivalent of 3,500 g/eq to 11,000 g/eq. 2. The fiber bundling agent according to claim 1 , wherein the vinyl ester resin (A) has a structure derived from a bisphenol A epoxy resin. 3. The fiber bundling agent according to claim 1 , further comprising: an epoxy resin (B). 4. The fiber bundling agent according to claim 1 , further comprising: a vinyl ester resin (C) other than the vinyl ester resin (A). 5. A fiber material comprising: the fiber bundling agent according to claim 1 . 6. A molding material comprising: the fiber material according to claim 5 ; and; a thermosetting resin. 7. A molded product, which is a cured product of the molding material according to claim 6 .

Assignees

Inventors

Classifications

  • Polyureas, polyurethanes or other polymers having ureide or urethane links; Precondensation products forming them · CPC title

  • Epoxy resins · CPC title

  • of unsaturated carboxylic esters having epoxy groups · CPC title

  • of alkylpolyalkylene glycol esters of unsaturated carboxylic acids · CPC title

  • Polyglycidyl ethers of bis-phenols · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12404377B2 cover?
To provide a fiber bundling agent containing: a vinyl ester resin (A) having an alkoxy polyoxyalkylene structure, a urethane bond, a (meth)acryloyl group, and an epoxy group; and an aqueous medium, in which the vinyl ester resin (A) has an epoxy equivalent of 3,500 g/eq to 11,000 g/eq. Since the fiber bundling agent is excellent in bundling properties and in interfacial shear strength between f…
Who is the assignee on this patent?
Dainippon Ink & Chemicals
What technology area does this patent fall under?
Primary CPC classification C08J5/042. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 02 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).